HFM301~HFM308(SMC)

HFM01
MCC
THRU
ES2A-L
HFM08
.0A
Surface
Mount High Effciency Rectifiers -50V- 1000V
omponents
SM&THRU
PACKAGE
20736 Marilla Street Chatsworth
Micro Commercial Components
TM
!"#
$
% !"#
FEATURES
* Glass passivated device
* Ideal for surface mounted applications
• * Lead
Compliant(Note 1) ("P" Suffix designates
leakage
Free
Finish/RoHS
current
Low
See ordering information)
* RoHS
Metallurgically
Compliant.
bonded
constructionrating
meets
UL
94 V-0 flammability
• Epoxy
• * Moisture Sensitivity Level 1
Pb-Free
is speed
available
x * Super
fastpackage
switching
under 35ns
RoHS product
for packing
"G"
x Marking
: Cathode
bandcode
and suffix
type number
(No '-L' Suffix)
ES2J-L
.280(7.11)
.257(6.52)
Features
Maximum
Ratings
MECHANICAL
DATA
2 Amp Super Fast
Recovery Rectifier
50 to 600 Volts
.128(3.25)
.245(6.22)
.108(2.75)
.220(5.59)
Halohen free product for packing code suffix "H"
• Operating Temperature: -65к to +175к
* Case: Molded plastic, DO-214A% (SM&)
• Storage Temperature: -65к to +175к
* Epoxy: Device has Ulflammability classification 94V-O
* Lead:
method 208C guaranteed
Maximum DC
Maximum
MCCMIL-STD-202E
*Part
Mounting
Any
Maximum
Blocking
Recurrent
Numberposition:
RMS Voltage
Voltage
Peak Reverse
* Weight: 0. gram
( Approximated)
.012(.305)
DO-214AC
(SMA) (LEAD FRAME)
.006(.152)
.103(2.62)
.078(1.98)
H
.059(1.51)
.028(0.75)
Voltage
ES2A-L
50V
35V
50V
ES2B-LMAXIMUM
100V
70V
100V
RATINGS AND ELECTRICAL CHARACTERISTICS
ES2D-L
200V
140V
200V
Ratings at 25℃ ambient temperature unless otherwise specified.
ES2G-L
400V
280V
400V
Single
phase half wave,
60Hz, resistive420V
of inductive load.600V
ES2J-L
600V
For capacitive
load, derate @
current
20% Otherwise Specified
E
Electrical
Characteristics
25°Cby
Unless
.008(.203)
.000(.000)
.320(8.13)
.305(7.75)
J
Dimensions in inches and (millimeters)
A
C
D
B
F
Average Forward
IF(AV)
2.0A
TL= 110к
HFM03 HFM04 HFM05 HFM06 HFM07HFM08
RATINGS
SYMBOL HFM01 HFM02
Current
G
Peak
Forward
IFSM
50A
8.3ms, half sine
H1
H2
H3 DIMENSIONS
H4
H5
H6
+7
H8
Marking
Code Surge
Current
INCHES
MM
Maximum Recurrent Peak Reverse Voltage
50 DIM 100
200
300
400
600
800
1000
VRRM
MIN
MAX
MIN
MAX
NOTE
Maximum
.079
.096
2.00
2.44
Maximum RMS Voltage
35 BA
70
140
210
280
420
560
700
VRMS
.050
.064
1.27
1.63
Instantaneous
.002
.008
.05
.20
MaximumVoltage
DC Blocking Voltage
50 CD 100
200
300
400
600
800
1000
VDC
Forward
--.02
--.51
E
.030
.060
.76
1.52
.95V
ES2A-L-ES2D-L
IFM = 2.0A;TJ=25oC
Maximum
Average ForwardVCurrent
F
F
.065
.091
1.65
IO
.0 2.32
G
.189
.220
4.80
5.59
ES2G-L
1.25V
at TA = 50℃
H
.157
.181
4.00
4.60
1.70V
ES2J-L
J
.090
.115
2.25
2.92
o
Peak Forward Surge Current 8.3 ms single half sine-wave
ES2J-L
.975V(Typ) IFM = 2.0A;TJ=150
IFSM C
0
SUGGESTED
SOLDER
1.25V(Max)
superimposed on rated load (JEDEC
method)
PAD LAYOUT
Maximum DC
0
RΘJA
0.090”
Typical
Thermal
Resistance
(Note
1)
IR
Reverse Current At
TA = 25к
5µA
RΘJC
Rated DC Blocking
1mA
TA = 100к
Typical Junction Capacitance (Note 2)
CJ
Voltage
-55 to +150
Operating Reverse
Temperature Range
TJ
Maximum
Trr
35ns
IF=0.5A, IR=1.0A,
0.085”
Recovery
Time
Irr=0.25A TSTG
-55 to +150
Storage Temperature
Range
Typical Junction
CJ
15pF
Measured at
Capacitance
1.0MHz, VR=4.0V
CHARACTERISTICS
SYMBOL HFM01 HFM02 HFM03 HFM04 HFM05
0.070” HFM06 HFM07 HFM08
Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7.
1.00
1.70
Maximum Forward Voltage at 2.0A DC
1.30
VF
Maximum Full load Reverse Current, Full
50.00
cycle Average TA=55℃
IR
5.0
Maximum DC Reverse Current
@ TA = 25℃
at Rated DC Blocking Voltage
www.mccsemi.com
2013.01
Volts
Volts
Volts
Amps
Amps
℃/W
PF
℃
℃
UNIT
Volts
μAmps
00.0
@ TA = 1℃
Maximum Reverse Recovery Time (Note 3)
Trr
NOTES :1.Thermal Resistance: Mounted on PCB.
of 4.0 volts.
Revision: D 2. Measured at 1 MHz and applied reverse voltage
1 of 3
3.Test Conditions: IF = 0.5A, IR = 1.0A, IRR = 0.25A
UNIT
50
75
nSec
2012/05/25
WILLAS ELECTRONIC CORP.
HFM01
THRU
.0A Surface Mount High Effciency Rectifiers -50V- 1000V
SM& PACKAGE
HFM08
RATING AND CHARACTERISTICS CURVES ( HFM301 THRU HFM308 )
trr
( + )
25 Vdc
(approx)
( - )
3.0
( - )
D.U.T
0
PULSE
GENERATOR
(NOTE 2)
1
NONINDUCTIVE
NOTES:
+0.5A
10
NONINDUCTIVE
-0.25A
( + )
OSCILLOSCOPE
(NOTE 1)
1 Rise Time = 7ns max. Input Impedance =
1 megohm. 22pF.
2. Rise Time = 10ns max. Source Impedance =
50 ohms.
-1.0A
2.5
AVERAGE FORWARD CURRENT, (A)
50
NONINDUCTIVE
1cm
SET TIME BASE FOR 50/100 ns/cm
2.0
1.5
Single Phase
Half Wave 60Hz
Resistive or
Inductive Load
1.0
0.5
FIG .1 TE S T CIR C UIT DIA G R A M A N D R E V E R S E R E C O V E R Y TIM E C H A R A C TE RIS TIC
0
25
50
75
100
125
150
175
O
AMBIENT TEMPERATURE, ( C)
FIG .2 T Y P IC A L F O R W A R D C U R R E N T
D E R A TIN G C U R V E
20
10
100
T A = 125 O C
10
T A = 75 O C
T A = 25 O C
1.0
0.1
0
20
40
60
80
100
120
140
T J = 25 O C
INSTANTANEOUS FORWARD CURRENT, (A)
INSTANTANEOUS REVERSE CURRENT, (A)
1000
3.0
HFM306~HFM308
1.0
HFM304~HFM305
0.3
0.1
HFM301~HFM303
0.03
0.01
Pulse Width=300uS
1% Duty Cycle
0
0.5
PERCENT OF RATED PEAK REVERSE VOLTAGE, (%)
FIG .3 T Y PIC A L R E V E R S E
C H A R A C TE RIS TIC S
50
30
20
10
1
5
10
50
100
NUMBER OF CYCLES AT 60Hz
FIG .5 M A XIM U M N O N -R E P E TITIV E F O R W A R D
SU R G E C U R R EN T
2013.01
200
8.3ms Single Half Sine-Wave
(JEDED Method)
150
125
100
1.5
2.0
2.5
3.0
3.5
FIG .4 T Y P ICA L IN S TA N TA N E O U S F O R W A R D
C H A R A C TE RIS TICS
HFM301~HFM305
T J = 25 O C
100
JUNCTION CAPACITANCE, (pF)
PEAK FORWARD SURGE CURRENT, (A)
200
1.0
INSTANTANEOUS FORWARD VOLTAGE, (V)
60
40
HFM306~HFM308
20
10
6
4
2
1
0 .1 0 .2
0.4
1 .0
2
4
10
20
40
100
REVERSE VOLTAGE, (V)
FIG .6 T Y PIC A L JU N C TIO N C A P A CITA N C E
WILLAS ELECTRONIC CORP.
HFM01
THRU
.0A Surface Mount High Effciency Rectifiers -50V- 1000V
SM& PACKAGE
HFM08
Ordering Information:
Device PN
Part Number -T(1)G(2)-WS
Packing
Tape & Reel Packing :3000pcs/Reel
Note: 1. Packing code, T: Tape & 13” Reel Packing;
2. RoHS product for packing code suffix ”G”, Halogen free product for packing code suffix "H" .
***Disclaimer***
WILLAS reserves the right to make changes without notice to any product
specification herein, to make corrections, modifications, enhancements or other
changes. WILLAS or anyone on its behalf assumes no responsibility or liability
for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" parameters
which may be included on WILLAS data sheets and/ or specifications can
and do vary in different applications and actual performance may vary over time.
WILLAS does not assume any liability arising out of the application or
use of any product or circuit.
WILLAS products are not designed, intended or authorized for use in medical,
life-saving implant or other applications intended for life-sustaining or other related
applications where a failure or malfunction of component or circuitry may directly
or indirectly cause injury or threaten a life without expressed written approval
of WILLAS. Customers using or selling WILLAS components for use in
such applications do so at their own risk and shall agree to fully indemnify WILLAS
Inc and its subsidiaries harmless against all claims, damages and expenditures.
2013.01
WILLAS ELECTRONIC CORP.