Details

2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
Product Features:
ZTT and ZTA Series
Applications:
Low Cost
Compatible with Leadfree Processing
Storage Media
Home Appliance
Microprocessors
Office Automation
5 .5 M a x
1 0 .0 M a x
7 .5 M a x
Frequency
1.8 MHz to 50 MHz
ESR (Equivalent Series Resistance)
See Table Below
5 .0 + /-1 .0
1
2
3
0 .3 M a x .
0 .6 + /-0 .1
2 .5 + /-0 .3
Frequency Tolerance @ 25 C
0.5%
Frequency Stability over Temperature
0.3%
Aging
0.3% Max. for 10 Years
2 .5 + /-0 .3
5 .5 M a x
1 0 .0 M a x
1 0 .0 M a x
Temperature
5 .0 + /-1 .0
Operating
-20 C to +80 C
Storage
-40 C to +85 C Standard
1
3
2
0 .6 + /-0 .1
2 .5 + /-0 .3
1 0 .0 M a x
Part
ZTT-MG
Frequency
ESR
C1
(MHz)
( Max.)
(pF)
1.8 to 4.9
80
30
(pF)
7 .5 M a x
30
ZTT-MT
5 to 12.9
50
22
22
13 to 19.9
40
22
22
15
5 .0 M a x
C2
ZTT-MX
ZTT-MX
0 .3 M a x .
2 .5 + /-0 .3
20 to 25.9
40
ZTT-MX
26 to 50
40
5
5
ZTA-MG
1.8 to 4.9
80
30*
30*
5 .0
0 .6 + /-0 .1
15
ZTA-MT
5 to 12.9
50
22*
22*
ZTA-MX
13 to 19.9
40
22*
22*
ZTA-MX
20 to 25.9
40
15*
15*
ZTA-MX
26 to 50
40
5*
5*
0 .3 M a x .
5 .0
+ /-0 .3
5 .0 M a x
1 0 .0 M a x
1 0 .0 M a x
5 .0
0 .6 + /-0 .1
* Recommended external capacitance, not internal to the device.
The terminations of the ZTA and ZTT series ceramic resonator are Pb free. Pb
may be contained in the ceramic resonator element of this device and is
exempted via item 7 of the RoHS annex. This ceramic resonator series is
considered RoHS compliant.
Part Number Guide
Sample Part Number:
0 .3 M a x .
5 .0
+ /-0 .3
D im e n s io n U n its : m m
ZTT - MX - 20.000
Part Series
ZTT - (internal capacitors)
ZTA -(must supply external capacitance for proper circuit operation)
Package Code
Frequency
MG
MT
MX
- 20.000 MHz
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
11/08/13_D
Specifications subject to change without notice
Page 1
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
Pb Free Solder Reflow Profile:
ZTT and ZTA Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: Frequency, Date code (Packaging Only)
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
11/08/13_D
Specifications subject to change without notice
Page 2
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