Details

2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
Product Features:
ZTACV and ZTTCV Series
Applications:
Low Cost
Compatible with Leadfree Processing
Storage Media
Home Appliance
Microprocessors
Office Automation
ZTACV - MX
1.2
3.7
1
2
3.1
0.7
Frequency
7 MHz to 50 MHz
ESR (Equivalent Series Resistance)
See Table Below
Frequency Tolerance @ 25 C
0.5%
Frequency Stability over Temperature
0.3%
Aging
0.3% Max. for 10 Years
ZTTCV - MX
0.7
1.2
3.7
1.4
1
2
3
0.9
Temperature
3.7
1
Operating
-40 C to +85 C
Storage
-40 C to +85 C Standard
2
3
4.1
1.4
0.9
Connection Diagrams
Part
Frequency
ESR
C1
C2
(MHz)
( Max.)
(pF)
ZTTCV-MX
13 to 19.9
40
30
30
ZTTCV-MX
20 to 25.9
40
15
15
ZTACV
2
1
(pF)
ZTTCV-MX
26 to 50
40
5
5
ZTACV-MX
7 to 12.9
60
30*
30*
ZTACV-MX
13 to 19.9
40
30*
30*
ZTACV-MX
20 to 25.9
40
15*
15*
ZTACV-MX
26 to 50
40
5*
5*
1
ZTTCV
3
2
Dimension Units: mm
* Recommended external capacitance, not internal to the device.
The terminations of the ZTACV and ZTTCV series ceramic resonator are Pb free. Pb may be contained in the ceramic resonator element of this
device and is exempted via item 7 of the RoHS annex. This ceramic resonator series is considered RoHS compliant.
Part Number Guide
Sample Part Number:
Part Series
ZTTCV - MX - 20.000
Package Code
Frequency
MX
- 20.000 MHz
ZTTCV (internal capacitors)
ZTACV (must supply external capacitance for proper circuit
operation)
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
08/16/13_C
Specifications subject to change without notice
Page 1
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
Pb Free Solder Reflow Profile:
ZTACV and ZTTCV Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e1 (Sn / Cu / Ag).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
12 +/-.3
8 +/-.2
5.5 +/-.2
13 +/-1 or 12 +/-3
60 / 80
180 / 250
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
08/16/13_C
Specifications subject to change without notice
Page 2
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