Details

Surface Mount Oscillator, OCXO
FR-4 Package, 25.4 mm X 22.1 mm
I414 Series
I414 Package
Product Features:
Applications:
Available in Both Sinewave and
HCMOS outputs
RoHS Compliant
Telecommunications
Data Communications
Instrumentation
Test and Measurement
22.1
25.4
Frequency
10.000 MHz, 13.000 MHz and 20.000 MHz
Output Level
HC-MOS
Sine
‘0’ = 10% Vcc Max., ‘1’ = 90% VDC typ.
+4dBm, ±3dBm
Duty Cycle (HC-MOS)
50% ±5%
12.0
2.54
3
4
5
2
Rise / Fall Time
10 nS Max. @ Fo <16 Mhz, 5 nS Max. @ Fo >16 Mhz.
6
1
2.54
Output Load
HC-MOS
Sine
15 pf
50 ohms
Frequency Stability
See Frequency Stability Table
Supply Voltage
3.3 V ±5%
Current (Warm Up)
Current @ 25  C
1200 mA Max.
400 mA
Control Voltage
Pullability
1.65VDC ±1.65 VDC ≥
±0.5PPM
Operating
See Operating Temperature Table in Part Number Guide
Storage
-40 C to +85 C
17.78
7.62
7
23.5
17.78
7.62
3.56
3.30
Recommended Land Pattern
Pin Function
1 V control
2 N.C.
3 Vdd
4 Output
5 N.C.
6 N.C
7 GND
Dimension Units: mm
Part Number Guide
Package
Input
Voltage
3 = 3.3V
I414 -
Sample Part Number:
I414-325A4V-20.000 MHz
Operating
Temperature
Symmetry
(Duty Cycle)
Output
Frequency
Stability
(in ppm)
7 = 0 C to +50 C
5 = 45 / 55 Max.
3 = 15pF HC-MOS
Y = 0.5
V = Controled
A = Sine
1 = 0.25
F = Fixed
1 = 0 C to +70 C
6 = -10 C to +75 C
2 = 0.1
3 = -20 C to +70 C
4 = 0.02
Voltage
Control
Frequency
-20.000 MHz
2 = -40 C to +85 C
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Frequency, supply, and load related parameters.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
04/11_B
Specifications subject to change without notice
Page 1
Surface Mount Oscillator, OCXO
FR-4 Package, 25.4 mm X 22.1 mm
I414 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXXXX (Part Number detail = I414-XXXXXX-Freq.)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
04/11_B
Specifications subject to change without notice
Page 2
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