Details

Metal Package Full Size DIP and Half DIP, TTL / HC-MOS
HCOF/HCOH Series
HCOF Package
20.7
Applications:
Product Features:
Low Jitter, Non-PLL Based Output
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
4
3
1
2
12.6
7.62
Frequency
1 MHz to 160.000 MHz
Output Level
HC-MOS
TTL
Duty Cycle
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
Specify 50% ±10% or ±5% See Table in Part Number Guide
Rise / Fall Time
5 nS Max. @ Vcc = +3.3 VDC, 10 nS Max. @ Vcc = +5 VDC ***
Output Load
Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL See Table in Part
Number Guide
See Frequency Stability Table (Includes room temperature tolerance and
stability over operating temperature)
10 mS Max.
15.24
5.1 Max.
6 Min.
0.048
Frequency Stability
Start-up Time
0.36
HCOH Package
12.6
4
3
1
2
12.6
Enable / Disable
Time
Supply Voltage
100 nS Max.
Current
40 mA Max. @ 3.3 VDC, 85 mA Max. @ 5.0 VDC ***
Operating
See Operating Temperature Table in Part Number Guide
Storage
-55 C to +125 C
See Input Voltage Table, tolerance ±5 %
7.62
7.62
5.1 Max.
6 Min.
Jitter:
RMS(1sigma)
1 MHz-75 MHz
76 MHz-160 MHz
Max Integrated
1 MHz-75 MHz
76 MHz-160 MHz
Max Total Jitter
1 MHz-75 MHz
76 MHz-160 MHz
5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods)
3 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods)
0.36
1.5 pS RMS (1 sigma -12KHz to 20MHz)
1 pS RMS (1 sigma -12KHz to 20MHz)
HCOF HCOH -
Dimension Units: mm
Pin
1
2
3
4
50 pS p-p (100K adjacent periods)
30 pS p-p (100K adjacent periods)
Part Number Guide
Package
0.48
Input
Voltage
Sample Part Number:
Operating
Temperature
Symmetry
(Duty Cycle)
5 = 5.0 V
1 = 0 C to +70 C
5 = 45 / 55 Max.
3 = 3.3 V
6 = -10 C to +70 C
6 = 40 / 60 Max.
Connection
Enable / N.C.
GND
Output
Vcc
HCOF - 3153BH - 20.000
Output
Stability
(in ppm)
Enable /
Disable
**E = 10
H = Enable
3 = 15 pF HC-MOS
**D = 15
O = N/C
3 = -20 C to +70 C
6 = 30 pF
**F = 20
4 = -30 C to +75 C
5 = 50 pF HC-MOS (<40 MHz)
A = 25
1 = 10TTL / 15 pF HC-MOS
B = 50
2 = -40 C to +85 C
C = 100
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/10_A
Specifications subject to change without notice
Page 1
Frequency
- 20.000 MHz
Metal Package Full Size DIP and Half DIP, TTL / HC-MOS
Pb Free Solder Reflow Profile:
HCOF/HCOH Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXXXX (Part Number detail = HCOH-XXXXXX-Freq.)
Line 3: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
12/10_A
Specifications subject to change without notice
Page 2
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