AU3PD, AU3PG, AU3PJ Datasheet

AU3PD, AU3PG, AU3PJ
www.vishay.com
Vishay General Semiconductor
Ultrafast Avalanche Surface Mount Rectifiers
FEATURES
eSMP ® Series
• Very low profile - typical height of 1.1 mm
Available
• Ideal for automated placement
K
• Glass passivated pellet chip junction
• Fast reverse recovery time
1
• Controlled avalanche characteristics
• Low leakage current
2
• High forward surge capability
TO-277A (SMPC)
K
Cathode
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
Anode 1
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
Anode 2
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
VRRM
200 V, 400 V, 600 V
IFSM
75 A
trr
75 ns
EAS
20 mJ
VF at IF = 3.0 A
1.13 V
TJ max.
175 °C
Package
TO-277A (SMPC)
Diode variations
Single die

TYPICAL APPLICATIONS
For use in lighting, high frequency rectification and
freewheeling application in switching mode converters and
inverters for consumer, computer, automotive, and
telecommunication.
MECHANICAL DATA
Case: TO-277A (SMPC)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3 - halogen-free, RoHS-compliant and
AEC-Q101 qualified
Base P/NHM3_X - halogen-free, RoHS-compliant and
AEC-Q101 qualified 
(“_X” denotes revision code e.g. A, B,.....)
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test

MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
Maximum repetitive peak reverse voltage
VRRM
Maximum DC forward current (fig. 1)
Peak forward surge current 10 ms single half sine-wave
superimposed on rated load
Non-repetitive avalanche energy at TJ = 25 °C
IAS = 2.5 A max.
IAS = 1.0 A typ.
Operating junction and storage temperature range
AU3PD
AU3PG
AU3PJ
AU3D
AU3G
AU3J
200
400
600
IF (1)
3.0
IF (2)
1.7
IFSM
45
EAS
TJ, TSTG
20
30
-55 to +175
UNIT
V
A
A
mJ
°C
Notes
(1) Mounted on 14 mm x 14 mm pad areas, 1 oz. FR4 PCB
(2) Free air, mounted on recommended pad area
Revision: 19-Feb-15
Document Number: 89338
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AU3PD, AU3PG, AU3PJ
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25 °C
SYMBOL
VF (1)
TYP.
MAX.
1.53
1.9
1.13
1.4
0.41
10
70
250
UNIT
Instantaneous forward voltage
IF = 3.0 A
Reverse current
Rated VR
Maximum reverse recovery time
IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A
trr
66
75
ns
Typical junction capacitance per diode
Rated VR = 4.0 V, 1 MHz
CJ
72
-
pF
AU3PJ
UNIT
TA = 125 °C
TA = 25 °C
TA = 125 °C
IR (2)
V
μA
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width  40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Typical thermal resistance
AU3PD
AU3PG
RJA (1)
85
RJM (2)
5
°C/W
Notes
(1) Free air, mounted on recommended PCB 1 oz. pad are; thermal resistance R
JA - junction to ambient
(2) Units mounted on PCB with 14 mm x 14 mm copper pad areas; R
JM - junction to mount
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
AU3PJ-M3/86A
0.10
86A
1500
7" diameter plastic tape and reel
AU3PJ-M3/87A
0.10
87A
6500
13" diameter plastic tape and reel
AU3PJHM3/86A (1)
0.10
86A
1500
7" diameter plastic tape and reel
AU3PJHM3/86A
(1)
0.10
87A
6500
13" diameter plastic tape and reel
AU3PJHM3_A/H
(1)
0.10
H
1500
7" diameter plastic tape and reel
0.10
I
6500
13" diameter plastic tape and reel
AU3PJHM3_A/I
(1)
Note
(1) AEC-Q101 qualified
Revision: 19-Feb-15
Document Number: 89338
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AU3PD, AU3PG, AU3PJ
www.vishay.com
Vishay General Semiconductor
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1000
TA = 25 °C
TM Measured
at the Cathode Band Terminal
25
50
75
100
TA = 125 °C
10
TA = 75 °C
1
TA = 25 °C
0.1
125
150
175
10
20
30
40
50
60
70
80
90
100
TM - Mount Temperature (°C)
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 4 - Typical Reverse Leakage Characteristics
4.8
D = 0.5
1000
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
D = 0.8
D = 0.3
4.0
D = 0.2
3.2
D = 0.1
D = 1.0
2.4
T
1.6
0.8
D = tp/T
100
tp
0
10
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
0.1
1
10
100
Average Forward Current (A)
Reverse Voltage (V)
Fig. 2 - Average Power Loss Characteristics
Fig. 5 - Typical Junction Capacitance
100
Transient Thermal Impedance (°C/W)
100
Instantaneous Forward Current (A)
TA = 175 °C
100
0.01
0
Average Power Loss (W)
Instantaneous Reverse Current (μA)
TM = 155 °C
Junction Capacitance (pF)
DC Forward Current (A)
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
TA = 175 °C
TA = 125 °C
10
TA = 75 °C
1
TA = 25 °C
0.1
0.2
0.7
1.2
1.7
2.2
2.7
3.2
Junction-to-Ambient
10
1
0.01
0.1
1
10
100
Instantaneous Forward Voltage (V)
t - Pulse Duration (s)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 6 - Typical Transient Thermal Impedance
Revision: 19-Feb-15
Document Number: 89338
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AU3PD, AU3PG, AU3PJ
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
TO-277A (SMPC)
0.187 (4.75)
0.175 (4.45)
0.016 (0.40)
0.006 (0.15)
K
0.262 (6.65)
0.250 (6.35)
0.242 (6.15)
0.238 (6.05)
2
1
0.047 (1.20)
0.039 (1.00)
0.171 (4.35)
0.167 (4.25)
0.146 (3.70)
0.134 (3.40)
Mounting Pad Layout
0.087 (2.20)
0.075 (1.90)
0.189 (4.80)
MIN.
0.189 (4.80)
0.173 (4.40)
0.186 (4.72)
MIN.
0.268
(6.80)
0.155 (3.94)
NOM.
0.030 (0.75) NOM.
0.049 (1.24)
0.037 (0.94)
0.050 (1.27)
MIN.
0.084 (2.13) NOM.
0.053 (1.35)
0.041 (1.05)
0.041
(1.04)
0.055 (1.40)
MIN.
Conform to JEDEC® TO-277A
Revision: 19-Feb-15
Document Number: 89338
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000