Material Content Data Sheet Sales Product Name SAF-XC888-6FFI 5V AC MA# MA000711042 Package PG-LQFP-64-14 Issued 29. August 2013 Weight* 372.98 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 11.934 3.20 0.174 0.05 467 0.755 0.20 2024 3.484 0.93 111.722 29.95 31.13 299535 311367 1.205 0.32 0.32 3230 3230 1.176 0.32 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.20 31997 31997 9341 3154 31.759 8.51 202.316 54.26 63.09 542427 630729 4.066 1.09 1.09 10901 10901 1.690 0.45 0.45 4532 4532 0.675 0.18 2.026 0.54 85148 1811 0.72 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5433 7244 1000000