Material Content Data Sheet Sales Product Name SAF-XC888-8FFI 5V AC MA# MA001127790 Package PG-LQFP-64-14 Issued 29. August 2013 Weight* 373.58 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 11.934 3.19 0.172 0.05 459 0.743 0.20 1990 3.431 0.92 110.016 29.45 30.62 294490 306123 1.205 0.32 0.32 3224 3224 1.188 0.32 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.19 31946 31946 9184 3180 32.076 8.59 204.334 54.69 63.60 546961 636001 4.118 1.10 1.10 11022 11022 1.663 0.45 0.45 4452 4452 0.675 0.18 2.026 0.54 85860 1808 0.72 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5424 7232 1000000