SPO-2012-D-0009

AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL
DMSMS NOTICE
DIMINISHING MANUFACTURING SOURCES AND MATERIAL SHORTAGES
1. TITLE
2. DOCUMENT NUMBER
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS, DUAL 4-INPUT
NAND GATE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
SPO-2012-D-0009
3. DATE (Year, Month, Date)
2012 Apr 11
4. MANUFACTURER NAME AND ADDRESS
5. MANUFACTURER POINT OF CONTACT (NAME)
AEROFLEX COLORADO SPRINGS, INC.
4350 CENTENNIAL BOULEVARD
COLORADO SPRINGS, COLORADO 80907-3486
6. MANUFACTURER POINT OF CONTACT TELEPHONE
MR. TIM MEADE
(719) 594-8048
7. MANUFACTURER POINT OF CONTACT EMAIL
[email protected]
8. CAGE CODE
9. MANUFACTURER FINAL ORDER DATE
10. PRODUCT IDENTIFICATION CODE
65342
SEE COMMENTS BELOW
L020A
UT54ACTS20
13. SMD NUMBER
14. DEVICE TYPE DESIGNATOR
12. BLANK
11. BASE PART
96527
01
15. RHA LEVELS
16. QML LEVEL
NON, R, F, G, AND H
Q AND V
17. NON QML LEVEL
18. BLANK
N/A
ADEPT FORM F##### REV -
RELEASE DATE: 11/11/11
19. COMMENTS
AEROFLEX COLORADO SPRINGS INC. IS ISSUING THIS DIMINISHING MANUFACTURING SOURCES AND MATERIAL
SHORTAGES NOTICE AND PRODUCT CHANGE NOTIFICATION TO ANNOUNCE THE
FOUNDRY MIGRATION OF DEVICE TYPE 01 FROM 1.2UM RADIATION-HARDENED CMOS TO ON-SEMICONDUCTOR’S 0.6UM
C5U COMMERCIAL RADIATION-HARDENED CMOS PROCESS. BECAUSE THE MIGRATED DEVICE IS FORM, FIT, AND
FUNCTIONAL TO THE LEGACY DEVICE, IT WILL CONTINUE TO SHIP AS DEVICE TYPE 01.
AS PART OF THIS PROCESS MIGRATION, THE RADIATION HARDNESS ASSURANCE LEVEL “H” AND CASE OUTLINE “C”
WILL NO LONGER BE AVAILABLE FROM AN APPROVED SOURCE OF SUPPLY. AEROFLEX IS NO LONGER ACCEPTING
PURCHASE ORDERS FOR PRODUCT WITH THE RHA LEVEL “H” OR CASE OUTLINE “C”. ADDITIONALLY, DIE SALES AGAINST
DIE DETAIL “A” ARE NO LONGER AVAILABLE. FUTURE DIE SALES MAY BE ISSUED AGAINST DIE DETAIL “B” OF THE
AFFECTED SMD. NOTE: THE NEW DIE SUPPLIED AGAINST DIE DETAIL “B” REQUIRE A SUBSTRATE BIAS TO VSS.
THE MIGRATED DEVICE OFFERING WILL BE AVAILABLE WITH THE FOLLOWING OPTIONS:
SMD #: 5962-96527 DEVICE TYPE: 01
AVAILABLE RHA DESIGNATORS: R (100Krads (Si)), F (300Krads (Si)), G (500Krads (Si))
DEVICE CLASS: Q, V
CASE OUTLINE DESIGNATOR: X (14 LEAD FLAT PACK)
OR
DIE CODE: 9
LEAD FINISH: A, C, X
OR
DIE DETAIL: B
SHIPMENTS OF THE MIGRATED DEVICE ARE EXPECTED TO BEGIN IN MAY 2012.
Obsolete SMD PINs
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
5962 H 96527
01
01
01
01
01
01
01
01
01
01
V
Q
Q
Q
Q
Q
V
V
V
V
9
9
C
X
C
X
C
X
C
X
Replace SMD PINs
5962 G 96527
5962 G 96527
5962 G 96527
5962 G 96527
5962 G 96527
5962 G 96527
01
01
01
01
01
01
Q
Q
Q
V
V
V
9
X
X
9
X
X
20.
ADEPT REPRESENTATIVE
Timothy L. Meade
ADEPT FORM F##### REV -
A
A
A
A
C
C
A
A
C
C
Vendor Similar PINs
UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20UT54ACTS20-
VDIE
QDIE
PQAH
UQAH
PQCH
UQCH
PVAH
UVAH
PVCH
UVCH
B
A
C
B
A
C
Vendor Similar PINs
UT54ACTS132UT54ACTS132UT54ACTS132UT54ACTS132UT54ACTS132UT54ACTS132-
QDIE
UQAG
UQCG
VDIE
UVAG
UVCG
21.
SIGNATURE
22.
DATE
2012, May, 07
RELEASE DATE: 11/11/11