SPO-2014-D-0007A

AEROFLEX DATA EXCHANGE PROGRAM TRANSMITTAL
DMSMS NOTICE
DIMINISHING MANUFACTURING SOURCES AND MATERIAL SHORTAGES
1. TITLE
2. DOCUMENT NUMBER
MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED,
SYNCHRONOUS 4-BIT UP/DOWN BINARY COUNTER, MONOLITHIC SILICON
FAB MIGRATION
SPO-2014-D-0007A
3. DATE (Year, Month, Date)
2014 February 14
4. MANUFACTURER NAME AND ADDRESS
5. MANUFACTURER POINT OF CONTACT (NAME)
AEROFLEX COLORADO SPRINGS, INC.
4350 CENTENNIAL BOULEVARD
COLORADO SPRINGS, COLORADO 80907-3486
MR. TIM MEADE
6. MANUFACTURER POINT OF CONTACT TELEPHONE
(719) 594-8048
7. MANUFACTURER POINT OF CONTACT EMAIL
[email protected]
8. CAGE CODE
9. MANUFACTURER FINAL ORDER DATE
10. PRODUCT IDENTIFICATION CODE
11. BASE PART
65342
SEE COMMENTS BELOW
C191A
UT54ACS191
13. SMD NUMBER
14. DEVICE TYPE DESIGNATOR
96564
01
15. RHA LEVELS
16. QML LEVEL
NON, R, F, G, AND H
Q AND V
17. NON QML LEVEL
18. BLANK
12. BLANK
N/A
19. COMMENTS
AEROFLEX COLORADO SPRINGS INC. IS ISSUING THIS DIMINISHING MANUFACTURING SOURCES AND MATERIAL
SHORTAGES NOTICE AND PRODUCT CHANGE NOTIFICATION TO ANNOUNCE THE FOUNDRY MIGRATION OF DEVICE TYPE
01 FROM 1.2UM RADIATION-HARDENED CMOS TO ON-SEMICONDUCTOR’S 0.6UM C5U COMMERCIAL RADIATIONHARDENED CMOS PROCESS. BECAUSE THE MIGRATED DEVICE IS FORM, FIT, AND FUNCTIONAL TO THE LEGACY
DEVICE, IT WILL CONTINUE TO SHIP AS DEVICE TYPE 01.
AS PART OF THIS PROCESS MIGRATION, THE RADIATION HARDNESS ASSURANCE LEVEL “H” AND CASE OUTLINE “E” WILL
NO LONGER BE AVAILABLE FROM AN APPROVED SOURCE OF SUPPLY. AEROFLEX WILL ACCEPT ORDERS FOR RHA
LEVEL “H” AND PACKAGE OUTLINE “E” ON A “FIRST COME, FIRST SERVED” BASIS, THROUGH JUNE 2014 OR UNTIL
INVENTORY EXHAUSTS. ADDITIONALLY, DIE SALES AGAINST DIE DETAIL “A” WILL NO LONGER BE AVAILABLE. FUTURE
DIE SALES MAY BE ISSUED AGAINST DIE DETAIL “B” OF THE AFFECTED SMD. NOTE: THE NEW DIE SUPPLIED AGAINST
DIE DETAIL “B” REQUIRE A SUBSTRATE BIAS TO VSS.
THE MIGRATED DEVICE OFFERING WILL BE AVAILABLE WITH THE FOLLOWING OPTIONS:
SMD #: 5962-96564 DEVICE TYPE: 01
AVAILABLE RHA DESIGNATORS: R (100Krads (Si)), F (300Krads (Si)), G (500Krads (Si))
DEVICE CLASS: Q, V
CASE OUTLINE DESIGNATOR: X (16 LEAD FLAT PACK)
OR
DIE CODE: 9
LEAD FINISH: A, C, X
OR
DIE DETAIL: B
SHIPMENTS OF THE MIGRATED DEVICE ARE EXPECTED TO BEGIN IN JUNE 2014.
See Continuation on page 2
20.
ADEPT REPRESENTATIVE
Timothy L. Meade
ADEPT FORM F##### REV -
21.
SIGNATURE
22.
DATE
5 March 2014
RELEASE DATE: 11/11/11
Continuation
Page 2
Obsolete SMD PINs
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
5962 H 96564
Replace SMD PINs
5962 G 96564
5962 G 96564
5962 G 96564
5962 G 96564
5962 G 96564
5962 G 96564
01
01
01
01
01
01
01
01
01
01
01
01
01
01
01
01
V
Q
Q
Q
Q
Q
V
V
V
V
Q
Q
Q
V
V
V
9
9
E
X
E
X
E
X
E
X
9
X
X
9
X
X
ADEPT FORM F##### REV -
A
A
A
A
C
C
A
A
C
C
Vendor Similar PINs
UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191-
VDIE
QDIE
PQAH
UQAH
PQCH
UQCH
PVAH
UVAH
PVCH
UVCH
B
A
C
B
A
C
Vendor Similar PINs
UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191UT54ACS191-
QDIE
UQAG
UQCG
VDIE
UVAG
UVCG
RELEASE DATE: 11/11/11