AD5791-DSCC: Military Data Sheet (Rev. A)

REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Delete figure 5 and all Daisy chain mode
references under footnote 13/ as specified under
table I. Add typical limits to INE, DNE, FSE, ZSE,
AE, ZIN, IDD, ISS, ICC, and IOICC as specified
under table I. - ro
13-10-02
C. SAFFLE
Prepared in accordance with ASME Y14.24
Vendor item drawing
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PMIC N/A
PREPARED BY
RICK OFFICER
Original date of drawing
YY-MM-DD
CHECKED BY
RAJESH PITHADIA
13-04-11
TITLE
MICROCIRCUIT, DIGITAL-LINEAR, 20 BIT,
VOLTAGE OUTPUT DIGITAL TO ANALOG
CONVERTER, MONOLITHIC SILICON
APPROVED BY
CHARLES F. SAFFLE
SIZE
A
REV
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
CODE IDENT. NO.
DWG NO.
V62/12664
16236
A
PAGE
1
OF
20
5962-V087-13
1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance 20 bit, voltage output digital to analog
converter (DAC) microcircuit, with an operating temperature range of -55°C to +125°C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/12664
-
Drawing
number
01
X
B
Device type
(See 1.2.1)
Case outline
(See 1.2.2)
Lead finish
(See 1.2.3)
1.2.1 Device type(s).
Device type
Generic
Circuit function
01
AD5791
20 bit, voltage output digital to analog converter
1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter
Number of pins
X
20
JEDEC PUB 95
Package style
MO-153-AC
Thin shrink small outline
1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer:
Finish designator
A
B
C
D
E
Z
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Material
Hot solder dip
Tin-lead plate
Gold plate
Palladium
Gold flash palladium
Other
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1.3 Absolute maximum ratings.
1/
Positive analog supply voltage (VDD) to analog ground reference (AGND) -0.3 V to +34 V
Negative analog supply (VSS) to AGND ...................................................... -34 V to +0.3 V
VDD to VSS ................................................................................................. -0.3 V to +34 V
Digital supply voltage (VCC) to digital ground reference (DGND) ................ -0.3 V to +7 V
Digital interface supply (IOVCC) to DGND .................................................. -0.3 V to VCC + 3 V or +7 V (whichever is less)
Digital inputs to DGND ................................................................................ -0.3 V to IOVCC + 0.3 V or +7 V (whichever is less)
Analog output voltage (VOUT) to AGND ...................................................... -0.3 V to VDD + 0.3 V
Positive reference force voltage (VREFPF) to AGND .................................. -0.3 V to VDD + 0.3 V
Positive reference sense voltage (VREFPS) to AGND ................................. -0.3 V to VDD + 0.3 V
Negative reference force voltage (VREFNF) to AGND ................................. VSS – 0.3 V to + 0.3 V
Negative reference sense voltage (VREFNS) to AGND ............................... VSS – 0.3 V to +0.3 V
DGND to AGND .......................................................................................... -0.3 V to +0.3 V
Storage temperature range (TSTG) ............................................................. -65°C to +150°C
Maximum junction temperature range (TJ) .................................................. +150°C
Power dissipation (PD) ................................................................................ 174.8 mW 2/
Electrostatic discharge (ESD):
Human body model (HBM) ...................................................................... 1.5 kV
1.4 Recommended operating conditions. 3/
Operating free-air temperature range (TA) .................................................. -55°C to +125°C
1.5 Thermal characteristics.
Thermal resistance, junction to case (θJC) .................................................. 45°C/W
Thermal resistance, junction to ambient (θJA) ............................................. 143°C/W
1/
2/
3/
Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
Power dissipation (PD) = ( TJ max – TA ) / θJA = (150 – 125) / 143 = 0.1748 W.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.
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2. APPLICABLE DOCUMENTS
JEDEC Solid State Technology Association
JEDEC PUB 95
–
Registered and Standard Outlines for Semiconductor Devices
(Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA
22201-3834 or online at http://www.jedec.org)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:
A.
B.
C.
Manufacturer’s name, CAGE code, or logo
Pin 1 identifier
ESDS identification (optional)
3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are
as specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.
3.5.3 Timing waveforms. The timing waveforms shall be as shown in figures 3 and 4.
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TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Static performance 4/
Resolution
Integral nonlinearity
error (relative
accuracy)
INE
VREFP = +10 V, VREFN = -10 V
-55°C to +125°C
01
20
0°C to +105°C
01
-1
-1.5
-55°C to +125°C
-1.5
-55°C to +125°C
-3
-55°C to +125°C
DNE
01
-55°C to +125°C
VREFP = +10 V, VREFN = -10 V
-2.5
-55°C to +125°C
01
+125°C
After 1,000 hours
FSE
+1.5
+2.5
0.16 typical
LSB
0.19 typical
After 1,000 hours
Full scale error
LSB
±1 typical
+25°C
After 500 hours
+1
±0.75 typical
+25°C
Linearity error long 6/
term stability
-1
-1.5
-55°C to +125°C
VREFP = +5 V, VREFN = 0 V
+3
±0.5 typical
+25°C
VREFP = +10 V, VREFN = 0 V
+1.5
±0.25 typical
+25°C
Differential nonlinearity
error
+1.5
±1 typical
+25°C
VREFP = +5 V, VREFN = 0 V 5/
LSB
±0.5 typical
+25°C
VREFP = +10 V, VREFN = 0 V 5/
+1
±0.25 typical
+25°C
VREFP = +10 V, VREFN = -10 V 5/
Bits
0.11 typical
+100°C
VREFP = +10 V, VREFN = -10 V 5/
01
-55°C to +125°C
-11
-55°C to +125°C
LSB
+11
±0.25 typical
+25°C
-21
-55°C to +125°C
VREFP = +5 V, VREFN = 0 V 5/
+7
±0.1 typical
+25°C
VREFP = +10 V, VREFN = 0 V 5/
-7
+21
±0.8 typical
+25°C
See footnotes at end of table.
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TABLE I. Electrical performance characteristics. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Unit
Min
Max
-4
+4
Static performance – continued. 4/
Full scale error
FSE
VREFP = +10 V, VREFN = -10 V 5/
01
0°C to +105°C
±0.1 typical
+25°C
-4
0°C to +105°C
VREFP = +10 V, VREFN = 0 V 5/
-6
0°C to +105°C
Zero scale error
ZSE
VREFP = +10 V, VREFN = -10 V 5/
+25°C
01
±0.02 typical
ppm
FSR/
°C
-55°C to +125°C
01
-7
LSB
-10
-55°C to +125°C
-21
-55°C to +125°C
-4
0°C to +105°C
-4
0°C to +105°C
-6
0°C to +105°C
+6
±0.75 typical
+25°C
Zero scale error 5/
temperature
coefficient
+4
±0.15 typical
+25°C
VREFP = +5 V, VREFN = 0 V 5/
+4
±0.1 typical
+25°C
VREFP = +10 V, VREFN = 0 V 5/
+21
±0.75 typical
+25°C
VREFP = +10 V, VREFN = -10 V 5/
+10
±0.15 typical
+25°C
VREFP = +5 V, VREFN = 0 V 5/
+7
±0.1 typical
+25°C
VREFP = +10 V, VREFN = 0 V 5/
+6
±0.8 typical
+25°C
Full scale error
temperature
coefficient
+4
±0.25 typical
+25°C
VREFP = +5 V, VREFN = 0 V 5/
LSB
01
+25°C
±0.04 typical
ppm
FSR/
°C
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions
Temperature,
TA
Device
type
Limits
Unit
Min
Max
-6
+6
Static performance – continued. 4/
Gain error
AE
VREFP = +10 V, VREFN = -10 V 5/
01
-55°C to +125°C
±0.3 typical
+25°C
-10
-55°C to +125°C
VREFP = +10 V, VREFN = 0 V 5/
-20
-55°C to +125°C
-6
0°C to +105°C
-6
0°C to +105°C
-7
0°C to +105°C
5/
R1, RFB matching
+7
±0.4 typical
+25°C
Gain error
temperature
coefficient
+6
±0.4 typical
+25°C
VREFP = +5 V, VREFN = 0 V 5/
+6
±0.3 typical
+25°C
VREFP = +10 V, VREFN = 0 V 5/
+20
±0.4 typical
+25°C
VREFP = +10 V, VREFN = -10 V 5/
+10
±0.4 typical
+25°C
VREFP = +5 V, VREFN = 0 V 5/
ppm
FSR
+25°C
01
±0.04 typical
ppm
FSR/
°C
+25°C
01
0.01 typical
%
See footnotes at end of table.
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7
TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Output characteristics.
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Unit
Min
Max
VREFN
VREFP
5/
Output voltage range
+25°C
01
Output slew rate
+25°C
01
50 typical
V/µs
+25°C
01
1 typical
µs
Output voltage settling
time
10 V step to 0.02%, using AD845
buffer in unity gain mode
500 code step to ±1 LSB 7/
Output noise spectral
density
V
1 typical
At 1 kHz, DAC code = midscale
01
+25°C
7.5 typical
At 10 kHz, DAC code = midscale
7.5 typical
At 100 kHz, DAC code = midscale
7.5 typical
nV /
Hz
Output voltage noise
DAC code = midscale,
0.1 Hz to 10 Hz bandwidth
8/
+25°C
01
1.1 typical
µVPP
Midscale glitch
impulse
VREFP = +10 V, VREFN = -10 V
+25°C
01
3.1 typical
nVsec
9/
MSB segment
glitch impulse
9/
Output enabled glitch
impulse
VREFP = +10 V, VREFN = 0 V
1.7 typical
VREFP = +5 V, VREFN = 0 V
1.4 typical
01
+25°C
VREFP = +10 V, VREFN = -10 V
9.1 typical
VREFP = +10 V, VREFN = 0 V
3.6 typical
VREFP = +5 V, VREFN = 0 V
1.9 typical
On removal of output ground clamp
nVsec
+25°C
01
45 typical
nVsec
Digital feedthrough
+25°C
01
0.4 typical
nVsec
DC output impedance
(normal mode)
+25°C
01
3.4 typical
kΩ
DC output impedance
(output clamped to
ground)
+25°C
01
6 typical
kΩ
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Output characteristics – continued. 5/
Spurious free dynamic
range
1 kHz tone, 10 kHz sample rate
+25°C
01
100 typical
dB
Total harmonic
distortion
1 kHz tone, 10 kHz sample rate
+25°C
01
97 typical
dB
VREFP input range
-55°C to +125°C
01
5
VDD
– 2.5
V
VREFN input range
-55°C to +125°C
01
VSS
+ 2.5 V
0
V
-55°C to +125°C
01
5
Reference inputs. 5/
DC input impedance
ZIN
VREFP, VREFN, code dependent,
typical mid-scale code
6.6 typical
+25°C
Input capacitance
CIN
VREFP, VREFN
kΩ
+25°C
01
-55°C to +125°C
01
15 typical
pF
Logic inputs. 5/
Input current
10/
IIN
Input low voltage
VIL
IOVCC = 1.71 V to 5.5 V
-55°C to +125°C
01
Input high voltage
VIH
IOVCC = 1.71 V to 5.5 V
-55°C to +125°C
01
+25°C
01
Pin capacitance
-1
+1
µA
0.3 x
IOVCC
V
0.7 x
IOVCC
V
5 typical
pF
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Logic output (SDO) 5/
Output low voltage
VOL
IOVCC = 1.71 V to 5.5 V,
sinking 1 mA
-55°C to +125°C
01
Output high voltage
VOH
IOVCC = 1.71 V to 5.5 V,
sourcing 1 mA
-55°C to +125°C
01
-55°C to +125°C
01
+25°C
01
High impedance
leakage current
High impedance
output capacitance
Power requirements.
0.4
V
V
IOVCC
– 0.5 V
±1
3 typical
µA
pF
All digital inputs at DGND or IOVCC
Positive analog
supply voltage
VDD
-55°C to +125°C
01
7.5
VSS
+ 33
V
Negative analog
supply voltage
VSS
-55°C to +125°C
01
VDD
- 33
-2.5
V
Digital supply voltage
VCC
-55°C to +125°C
01
2.7
5.5
V
Digital interface supply
voltage
IOVCC
-55°C to +125°C
01
1.71
5.5
V
Positive analog
supply current
IDD
-55°C to +125°C
01
5.2
mA
IOVCC ≤ VCC
4.2 typical
+25°C
Negative analog
supply current
01
-55°C to +125°C
ISS
01
-55°C to +125°C
ICC
IOICC
SDO disabled
01
-55°C to +125°C
VDD ± 10%, VSS = 15 V
µA
140
µA
52 typical
+25°C
DC power
5/ 11/
supply rejection ratio
900
600 typical
+25°C
Digital interface supply
current
mA
4 typical
+25°C
Digital supply current
4.9
01
+25°C
±0.6 typical
µV/V
±0.6 typical
VSS ± 10%, VDD = 15 V
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Min
Power requirements - continued.
All digital inputs at DGND or IOVCC
AC power
5/
supply rejection ratio
VDD ± 200 mV, 50 Hz/60 Hz,
01
+25°C
Unit
Max
95 typical
dB
VSS = -15 V
95 typical
∆VSS ± 200 mV, 50 Hz/60 Hz,
VDD = 15 V
Timing requirements.
12/
SCLK cycle time 13/
t1
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t2
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t3
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t4
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t5
SYNC rising edge
hold time
Minimum SYNC high
time
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t7
Data setup time
t8
ns
5
ns
2
ns
48
ns
40
IOVCC = 3.3 V to 5.5 V
SYNC rising edge to
next SCLK falling
edge ignore
9
2
IOVCC = 3.3 V to 5.5 V
t6
ns
5
IOVCC = 3.3 V to 5.5 V
SCLK falling edge to
15
5
IOVCC = 3.3 V to 5.5 V
SYNC to SCLK falling
edge setup time
ns
10
IOVCC = 3.3 V to 5.5 V
SCLK low time
92
60
IOVCC = 3.3 V to 5.5 V
SCLK high time
ns
28
IOVCC = 3.3 V to 5.5 V
SCLK cycle time
(readback) modes
40
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
8
ns
6
IOVCC = 3.3 V to 5.5 V
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
9
ns
7
IOVCC = 3.3 V to 5.5 V
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Timing requirements – continued. 12/
Data hold time
t9
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t10
to SYNC falling edge
SYNC rising edge to
LDAC falling edge
LDAC pulse width low
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
SYNC rising edge to
output response time
t13
t15
01
+25°C
IOVCC = 1.71 V to 3.3 V
t16
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t17
ns
130 typical
ns
130 typical
ns
50
ns
50
01
+25°C
IOVCC = 1.71 V to 3.3 V
140 typical
ns
140 typical
IOVCC = 3.3 V to 5.5 V
SYNC falling edge
to first SCLK rising
edge
14
130 typical
IOVCC = 3.3 V to 5.5 V
CLR pulse activation
time
ns
130 typical
IOVCC = 3.3 V to 5.5 V
( LDAC tied low)
CLR pulse width low
01
+25°C
IOVCC = 1.71 V to 3.3 V
IOVCC = 3.3 V to 5.5 V
t14
20
11
IOVCC = 3.3 V to 5.5 V
LDAC falling edge to
output response time
ns
16
IOVCC = 3.3 V to 5.5 V
t12
13
10
IOVCC = 3.3 V to 5.5 V
t11
ns
7
IOVCC = 3.3 V to 5.5 V
LDAC falling edge
12
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
0
ns
0
IOVCC = 3.3 V to 5.5 V
See footnotes at end of table.
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TABLE I. Electrical performance characteristics – Continued. 1/
Test
Symbol
Conditions 2/ 3/
Temperature,
TA
Device
type
Limits
Min
Unit
Max
Timing requirements – continued. 12/
SYNC rising edge to
SDO tristate
t18
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V,
65
ns
CL = 50 pF
60
IOVCC = 3.3 V to 5.5 V,
CL = 50 pF
SCLK rising edge
to SDO valid
t19
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V,
62
ns
CL = 50 pF
45
IOVCC = 3.3 V to 5.5 V,
CL = 50 pF
SYNC rising edge
to SCLK rising edge
ignore
t20
RESET pulse width
low
t21
01
-55°C to +125°C
IOVCC = 1.71 V to 3.3 V
t22
01
+25°C
IOVCC = 1.71 V to 3.3 V
2/
35 typical
ns
35 typical
01
+25°C
IOVCC = 1.71 V to 3.3 V
150 typical
ns
150 typical
IOVCC = 3.3 V to 5.5 V
1/
ns
0
IOVCC = 3.3 V to 5.5 V
IOVCC = 3.3 V to 5.5 V
RESET pulse
activation time
0
Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over
the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.
Unless otherwise specified, VDD = +12.5 V to +16.5 V, VSS = -16.5 V to -12.5 V, VREFP = +10 V, VREFN = -10 V,
VCC = +2.7 V to +5.5 V, IOVCC = +1.71 V to +5.5 V, RL = unloaded, and CL = unloaded.
3/
4/
5/
6/
7/
8/
9/
10/
11/
12/
13/
Unless otherwise specified, for typical conditions, TA = +25°C, VDD = +15 V, VSS = -15 V, VREFP = +10 V, and VREFN = -10 V.
Performance characterized with AD8676BRZ voltage reference buffers and AD8675ARZ output buffer.
Guaranteed by design and characterization; not production tested.
Linearity error refers to both INL error and DNL error; either parameter can be expected to drift by the amount specified after
the length of time specified.
The device configured in x2 gain mode, 25 pF compensation capacitor on AD797.
Includes noise contribution from AD8676BRZ voltage reference buffers.
The device is configured in the bias compensation mode with a low pass resistor-capacitor (RC) filter on the output.
R = 300 Ω, C = 143 pF (total capacitance seen by the output buffer, lead capacitance).
Current flowing in an individual logic pin.
Includes PSRR of AD8676BRZ voltage reference buffers.
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVCC) and timed from a voltage level of (VIL + VIH) / 2.
Maximum SCLK frequency is 35 MHz for write mode and 16 MHz for readback mode.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
PAGE
13
Case X
FIGURE 1. Case outline.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
PAGE
14
Case X
Dimensions
Inches
Symbol
Millimeters
Min
Med
Max
Min
Med
Max
A
---
---
.047
---
---
1.20
A1
.001
---
.005
0.05
---
0.15
b
.007
---
.011
0.19
---
0.30
c
.003
---
.007
0.09
---
0.20
D
.251
0.255
.259
6.40
6.50
6.60
E
.169
0.173
.177
4.30
4.40
4.50
E1
.251 BSC
6.40 BSC
e
.025 BSC
0.65 BSC
L
.017
.023
.029
0.45
0.60
0.75
NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. Falls within reference to JEDEC MO-153-AC.
FIGURE 1. Case outline - Continued.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
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15
Device type
01
Case outline
X
Terminal number
Terminal
symbol
1
INV
2
VOUT
3
VREFPS
Description
Connection to inverting input of external amplifier.
Analog output voltage.
Positive reference sense voltage input. A voltage range of 5 V to
VDD – 2.5 V can be connected. A unity gain amplifier must be
connected at this pin, in conjunction with the VREFPF pin.
4
VREFPF
Positive reference force voltage input. A voltage range of 5 V to
VDD – 2.5 V can be connected. A unity gain amplifier must be
connected at this pin, in conjunction with the VREFPS pin.
5
VDD
Positive analog supply connection. A voltage range of 7.5 V to
16.5 V can be connected. VDD should be decoupled to AGND.
6
RESET
Active low reset logic input pin. Asserting this pin returns the device
to its power on status.
7
CLR
Active low clear logic input pin. Asserting this pin sets the DAC
register to a user defined value and updates the DAC output. The
output value depends on the DAC register coding that is being used,
either binary or twos complement.
8
LDAC
Active low load DAC input pin. This is used to update the DAC
register and, consequently, the analog output. When tied
permanently low, the output is updated on the rising edge of SYNC .
If LDAC is held high during the write cycle, the input register is
updated, but the output is held off until the falling edge of LDAC .
The LDAC pin should not be left unconnected.
9
VCC
10
IOVCC
Digital supply connection. A voltage in the range of 2.7 V to 5.5 V
can be connected. VCC should be decoupled to DGND.
Digital interface supply pin. Digital threshold levels are referenced to
the voltage applied to this pin. A voltage range of 1.71 V to 5.5 V
can be connected. IOVCC should not be allowed to exceed VCC.
FIGURE 2. Terminal connections.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
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V62/12664
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Device type
01
Case outline
X
Terminal number
Terminal
symbol
Description
11
SDO
Serial data output pin. Data is clocked out on the rising edge of the
serial clock input.
12
SDIN
Serial data input pin. This device has a 24 bit shift register. Data is
clocked into the register on the falling edge of the serial clock input.
13
SCLK
Serial clock input. Data is clocked into the input shift register on the
falling edge of the serial clock input. Data can be transferred at clock
rates of up to 35 MHz.
14
SYNC
Active low digital interface synchronization input pin. This is the
frame synchronization signal for the input data. When SYNC is low,
it enables the input shift register, and data is then transferred in on
the falling edges of the following clocks. The input shift register is
updated on the rising edge of SYNC .
15
DGND
Ground reference pin for digital circuitry.
16
VREFNF
Negative reference force voltage input. A voltage range of VSS +
2.5 V to 0 V can be connected. A unity gain amplifier must be
connected at this pin, in conjunction with the VREFNS pin.
17
VREFNS
Negative reference sense voltage input. A voltage range of VSS +
2.5 V to 0 V can be connected. A unity gain amplifier must be
connected at this pin, in conjunction with the VREFNF pin.
18
VSS
Negative analog supply connection. A voltage range of -16.5 V to
-2.5 V can be connected. VSS should be decoupled to AGND.
19
AGND
20
RFB
Ground reference pin for analog circuitry.
Feedback connection for external amplifier.
FIGURE 2. Terminal connections - continued.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
PAGE
17
FIGURE 3. Write mode timing diagram.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
PAGE
18
FIGURE 4. Readback mode timing diagram.
DLA LAND AND MARITIME
COLUMBUS, OHIO
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
PAGE
19
4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,
classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee
of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Vendor item drawing
administrative control
number 1/
Device
manufacturer
CAGE code
Vendor part number
V62/12664-01XB
24355
AD5791SRU-EP
1/ The vendor item drawing establishes an administrative control number
for identifying the item on the engineering documentation.
CAGE code
24355
DLA LAND AND MARITIME
COLUMBUS, OHIO
Source of supply
Analog Devices
Route 1 Industrial Park
P.O. Box 9106
Norwood, MA 02062
Point of contact: Raheen Business Park
Limerick, Ireland
SIZE
A
CODE IDENT NO.
16236
REV
A
DWG NO.
V62/12664
PAGE
20