STK57FU394AGEVB STK57FU394A-E Evaluation Board User'sManual Introduction www.onsemi.com By using this board, STK57FU394A−E (SIP2A) can be evaluated. ONPN of EVAL Board ONPN of IPM Io STK57FU394AGEVB STK57FU394A−E 15A EVAL BOARD USER’S MANUAL Bridge Diode IPM Top View Bottom View Figure 1. Evaluation Board Photos © Semiconductor Components Industries, LLC, 2015 October, 2015 − Rev. 0 1 Publication Order Number: EVBUM2326/D STK57FU394AGEVB CIRCUIT DIAGRAM ACIN1 IPM VDD C11 VSS + C10 34. VDD 220uF C13 C20 C19 C18 C17 C16 C15 C14 R23 R22 R21 R20 R19 R18 R24 R10 6.8kΩ C12 5. W TH 33. TH ITRIP 32. ITRIP PFCTRIP 31. PFCTRIP FLTEN Connector ACIN2 4. VB3 C7 C4 R9 30. FLTEN R7 2kΩ R11 PFCIN R17 HIN1 R16 HIN2 R15 HIN3 R14 LIN1 R13 LIN2 R12 LIN3 Bridge diode 35. VSS 20kΩ 3.3kΩ + 0.1uF VEXT 100pF 1. PFC PFC 8. VB2 + W 22uF 0.1uF C8 C5 + V 9. V 12. VB1 C9 C6 + U 13. U R8 200Ω 29. PFCIN 23. HIN1 24. HIN2 P 16. VCC 19. -VCC C3 C1 + C2 N 470uF 470uF 20. WN 27. LIN2 21. VN 28. LIN3 22. UN R1 R2 R3 Test pin Faston terminal (Tab) Figure 2. Circuit Diagram www.onsemi.com 2 R6 Shunt R (PFC) 26. LIN1 U− R4 R5 2.2uF 25. HIN3 100Ω + Shunt R (INV) STK57FU394AGEVB PIN DESCRIPTION * IC1, DB1, R11−24, C14−20 are arranged on backside. DB 1 IC 1 R4 C4 C5 C6 C7 C8 C9 R5 R6 − R7 C10 PFC C11 CN 1 VDD VSS W R8 + V ITRIP ACIN1 R1 U R2 R3 R9 VEXT U− C13 TH C12 PFCTRIP FLTEN LIN3 LIN1 ACIN2 HIN2 P HIN1 C3 HIN3 LIN2 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 C14 C15 C16 C17 C18 C19 C20 N C1 PFCIN R10 C2 Transparent view from top side U, V, W : 3 phase inverter output R1−6 : Shunt resistor, 3 parallel connection VDD : Control power supply (DC 15 V) R8 (, C12) : RC filter for ITRIP VSS : Signal GND R7 (, C13) : RC filter for PFCTRIP PFC : Rectified AC Voltage input R9 : Pull−up to VEXT (TH) HINx, LINx, PFCIN : Control signal input R10 : Pull−up to VEXT (FLTEN) ITRIP : Over current protection for Inverter R11−17, C14−20 : Low pass filter for signal input PFCTRIP : Over current protection for PFC Prevention malfunction by noise C4 −6 : Boot strap capacitor VEXT : FLTEN, TH pull−up R18−24 : Pull −down to VSS for signal input Impre ss DC5V FLTEN : Enable input and Fault output Prevention malfunction by external wiring TH : Internal termistor IC1 : IPM ACIN1, ACIN2 : Bridge diode AC voltage input DB1 : Bridge diode +, − : Bridge diode output Figure 3. Pin Description www.onsemi.com 3 STK57FU394AGEVB OPERATION PROCEDURE DB 1 IC 1 R4 C4 C5 C6 C7 C8 C9 R5 R6 − R7 C10 PFC C11 VSS W Inductor ITRIP ACIN1 R1 U R2 R3 R9 VEXT U− R8 + V AC power supply CN 1 VDD C13 TH C12 PFCTRIP FLTEN LIN3 LIN1 ACIN2 HIN2 P HIN1 C3 HIN3 LIN2 R11 R12 R13 R14 R15 R16 R17 DC 15 V Logic R18 R19 R20 R21 R22 R23 R24 C14 C15 C16 C17 C18 C19 N C20 C1 PFCIN R10 C2 Motor Figure 4. Connection Example Step 4. By inputting signal to the logic part, IPM control is started. (Therefore, please set electric charge to the boot-strap capacitor of high side to turn on low side IGBT before running.) Step 1. Please connect IPM, each power supply, logic parts, inductor and the motor to the evaluation board, and confirm that each power supply is OFF at this time. Step 2. Please impress DC 15 V to VDD and DC 5 V to VEXT. Step 3. Please perform a voltage setup according to specifications, and impress AC power supply between ACIN1 and ACIN2. NOTE: When turning off the power supply part and the logic part, please carry out in the reverse order to above steps. www.onsemi.com 4 STK57FU394AGEVB LAYOUT (TOP VIEW) Figure 5. Layout − Top Side Figure 6. Layout − Back Side Length: 121 mm Side: 200 mm Thickness: 1.6 mm Rigid double−sided substrate (Material: FR−4) Both sides resist coating Copper foil thickness: 70 m www.onsemi.com 5 STK57FU394AGEVB BILL OF MATERIALS Table 1. BILL OF MATERIALS Substitution Allowed Designator Qty Description Value Manufacturer Manufacturer Part Number R1, R2 2 Metal plate resistor 50 m / 5W ±10% KOA BPR58C50LK Yes R4, R5 2 Metal plate resistor 20 m / 5W ±10% KOA BPR58C20LK Yes R7 1 2 k / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD2001F Yes R8 1 200 / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD2000F Yes R9 1 20 k / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD2002F Yes R10 1 6.8 k / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD6801F Yes R11 − R17 7 100 / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD1000F Yes R18 − R24 7 3.3 k / 0.1 W ±1% SMD 1608 KOA RK73H1JTTD3301F Yes C1, C2 2 Aluminum electrolytic capacitor 470 F / 450 V ±20% Through− hole Rubycon 450MXC470MEFCSN35X50 Yes C3 1 Film capacitor 2.2 F / 630 V ±5% Through− hole PANASONIC ECQE6225JT Yes C4 − C6 3 47 F / 50 V ±20% Through− hole Nippon Chemi−Con EKMG500ELL470MF11D Yes C7 − C10 4 0.1 F / 50 V ±10% SMD 1608 MURATA GRM188B31H104K Yes C11 1 220 F / 35 V ±20% Through− hole Nippon Chemi−Con EKMG350ELL221MHB5D Yes C12, C13 2 C14 − C20 7 DB1 1 Bridge diode CN1 1 Connector VSS, VDD, VEXT, U−, TH, ITRIP, PFCTRIP, FLTEN, PFCIN, HIN1−3, LIN1−3, P, N 17 U, V, W, +, PFC, ACIN1, ACIN2 IC1 Aluminum electrolytic capacitor Tolerance optional 100 pF / 50 V Footprint SMD 1608 Yes SMD 1608 MURATA GRM1882C1H101J Yes 25 A / 800 V Through− hole Shindengen D25XB80 Yes 18 pin / 2.54 pitch Through− hole Hirose A2−18PA−2.54DSA(71) Yes Test Pin Through− hole Mac8 ST−1−3 Yes 7 Faston terminal (Tab) Through− hole 1 3 Phase Inverter IPM Through− hole ±5% NOTE All components are lead free. www.onsemi.com 6 Yes ON Semiconductor STK57FU394A−E No STK57FU394AGEVB HEAT SINK MOUNTING Table 2. MOUNTING CONDITION Item Recommended Condition Pitch 56.0 ± 0.1 mm (Please refer to Package Outline Diagram) Screw Diameter: M3 Bind machine screw, Truss machine screw, Pan machine screw Washer Heat Sink Plane washer The size is D = 7 mm, d = 3.2 mm and t = 0.5 mm (Figure 8) JIS B 1256 Material: Copper or Aluminum Warpage (the surface that contacts IPM): −50 ∼ 100 m Screw holes must be countersunk. No contamination on the heat sink surface that contacts IPM. Torque Final tightening: 0.6 ∼ 0.9 Nm Temporary tightening: 20 ∼ 30% of final tightening Grease Silicone grease Thickness: 100 ∼ 200 m Uniformly apply silicone grease to whole back. (Figure 9) Figure 7. Mounting Composition t D d Figure 8. Size of Washer Procedure for the Heat Sink Mounting 1st step: Tighten the screws until the torque of temporary tightening while maintaining the balance of left (1) and right (2). nd 2 step: Tighten them until the torque of final tightening. Figure 9. Grease Application ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EVBUM2326/D