STK581U3C2DGEVB STK581U3C2D-E Evaluation Board User'sManual Introduction www.onsemi.com By using this board, STK581U3C2D−E (SIP3 / 1 shunt) can be evaluated. EVAL BOARD USER’S MANUAL Surface Back side Figure 1. Evaluation Board Photos Table 1. ONPN of Evaluation Board ONPN of IPM Io STK581U3C2DGEVB STK581U3C2D−E 30 A © Semiconductor Components Industries, LLC, 2014 November, 2014 − Rev. 0 1 Publication Order Number: EVBUM2286/D STK581U3C2DGEVB CIRCUIT DIAGRAM Figure 2. Circuit Diagram www.onsemi.com 2 Figure 3. Description of Each Pin www.onsemi.com 3 - Pull-down resistor 3.3kΩ for signal input terminal (HIN1-3, LIN1-3) Prevention of malfunction by influence of the external wiring - Low pass filter for signal input terminal (HIN1-3, LIN1-3) Low pass filter is composed of resistor of 100W, and capacitor of 100pF. Connector For the connection to the control part Test pins For monitoring each control signals Pull-up resistor 20kΩ to VEXT for FAULT Please impress arbitrary voltage to VEXT terminal. +, - terminal Please connect to DC power supply. U,V,W terminal Please connect to the motor. * All chip components are arranged backside. These are holes to pass the screws when the heat sink is installed on IPM. STK581U3C2DGEVB PIN DESCRIPTION STK581U3C2DGEVB OPERATION PROCEDURE Figure 4. Step 1: Please connect IPM, each power supply, logic parts, and the motor to the evaluation board, and confirm that each power supply is OFF at this time. Step 2: Please impress the power supply of DC 15 V. Step 3: Please perform a voltage setup according to specifications, and impress the power supply between the “+” and the “−” terminal. Step 4: By inputting signal to the logic part, IPM control is started. (Therefore, please set electric charge to the boot-strap capacitor of upper side to turn on lower side IGBT before running.) NOTE: When turning off the power supply part and the logic part, please carry out in the reverse order to above steps. www.onsemi.com 4 STK581U3C2DGEVB LAYOUT Length: 116 mm Side: 145 mm Thickness: 1.6 mm Rigid double−sided substrate (Material: FR−4) Both sides resist coating Copper foil thickness: 70 mm Figure 5. Layout (Top View) − Surface Figure 6. Layout (Top View) − Back Side www.onsemi.com 5 STK581U3C2DGEVB BILL OF MATERIALS Table 2. EVALUATION BOARD BILL OF MATERIALS Components Symbol SMD Manufacturer Part Number Specification Resistor R1 1 KOA RK73H1JTTD2002F 20 kW/ 0.1 W / ±1% Chip (1608 size) Fault pull−up R2 − R7 6 KOA RK73H1JTTD1000F 100 W / 0.1 W / ±1% Chip (1608 size) Signal input low pass filter R8 − R13 6 KOA RK73H1JTTD3301F 3.3 kW / 0.1 W / ±1% Chip (1608 size) Signal input pull−down Capacitor DIP C1, C2 2 Nippon Chemi−Con EKMM451VSN471MA50S 470 mF / 450 V / ±20% Aluminum electrolytic capacitor Plus−Minus C3 1 PANASONIC ECQE6225JT 2.2 mF / 630 V / ±5% Film capacitor Plus−Minus, Snubber C4−C6 3 Nippon Chemi−Con EKMG350ELL470ME11D 47 mF / 35 V / ±20% Aluminum electrolytic capacitor VBx − VSx C7 1 Nippon Chemi−Con EKMG350ELL221MHB5D 220 mF / 35 V / ±20% Aluminum electrolytic capacitor VDD−VSS C8 − C11 4 MURATA GRM188B31H104K 0.1 mF / 50 V / ±10% Chip (1608 size) VBx − Vsx, VDD−VSS C12 − C17 6 MURATA GRM1882C1H101J 100 pF / 50 V / ±5% Chip (1608 size) Signal input low pass filter 14 pin / 2.54 pitch Connector CN1 1 HIROSE ELECTRIC A2−14PA−2.54DSA(71) Pin (S) VSS, VDD, VEXT, ISO, FAULT, HIN1−3, LIN1−3, V+, V− 13 Mac8 ST−1−3 Pin (L) U, V, W, +, − 5 IC Supplement IC1 Total 1 23 Faston terminal (Tab) ON Semiconductor STK581U3C2D−E 27 www.onsemi.com 6 SIP3 / 1shunt STK581U3C2DGEVB Heat Sink Mounting NOTE: When mounting the heat sink on IPM, first, tighten the screws roughly by temporary maintaining the balance of left and right. Next, tighten both screws gradually alternately until the end. Table 3. Item Recommended Condition Pitch 70.0 ± 0.1 mm (Please refer to Package Outline Diagram) Screw Diameter: M4 Bind machine screw, Truss machine screw, Pan machine screw Washer Heat Sink Figure 7. Mount HIC on a Heat Sink t Plane washer The size is D = 9 mm, d = 4.2 mm and t = 0.8 mm (Figure 8) JIS B 1256 Material: copper or Aluminum Warpage (the surface that contacts IPM): −50 ∼ 100 mm Screw holes must be countersunk. No contamination on the heat sink surface that contacts IPM. Torque Final tightening: 0.79 ∼ 1.17 Nm Temporary tightening: 20 ∼ 30% of final tightening Grease Silicon grease Thickness: 100 ∼ 200 mm Uniformly apply silicon grease to whole back. (Figure 9) D d Figure 8. Size of Washer Figure 9. About Uniformly Application ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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