TLE6251DS Data Sheet (566 KB, EN)

Data Sheet, Rev. 3.1, Aug. 2007
TLE6251DS
High Speed CAN-Transceiver with Bus wake-up
Automotive Power
Edition 2007-08-20
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2005 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
High Speed CAN-Transceiver with Bus wake-up
TLE6251DS
Features
•
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CAN data transmission rate up to 1 Mbaud
Compatible to ISO/DIS 11898
Supports 12 V and 24 V automotive applications
Low power mode with remote wake-up via CAN bus
Wake signaling by RxD change
No BUS load in stand-by mode
Wide common mode range for electromagnetic immunity
(EMI)
Digital inputs compatible to 3.3 and 5 V logic devices
CAN short circuit proof to ground, battery and VCC
Split termination to stabilize the recessive level
TxD time-out function
Overtemperature protection
Protected against automotive transients
Green Product (RoHS compliant)
AEC Qualified
Description
The CAN-transceiver TLE6251DS is a monolithic integrated circuit in a PG-DSO-8 package for
high speed differential mode data transmission (up to 1 Mbaud) and reception in automotive and
industrial applications. It works as an interface between the CAN protocol controller and the
physical bus lines compatible to ISO/DIS 11898.
As a successor to the first generation of HS CAN (TLE6250), the TLE6251DS is designed to
provide an excellent passive behavior when the transceiver is switched off (mixed networks,
terminal 15/30 applications) and a remote wake-up capability via CAN bus in low power mode.
This supports networks with partially un-powered nodes.
The TLE6251DS has two operation modes, the normal and the stand-by mode. These modes can
be chosen by the STB pin. If the TLE6251DS is in stand-by mode and a message on the bus is
Type
Package
TLE6251DS
PG-DSO-8
Data Sheet
3
Rev. 3.1, 2007-08-20
TLE6251DS
detected, the TLE6251DS changes the level at the RxD pin corresponding to the bus signal
(wake-up flag).
The TLE6251DS is also designed to withstand the severe conditions of automotive applications
and to support 12 V and 24 V applications.
The IC is based on the Smart Power Technology SPT® which allows bipolar and CMOS control
circuitry in accordance with DMOS power devices existing on the same monolithic circuit.
Pin Configuration and Definitions
T L E6251 D S
T xD
1
8
ST B
GN D
2
7
C AN H
VCC
3
6
C AN L
R xD
4
5
SPLIT
AEP03389.VSD
Figure 1
Pin Configuration (top view)
Table 1
Pin Definitions and Functions
Pin No.
Symbol
Function
1
TxD
CAN transmit data input; 20 kΩ pull-up, LOW in dominant state
2
GND
Ground
3
VCC
5 V supply input; block to GND with 100 nF ceramic capacitor
4
RxD
CAN receive data output; LOW in dominant state
5
SPLIT
Split termination output; to support the recessive voltage level of the
bus lines
6
CANL
Low line input; LOW in dominant state
7
CANH
High line output; HIGH in dominant state
8
STB
Mode control input; internal pull-up, see Figure 3
Data Sheet
4
Rev. 3.1, 2007-08-20
TLE6251DS
Functional Block Diagram
TLE6251DS
VCC
3
Wake-Up
Logic
8
Mode Control
Logic
STB
VCC
CANH
CANL
7
6
Driver
Output
Stage
Temp.Protection
1
+
timeout
TxD
=
Receiver
MUX
SPLIT
GND
4
RxD
5
2
AEB03388.VSD
Figure 2
Data Sheet
Functional Block Diagram
5
Rev. 3.1, 2007-08-20
TLE6251DS
Application Information
The TLE6251DS has two operation modes, the normal and the standby mode. These modes can
be controlled with the STB pin (see Figure 3, Table 2). The STB pin has an implemented pullup, so if there is no signal applied to STB or STB = HIGH, the standby mode is activated. To
transfer the TLE6251DS into the normal mode, STB has to be switched to LOW.
Normal
STB = 0
Stand-By
STB = 1
AEA03391.VSD
Figure 3
Mode State Diagram
Table 2
Truth Table
Mode
STB
Normal
low
Stand by
1)
high
Event
RxD
BUS
Termination
VCC/2
bus dominant
low
bus recessive
high
wake-up via CAN bus detected
low/high1)
no wake-up detected
high
GND
Signal at RxD changes corresponding to the bus signal during stand by mode. See Figure 6
Normal Mode
This mode is designed for the normal data transmission/reception within the HS-CAN network.
Data Sheet
6
Rev. 3.1, 2007-08-20
TLE6251DS
Transmission
The signal from the µC is applied to the TxD input of the TLE6251DS. Now the bus driver
switches the CANH/L output stages to transfer this input signal to the CAN bus lines.
TxD Time-out Feature
If the TxD signal is dominant for a time t > tTxD the TxD time-out function deactivates the
transmission of the signal at the bus. This is realized to prevent the bus from being blocked
permanently dominant due to an error.
The transmission is released again, after a rising edge at TxD has been detected.
Reduced Electromagnetic Emission
The bus driver has an implemented control to reduce the electromagnetic emission (EME). This
is achieved by controlling the symmetry of the slope, resp. of CANH and CANL.
Overtemperature
The driver stages are protected against overtemperature. Exceeding the shutdown temperature
results in deactivation of the driving stages at CANH/L. To avoid a bit failure after cooling down,
the signals can be transmitted again only after a dominant to recessive edge at TxD.
Figure 4 shows the way how the transmission stage is deactivated and activated again. First an
over temperature condition causes the transmission stage to deactivate. After the over
temperature condition is no longer present, the transmission is only possible after the TxD signal
has changed to recessive level.
Data Sheet
7
Rev. 3.1, 2007-08-20
TLE6251DS
Failure
Overtemp
VCC
Overtemperature
GND
t
TxD
VCC
GND
t
BUS VDIFF
(CANH-CANL)
R
D
R
t
AET03394.VSD
Figure 4
Release of the Transmission after Overtemperature
Reception
The analog CAN bus signals are converted into a digital signal at RxD via the differential input
receiver. The RxD signal is switched to RxD output pin via the multiplexer (MUX), see Figure 2.
In normal mode the split pin is used to stabilize the recessive common mode signal.
Standby Mode
The standby mode is designed to switch the TLE6251DS into a low power mode with minimum
current consumption. The driving stages and the receiver are deactivated. Only the relevant
circuitry to guarantee a correct handling of the CAN bus wake-up is still active. This wake-up
receiver is also designed to show an excellent immunity against electromagnetic noise (EMI).
Change into Standby Mode during CAN Bus Failure
It is possible to change from normal mode into the standby mode if the bus is dominant due to a
bus failure without setting the RxD wake flag to LOW. The advantage is, that the TLE6251DS
can be kept in the standby mode even if a bus failure occurs.
Figure 5 shows this mechanism in detail. During a bus network failure, the bus might be
dominant. Normal communication is not possible until the failure is removed. To reduce the
current consumption, it makes sense to switch over to standby mode. This is possible with the
Data Sheet
8
Rev. 3.1, 2007-08-20
TLE6251DS
TLE6251DS. If the dominant signal switches back to recessive level, e.g. failure removed, a
wake-up via CAN bus (recessive to dominant signal detected) is possible.
BUS VDIFF
(CANH-CANL)
VCC
D
R
D
t
STB
(Mode)
VCC
Normal Mode
(STB = LOW)
Standby Mode (STB = HIGH)
RxD
tWU1
tWU2
t
VCC
t
AET03393.VSD
Figure 5
Go-To Standby Mode during Bus Dominant Condition
Wake-up via CAN Message
During standby mode, a dominant CAN message on the bus longer than the filtering time t > tWU1,
leads to the activation of the wake-up. The wake-up during standby mode is signaled with the
RxD output pin. A dominant signal longer t > tWU1 on the CAN bus switches the RxD level to
LOW, with a following recessive signal on the CAN bus longer t > tWU2 the RxD level is switched
to high, see Figure 6.
The µC is able to detect this change at RxD and switch the transceiver into the normal mode.
Data Sheet
9
Rev. 3.1, 2007-08-20
TLE6251DS
VCAN
CANH
VCC
VCC/2
CANL
t
BUS VDIFF
(CANH-CANL)
Recessive to
Dominant
VDIFF(d)
VDIFF(d)
VRxD
tWU2
tWU1
VCC
VDIFF(d)
VDIFF(d)
t
0.8 x VCC
0.2 x VCC
GND
t
AET03395_TO1.VSD
Figure 6
Wake-up behavior
Split Circuit
The split circuitry is activated during normal mode and deactivated (SPLIT pin floating) during
standby mode. The SPLIT pin is used to stabilize the recessive common mode signal in normal
mode. This is realized with a stabilized voltage of 0.5 VCC at SPLIT.
A correct application of the SPLIT pin is shown in Figure 7. The split termination for the left and
right node is realized with two 60 Ω resistances and one 10 nF capacitor. The center node in this
example is a stub node and the recommended value for the split resistances is 1.5 kΩ.
Data Sheet
10
Rev. 3.1, 2007-08-20
TLE6251DS
C AN H
C AN H
T LE6251 G/D S
60 Ω
Split
Term ination
SPLIT
10
nF
T LE6251 G/D S
60 Ω
C AN
Bus
Split
T erm ination
60 Ω
60 Ω
SPLIT
10
nF
C AN L
C AN L
10
nF
Split
Term ination
at Stub
1.5 kΩ
C AN H
1.5 kΩ
SPLIT
C AN L
TL E6251 G/D S
AEA 03390.VSD
Figure 7
Application of the SPLIT Pin for Normal Nodes and one Stub Node
Other Features
Fail Safe
If the device is supplied but there is no signal at the digital inputs, the TxD and STB have an
internal pull-up path, to prevent the transceiver to switch into the normal mode or send a dominant
signal on the bus.
Un-supplied Node
The CANH/CANL pins remain high ohmic, if the transceiver is un-supplied.
Data Sheet
11
Rev. 3.1, 2007-08-20
TLE6251DS
Table 3
Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit Remarks
Min.
Max.
VCC
VCANH/L
-0.3
5.5
V
–
-32
40
V
–
CAN bus differential voltage
CANH, CANL, SPLIT
VCAN diff
-40
40
V
CANH - CANL < |40 V|
CANH - SPLIT < |40 V|
CANL - SPLIT < |40 V|
Input voltage at SPLIT
VSPLIT
VI
-27
40
V
–
-0.3
VCC
V
0 V < VCC < 5.5 V
Electrostatic discharge
voltage at CANH, CANL,
SPLIT vs. GND
VESD
-6
6
kV
human body model
(100 pF via 1.5 kΩ)
Electrostatic discharge
voltage
VESD
-2
2
kV
human body model
(100 pF via 1.5 kΩ)
Tj
-40
150
°C
–
Voltages
Supply voltage
CAN bus voltage (CANH,
CANL)
Logic voltages at STB, TxD,
RxD
Temperatures
Storage temperature
Note: Maximum ratings are absolute ratings; exceeding any one of these values may cause
irreversible damage to the integrated circuit.
Data Sheet
12
Rev. 3.1, 2007-08-20
TLE6251DS
Table 4
Operating Range
Parameter
Symbol
Limit Values
Min.
Supply voltage
Junction temperature
Unit
Remarks
Max.
VCC
Tj
4.75
5.25
V
–
-40
150
°C
–
Rthj-a
–
185
K/W
1)
150
190
°C
–
–
10
K
–
Thermal Resistances
Junction ambient
Thermal Shutdown (junction temperature)
Thermal shutdown temperature
Thermal shutdown hyst.
1)
TjsD
∆T
Calculation of the junction temperature Tj = Tamb + P × Rthj-a
Data Sheet
13
Rev. 3.1, 2007-08-20
TLE6251DS
Table 5
Electrical Characteristics
4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground;
positive current flowing into pin; unless otherwise specified.
Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
ICC
–
6
10
ICC
–
ICC,stb
–
20
30
µA
stand-by mode;
TxD = high
HIGH level output current
IRD,H
–
-4
-2
mA
VRD = 0.8 × VCC
–
-100
–
µA
stand-by mode
LOW level output current
IRD,L
ISC,RxD
2
4
–
mA
VRD = 0.2 × VCC
–
15
20
mA
–
HIGH level input voltage
threshold
VTD,H
2.0
–
–
V
recessive state
LOW level input voltage
threshold
VTD,L
–
–
0.8
V
dominant state
TxD pull-up resistance
RTD
VTD hys
10
20
40
kΩ
–
–
200
–
mV
–
HIGH level input voltage
threshold
VSTB,H
2.0
–
–
V
normal mode
LOW level input voltage
threshold
VSTB,L
–
–
0.8
V
receive-only mode
STB pull-up resistance
RSTB
VSTB hys
10
20
40
kΩ
–
–
200
–
mV
–
Current Consumption
Current consumption
Current consumption
Current consumption
mA
recessive state;
VTxD = VCC
45
70
mA
dominant state;
VTxD = 0 V
Receiver Output RxD
Short circuit current
Transmission Input TxD
TxD input hysteresis
Stand By Input (pin STB)
STB input hysteresis
Data Sheet
14
Rev. 3.1, 2007-08-20
TLE6251DS
Table 5
Electrical Characteristics (cont’d)
4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground;
positive current flowing into pin; unless otherwise specified.
Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
VSPLIT
0.3 ×
0.5 ×
0.7 ×
VSPLIT
0.45 × 0.5 ×
0.55× V
VCC
VCC
VCC
Leakage current
ISPLIT
-5
0
5
µA
standby mode;
-22 V < VSPLIT < 35 V
SPLIT output resistance
RSPLIT
–
600
–
Ω
–
Differential receiver
threshold voltage,
normal mode
Vdiff,rdN
Vdiff,drN
–
0.8
0.9
V
recessive to dominant
0.5
0.6
–
V
dominant to recessive
Differential receiver
threshold,
low power mode
Vdiff,rdLP
Vdiff,drLP
0.9
1.15
V
recessive to dominant
V
dominant to recessive
Split Termination Output (pin SPLIT)
Split output voltage
VCC
VCC
V
VCC
normal mode;
-500 µA < ISPLIT <
500 µA
normal mode;
no Load
Bus Receiver
0.4
0.8
Common Mode Range
CMR
-12
–
12
V
VCC = 5 V
Differential receiver
hysteresis
Vdiff,hys
–
200
–
mV
–
CANH, CANL input
resistance
Ri
10
20
30
kΩ
recessive state
20
40
60
kΩ
recessive state
2.5
3.0
V
VTxD = VCC;
Differential input resistance Rdiff
Bus Transmitter
CANL/CANH recessive
output voltage
VCANL/H
2.0
CANH, CANL recessive
output voltage difference
Vdiff
-500
–
50
mV
CANL dominant output
voltage
VCANL
0.5
–
2.25
V
CANH dominant output
voltage
VCANH
2.75
–
4.5
V
Data Sheet
no load
VTxD = VCC;
no load
15
VTxD = 0 V;
VCC = 5 V
VTxD = 0 V;
VCC = 5 V
Rev. 3.1, 2007-08-20
TLE6251DS
Table 5
Electrical Characteristics (cont’d)
4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground;
positive current flowing into pin; unless otherwise specified.
Parameter
Symbol
Limit Values
Unit Remarks
Min.
Typ.
Max.
1.5
–
3.0
V
VTxD = 0 V;
VCC = 5 V
CANL short circuit current ICANLsc
50
80
200
mA
CANH short circuit current ICANHsc
-200
-80
-50
mA
-
-
-5
µA
VCANLshort = 18 V
VCANHshort = 0 V
VCC = 0 V;
0 V < VCANH,L < 5 V
CANH, CANL dominant
output voltage difference
Vdiff = VCANH - VCANL
Leakage current
Vdiff
ICANH,L,lk
Dynamic CAN-Transceiver Characteristics
Propagation delay
TxD-to-RxD LOW
(recessive to dominant)
td(L),TR
–
150
255
ns
Propagation delay
TxD-to-RxD HIGH
(dominant to recessive)
td(H),TR
–
150
255
ns
td(L),T
Propagation delay
TxD LOW to bus dominant
–
50
120
ns
Propagation delay
td(H),T
TxD HIGH to bus recessive
–
50
120
ns
Propagation delay
td(L),R
bus dominant to RxD LOW
–
100
135
ns
Propagation delay
td(H),R
bus recessive to RxD HIGH
–
100
135
ns
Min. dominant time for bus tWU1
wake-up signal (RxD high
to low)
0.75
3
5
µs
Data Sheet
16
CL = 47 pF;
RL = 60 Ω;
VCC = 5 V;
CRxD = 15 pF
CL = 47 pF;
RL = 60 Ω;
VCC = 5 V;
CRxD = 15 pF
CL = 47 pF;
RL = 60 Ω;
VCC = 5 V
CL = 47 pF;
RL = 60 Ω;
VCC = 5 V
CL = 47 pF;
RL = 60 Ω;
VCC = 5 V;
CRxD = 15 pF
CL = 47 pF;
RL = 60 Ω;
VCC = 5 V;
CRxD = 15 pF
tWU1 = td(L),R + tWU
see Figure 6
Rev. 3.1, 2007-08-20
TLE6251DS
Table 5
Electrical Characteristics (cont’d)
4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground;
positive current flowing into pin; unless otherwise specified.
Parameter
Symbol
Min. recessive time for bus tWU2
wake-up signal (RxD low
to high)
TxD permanent dominant
disable time
Data Sheet
tTxD
Limit Values
Min.
Typ.
Max.
0.75
3
5
0.3
–
17
1.0
Unit Remarks
µs
tWU2 = td(H),R + tWU
ms
–
see Figure 6
Rev. 3.1, 2007-08-20
TLE6251DS
Diagrams
STB
7
TxD
CANH
SPLIT
47 pF
8
1
5
60 Ω
RxD
6
4
15 pF
CANL
GND
VCC
2
3
5V
100 nF
AEA03392.VSD
Figure 8
Data Sheet
Test Circuits for Dynamic Characteristics
18
Rev. 3.1, 2007-08-20
TLE6251DS
VTxD
VµC
GND
VDIFF
td(L), T
td(H), T
t
VDIFF(d)
VDIFF(r)
VRxD
td(L), R
t
td(H), R
VµC
0.8VµC
0.2VµC
GND
td(L), TR
td(H), TR
t
AET02926
Figure 9
Data Sheet
Timing Diagrams for Dynamic Characteristics
19
Rev. 3.1, 2007-08-20
TLE6251DS
Application
4 .7 nF
60 Ω
1)
VS
60 Ω
TL E6251 G
10 k Ω
9
V Bat
C AN
Bus
WK
EN
N ST B
N ER R
51 µH
13
1)
12
11
10
C AN H
R xD
C AN L
T xD
SPLIT
V µC
6
14
8
µP
w ith On C hip
C AN M odule
4
1
e.g . C164 C
C167 C
5
100
nF
VS
100 7
IN H
nF
GN D
VCC
3
VQ 1
IN H
e.g. T LE 4476
(3.3/5 V) or
TLE 4471
TLE 4276
TLE 4271
100
nF
VI
GN D
100
nF
2
22 +
µF
100
nF
GN D
VQ 2
5 V
+
22
µF
+
22
µF
EC U
TL E6251 D S
51 µH
7
1)
6
5
C AN H
ST B
C AN L
R xD
SPLIT
T xD
GN D
V CC
8
µP
w ith On C hip
C AN M odule
4
1
e.g . C164 C
C167 C
3
100
nF
2
100
nF
GN D
e. g. T LE 4270
60 Ω
VI
60 Ω
4.7 nF
1)
22 +
µF
100
nF
Data Sheet
+
22 µF
EC U
1) Optional, according to the car m anufacturer requirem ents
Figure 10
5V
VQ
GN D
AEA 03387.VSD
Application Circuit
20
Rev. 3.1, 2007-08-20
TLE6251DS
0.1
2)
0.41+0.1
-0.06
0.2
8
5
1
4
5 -0.2 1)
M
0.19 +0.06
C
B
8 MAX.
1.27
0.35 x 45˚
4 -0.2 1)
1.75 MAX.
0.175 ±0.07
(1.45)
Package Outlines
0.64 ±0.25
6 ±0.2
A B 8x
0.2
M
C 8x
A
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Lead width can be 0.61 max. in dambar area
GPS01181
Figure 11
PG-DSO-8 (PG-DSO-8-16 Plastic Dual Small Outline)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be
compliant with government regulations the device is available as a green product. Green products
are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to
IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
SMD = Surface Mounted Device
Data Sheet
21
Rev. 3.1, 2007-08-20
TLE6251DS
Revision History
Version
Date
Changes
Rev. 3.1
2007-08-20 RoHS-compliant version of the TLE6251DS
•
•
•
•
•
Data Sheet
All pages: Infineon logo updated
Page 3:
“added AEC qualified” and “RoHS” logo, “Green Product
(RoHS compliant)” and “AEC qualified” statement added to
feature list, package name changed to RoHS compliant
versions, package picture updated, ordering code removed
Page 21:
Change package drawing to GPS01181
Package name changed to RoHS compliant versions, “Green
Product” description added
added Revision History
updated Legal Disclaimer
22
Rev. 3.1, 2007-08-20