NL17SV00 Single 2-Input NAND Gate The NL17SV00 is an ultra−high performance 2−Input NAND gate manufactured in 0.35 mm technology, with excellent performance down to 0.9 V. This device is ideal for extremely high speed and high−drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT−553 makes this device fit most tight designs and spaces. http://onsemi.com Features • • • • • • • Extremely High Speed: 1.0 ns (Typ) @ VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permits Logic Translation Balanced ±24 mA Output Drive @ VCC 3.3 V Near Zero Static Supply Current Ultra−Tiny SOT−553 5−Pin Package, only 1.6 x 1.6 x 0.6 mm These Devices are Pb−Free and are RoHS Compliant Typical Applications • • • • Cellular Digital Camera PDA Digital Video MARKING DIAGRAM 5 1 UH M G G SOT−553 CASE 463B UH = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN DIAGRAM IN B 1 IN A 2 GND 3 5 VCC 4 OUT Y Industry Leadership • Functionally Similar to NC7SV00 and SN74AUC1G00 IN A & OUT Y IN B PIN ASSIGNMENT Figure 1. Logic Symbol FUNCTION TABLE Inputs PIN # FUNCTION 1 IN B 2 IN A Output 3 GND A B Y 4 OUT Y L L H 5 VCC L H H H L H H H L ORDERING INFORMATION Device Package Shipping† NL17SV00XV5T2G SOT−553 4000 Tape & Reel (Pb−Free) (178 mm) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. © Semiconductor Components Industries, LLC, 2014 May, 2014 − Rev. 5 1 Publication Order Number: NL17SV00XV5T2/D NL17SV00 MAXIMUM RATINGS Symbol VCC Rating Value Units DC Supply Voltage −0.5 to +4.6 V VI DC Input Voltage −0.5 to +4.6 V VO DC Output Voltage IIK DC Input Diode Current VIN < 0 V −50 DC Output Diode Current VOUT < 0 V VOUT > VCC −50 +50 IO DC Output Sink Current ±50 mA IOK −0.5 to VCC + 0.5 V mA mA ICC DC Supply Current per Supply Pin ±50 mA IGND DC Ground Current per Ground Pin ±50 mA TSTG Storage Temperature Range − 65 to +150 °C TL Lead Temperature, 1.0 mm from Case for 10 seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 1) 250 °C/W PD Power Dissipation in Still Air at 85°C 250 mW MSL FR Moisture Sensitivity Level 1 Flammability Rating Oxygen index: 28 to 34 UL 94 V−0 @ 0125 in Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units 0.9 3.6 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 3.6 V Vout Output Voltage 0 VCC V IOH/IOL tA tr, tf Output Current VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V ±24 ±18 ±6 ±4 ±2 ±0.1 Operating Temperature Range. All Package Types Input Rise or Fall Time VCC = 3.3V ± 0.3 V −40 +85 0 10 mA °C nS/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction, Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 2 NL17SV00 DC CHARACTERISTICS – Digital Section (Voltages Referenced to GND) TA = 25°C Symbol Parameter VCC Min VIH High Level Input Voltage 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIL Low Level Input Voltage 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = −40 to 85°C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Units V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V IOH = −100 mA 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.1 VCC − 0.1 VCC − 0.2 VCC − 0.2 VCC − 0.2 VCC − 0.2 IOH = −2.0 mA 1.10 ≤ VCC ≤ 1.30 0.75 x VCC 0.75 x VCC IOH = −4.0 mA 1.40 ≤ VCC ≤ 1.60 0.75 x VCC 0.75 x VCC IOH = −6.0 mA 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 1.25 2.0 1.25 2.0 IOH = −12 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 1.8 2.2 1.8 2.2 IOH = −18 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 1.7 2.4 1.7 2.4 IOH = −24 mA 2.70 ≤ VCC ≤ 3.60 2.2 2.2 IOL = 100 mA 0.90 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 ≤ VCC ≤ 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 ≤ VCC ≤ 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 ≤ VCC ≤ 1.95 0.3 0.3 IOL = 12 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 ≤ VCC ≤ 2.70 2.70 < VCC ≤ 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 ≤ VCC ≤ 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 mA 0 1 5 mA 0.90 to 3.60 0.9 5 mA VI = VCC or GND http://onsemi.com 3 V V NL17SV00 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) −40°C 25°C Min Typ 85°C Symbol Parameter Condition VCC Max Min Max TPHL, TPLH Propagation Delay CL = 15 pF, RL = 1.0 MW 0.90 CL = 15 pF, RL = 2.0 kW 1.10 ≤ VCC ≤ 1.30 1.40 ≤ VCC ≤ 1.60 3.0 1.0 6.0 3.2 9.9 6.0 1.0 1.0 14.6 7.2 nS CL = 30 pF, RL = 500 W 1.65 ≤ VCC ≤ 1.95 2.30 ≤ VCC ≤ 2.70 2.70 ≤ VCC ≤ 3.60 1.0 0.8 0.7 1.9 1.2 1.0 4.5 2.6 2.3 1.0 0.7 0.6 5.3 3.7 3.0 nS 13 Units nS CIN Input Capacitance 0 2.0 pF COUT Output Capacitance 0 4.5 pF CPD Power Dissipation Capacitance 0.90 to 3.60 20 pF VI = 0 V or VCC F = 10 MHz http://onsemi.com 4 NL17SV00 PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B ISSUE C D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 1 2 E −Y− 3 b e HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.008 0.004 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 RECOMMENDED SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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