SPEC NO. 05-08-5029 REV. V REV 0 A B C D E F RH27, PRECISION OPERATIONAL AMPLIFIER REVISION RECORD DESCRIPTION DATE 06/12/96 08/01/97 INITIAL RELEASE • PAGE 2 - ADDED PARAGRAPHS 3.2.1 - 3.2.3 REFERENCING THE PACKAGE OPTIONS. PARAGRAPH 3.3.b, ADDED “(SEE PARAGRAPH 3.2)”. PARAGRAPH 3.2.3, CHANGED PACKAGE OPTION FROM “10LEAD FLATPACK” TO “10 LEAD BOTTOM BRAZED FLATPACK”. • PAGE 3, PARAGRAPH 3.6 – CHANGED “TABLE I” AND “TABLE IA” TO “TABLE 1” AND “TABLE 1A” TO MATCH THE ACTUAL TABLES ON PAGES 17 AND 18. • PAGE 4 – DELETED PARAGRAPH 3.12.1. • PAGE 6, FIGURE 1, PAGE 7, FIGURE 2, AND PAGE 8, FIGURE 3 - ADDED θja, θjc, AND TJMAX. • PAGE 9, FIGURE 6 – CHANGED TO VIEW OF THE 10 LEAD W PACKAGE. • PAGES 10 - 13, FIGURES 7 – 10 – REMOVED REFERENCE TO LTC SPEC. • PAGES 14 AND 15, FIGURES 11 AND 12 – REMOVED NOTE ON CALCULATION OF TJMAX SUPPLIED BY CUSTOMER. CHANGED PACKAGE TYPE FROM “FLATPACK” TO “BOTTOM BRAZED FLATPACK” ON BOTH PAGES. • PAGE 17 – REMOVED EXTRA HEADER FOR PRE-IRRADIATION ELECTRICAL TABLE. • PAGE 20 – CHANGED DELTA LIMITS ON +IB AND –IB PARAMETERS FROM MIN –10, MAX 10 TO –30, MAX 30. • PAGE 4, ADDED PARAGRAPHS 3.8.1, 3.8.2, 3.8.3. • PAGE 5, PARAGRAPH 4.4.2, GROUP B INSPECTION, WAS REDEFINED. • PAGE 6, PARAGRAPH 4.4.3, GROUP D INSPECTION, WAS REDEFINED. PARAGRAPH 4.5, SOURCE INSPECTION WAS REDEFINED. • PAGE 5, AMENDED PARAGRAPHS 4.1 AND 4.1.1 TAKING EXCEPTION TO ANALYSIS OF CATASTROPHIC FAILURES. ADDED A SECOND PAGE FOR REVISION RECORD. UPDATED ENTIRE SPEC TO NEXT REVISION DUE TO THE ADDITIONAL PAGE. • PAGE 3, CHANGED PARAGRAPH 3.2.3, PACKAGE OPTION FROM “10 LEAD BOTTOM BRAZED FLATPACK” TO “10 LEAD CERPAK”. PAGE 9 CHANGED “(WB) BOTTOM BRAZED FLATPACK” TO “(W) CERPAK”. PAGE 10 CHANGED OPTION 3 FROM “(WB) BOTTOM BRAZED FLATPACK” TO “(W) CERPAK”. PAGE 15, 16, CHANGED FIGURE 11, 12, FROM “BOTTOM BRAZED FLATPACK” TO “CERPAK”. PAGE 4, CHANGED OPTION 3 TO “CERPAK”. • PAGE 7, TO5 CASE OUTLINE, CHANGED θjc FROM 60°C/W TO 40°C/W, θja DOES NOT CHANGE. • PAGE 8, CERDIP CASE OUTLINE, CHANGED θja FROM 120°C/W TO 110°C/W, θjc CHANGED FROM 50°C/W TO 30°C/W. 09/29/97 12/01/97 03/20/98 10/16/98 7/19/99 CONTINUED ON NEXT PAGE….. REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE. CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION INDEX REVISION INDEX PAGE NO. REVISION PAGE NO. REVISION APPLICATION 1 V 18 V ORIG DSGN ENGR MFG CM QA PROG FUNCT 2 V 19 V 3 V 20 V 4 V 21 V 5 V 22 V SIGNOFFS 6 V 7 V DATE 8 V 9 V 10 V 11 V 12 V 13 V 14 V 15 V 16 V 17 V LINEAR TECHNOLOGY CORPORATION MILPITAS, CALIFORNIA TITLE: MICROCIRCUIT, LINEAR, RH27, OPERATIONAL AMPLIFIER SIZE CAGE CODE DRAWING NUMBER REV 64155 05-08-5029 V CONTRACT: FOR OFFICIAL USE ONLY ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 1 of 22 SPEC NO. 05-08-5029 REV. V REV G H J K RH27, PRECISION OPERATIONAL AMPLIFIER REVISION RECORD DESCRIPTION • PAGE 9, FIGURE 3, CHANGED θja AND θjc. • PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3 HAD FIGURES 1, 2, 3 REMOVED. • PAGE 4, PARAGRAPH 3.7 CHANGED VERBIAGE FROM “SPECIFIED IN TABLE III” TO “AND AS SPECIFIED IN TABLE III HEREIN”, LINE 2. PARAGRAPH 3.9 ADDED “HEREIN” AFTER “TABLE II”, LINE 2. • PAGE 5, PARAGRAPH 4.3, ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.1, ADDED “HEREIN” AFTER “TABLE III”, LINE 2. PARAGRAPH 4.4.2.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IIA OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IIA IN MIL-STD-883”. • PAGE 6, PARAGRAPH 4.4.3.2, CHANGED VERBIAGE IN LINE 1 FROM “ALL FOOTNOTES OF TABLE IV OF MIL-STD-883” TO “ALL FOOTNOTES PERTAINING TO TABLE IV IN MIL-STD883”. • PAGE 9, CHANGED THETA JA TO θJA=170°C/W AND THETA JC TO θJC=40°C/W FROM θJA=225°C/W AND θJC=18°C/W PER PACKAGE ENGINEER. • PAGE 3, PARAGRAPHS 3.2.1, 3.2.2, 3.2.3, ADDED “OPTION” BEFORE EACH DEVICE SELECTION. • PAGE 4, PARAGRAPH 3.6, TABLE IA CHANGED TO TABLE II. PARAGRAPH 3.7, TABLE III CHANGED TO TABLE IV. PARAGRAPH 3.10.3, ADDED “DEVICE OPTIONS 1, 2, AND 3” TO LINE 1. DATE 09/29/99 01/04/00 09/05/00 11/07/02 • PAGE 5, PARAGRAPH 3.11.1 WAS CHANGED FROM “…dosage rate of approximately 20 Rads per second” TO “…dosage rate of less than or equal to 10 Rads per second”. PARAGRAPHS 4.1 THROUGH 4.4.2.1 CHANGES WERE DONE TO CLARIFY GROUP SAMPLING. • PAGE 6, PARAGRAPH 4.4.3 CHANGE WAS DONE TO CLARIFY GROUP SAMPLING. PARAGRAPHS 4.6.2 THROUGH 4.6.4 WERE RE-WRITTEN. THESE DATA PROVIDED, AND DATA AVAILABLE. PARAGRAPH 4.6.10 NOTE, ADDED FURTHER EXPLANATION OF MINIMUM DELIVERED DATA. • PAGES 8 THROUGH 18, ALL FIGURE TITLES CHANGED TO HAVE DEVICE OPTIONS AND PACKAGE TYPES AT TOP OF PAGE, AND HAVE ALL FIGURES AT BOTTOM OF PAGE. • PAGE 9, CASE OUTLINE EDITED TO REFLECT ONLY THE 8 LEAD PACKAGE INFORMATION. FIGURE 2, SHOULDER OF LEAD WIDTH MAXIMUM INCREASED BY .003 INCHES. • PAGE 10, CASE OUTLINE WAS UPDATED TO MEET MIL-STD-1835. FIGURE 3, PACKAGE THICKNESS MAXIMUM INCREASED BY .005 INCHES. PACKAGE WIDTH AND LENGTH MAXIMUMS INCREASED BY .01 AND .02 INCHES, RESPECTIVELY. • • • • • • • PAGE 11, MOVED FIGURES 4, 5, 6 FOR BETTER FIT ON PAGE. PAGE 13, FIGURE 8, ADDED PACKAGE PINOUTS. PAGE 14, FIGURE 9, ADDED PACKAGE PINOUTS. PAGE 15, FIGURE 10, ADDED PACKAGE PINOUTS. PAGE 16, FIGURE 11, ADDED PACKAGE PINOUTS. PAGE 17, FIGURE 12, ADDED PACKAGE PINOUTS. PAGE 19, ADDED NOTE 8 AFTER TABLE II. L • PAGE 9, CHANGED OUTLINE DRAWING PIN 1 NOTCH MOVED TO INSIDE LEAD LOCATION. M N • • P Q PAGE 4, CHANGED INITIAL RATE OF RADS TO 240 RADS/SEC. PAGE 5, CHANGED IN 4.2 & 4.3 PARAGRAPHS IN CONJUNCTION TO 3.3 CHANGED TO PARAGRAPH 3.4 • PAGE 5, PARAGRAPH 4.3 CHANGED 3.1.1 TO 3.1 AND 3.2.1 TO 3.1.1 • PAGE 4, PARAGRAPH 3.10.3 ADDED OPTION 3 IS ALLOY 42 FOR FLATPACK. 05/19/03 03/16/05 07/16/07 09/10/07 10/19/07 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 2 of 22 SPEC NO. 05-08-5029 REV. V REVISION RECORD DESCRIPTION REV R S T U V RH27, PRECISION OPERATIONAL AMPLIFIER • • PAGE 6, PARAGRAPH 3.11.1 CHANGED VERBIAGE PAGE 5, PARAGRAPH 3.10.3 CHANGED OPTION 2 TO ALLOY 42 PACKAGE REQUIREMENT. • PAGE 6, PARAGRAPH 4.4.2 CHANGED VERBIAGE. • PAGE 10, FIGURE 3 NOTE 2 ADDED TO LEAD THICKNESS. • ADDED OPTION 4 & OPTION 5 THROUGH OUT SPEC. • Page 16, ADDED DYNAMIC BURN-IN CIRCUIT INFORMATION • Removed the “C” from RH27 header. • Page 19, 20, Added updated data sheet. • PAGE 4, PARAGRAPH 3.2.6, ADDED OPTION 6, RH27AEW (GLASS SEAL FLATPACK, 10 LEADS). • PAGE 5, PARAGRAPH 3.8.3, ADDED OPTION 6 TO BURN-IN REQUIREMENT. • PAGE 5, PARAGRAPH 3.10.3, ADDED OPTION 6 TO LEAD MATERIAL AND FINISH. • PAGE 10, FIGURE 3, ADDED DEVICE OPTION 6 TO W10 GLASS SEALED FLATPACK. • PAGE 11, FIGURE 6, ADDED DEVICE OPTION 6 TO GLASS SEALED FLATPACK TERMINAL CONNECTIONS. • PAGE 16, FIGURE 11, ADDED OPTION 6 TO STATIC BURN-IN CIRCUIT. • PAGE 17, FIGURE 12, ADDED OPTION 6 TO DYNAMIC BURN-IN CIRCUIT. • PAGE 5, PARAGRAPH 3.5, AMENDED ESD CLASSIFICATION FROM CLASS 1 TO CLASS 2. DATE 04/29/08 05/27/08 01/23/09 01/20/12 05/23/12 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 3 of 22 SPEC NO. 05-08-5029 REV. V 1.0 SCOPE: 1.1 2.0 RH27, PRECISION OPERATIONAL AMPLIFIER This specification defines the performance and test requirements for a microcircuit processed to a space level manufacturing flow. APPLICABLE DOCUMENTS: 2.1 Government Specifications and Standards: the following documents listed in the Department of Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this specification to the extent specified herein. SPECIFICATIONS: 2.2 3.0 MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for MIL-STD-883 Test Method and Procedures for Microcircuits MIL-STD-1835 Microcircuits Case Outlines Order of Precedence: In the event of a conflict between the documents referenced herein and the contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other referenced specifications. REQUIREMENTS: 3.1 General Description: This specification details the requirements for the RH27 Precision Operational Amplifier, processed to space level manufacturing flow. 3.2 Part Number: 3.2.1 Option 1 – RH27CH (TO5 Metal Can, 8 Leads) 3.2.2 Option 2 – RH27CJ8 (Ceramic Dip, 8 Leads) 3.2.3 Option 3 – RH27CW (Glass Seal Flatpack, 10 Leads) 3.2.4 Option 4 – RH27EW (Glass Seal Flatpack, 10 Leads) 3.2.5 Option 5 – RH27EH (TO5 Metal Can, 8 Leads) 3.2.6 Option 6 – RH27AEW (Glass Seal Flatpack, 10 Leads) Note: RH27AEW is marked and processed as RH27EW. Orders will be delivered with an additional screening at 25°C, –55°C to 125°C to the VOS specification shown on Table 1. ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 4 of 22 SPEC NO. 05-08-5029 REV. V 3.3 3.4 RH27, PRECISION OPERATIONAL AMPLIFIER Part Marking Includes: a. LTC Logo b. LTC Part Number (See Paragraph 3.2) c. Date Code d. Serial Number e. ESD Identifier per MIL-PRF-38535, Appendix A The Absolute Maximum Ratings: Supply Voltage . . . . . . . . Internal Power Dissipation . . . . . . Input Voltage Output Short Circuit Duration . . . Differential Input Current 1/ . Operating Temperature Range . Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 sec) . . . . . . . . . . +22V . . . . . . . . . . 500mW . . . . . . . . . . Equal to Supply Voltage . . . . . . . . . . Indefinite . . . . . . . . . . +25mA . . . . . . . . . . -55°C to +125°C . . . . . . . . . . -55°C to +150°C . . . . . . . . . . -65°C to +150°C . . . . . . . . +300°C 1/ The RH27’s inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise. If differential input voltage exceeds +0.7V, the input current should be limited to 25mA. 3.5 Electrostatic discharge sensitivity, ESDS, shall be Class 2. 3.6 Electrical Performance Characteristics: The electrical performance characteristics shall be as specified in Table I and Table II. 3.7 Electrical Test Requirements: Screening requirements shall be in accordance with 4.1 herein, MIL-STD-883, Method 5004, and as specified in Table IV herein. 3.8 Burn-In Requirement: 3.8.1 Option 1, 5 (TO5): Static Burn-In, Figure 7; Dynamic Burn-In, Figure 8 3.8.2 Option 2 (Ceramic Dip): Static Burn-In, Figure 9; Dynamic Burn-In, Figure 10 3.8.3 Options 3, 4, 6: (Glass Sealed Flatpack) : Static Burn-In, Figure 11; Dynamic Burn-In, Figure 12 3.9 Delta Limit Requirement: Delta limit parameters are specified in Table III herein, are calculated after each burn-in, and the delta rejects are included in the PDA calculation. 3.10 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and electrical requirements shall be specified herein. 3.10.1 3.10.2 Mechanical / Packaging Requirements: Case outlines and dimensions are in accordance with Figure 1, Figure 2, and Figure 3. Terminal Connections: The terminal connections shall be as specified in Figure 4, Figure 5, and Figure 6. ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 5 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER 3.10.3 Lead Material and Finish: The lead material and finish for Device Options 1, 5 shall be Kovar and Options 2, 3, 4, and 6 are Alloy 42. The lead finishes shall be hot solder dip (Finish letter A) in accordance with MIL-PRF-38535. 3.11 4.0 Radiation Hardness Assurance (RHA): 3.11.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a guideline. 3.11.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the manufacturer will provide certified RAD testing and report through an independent test laboratory when required as a customer purchase order line item. 3.11.3 Total dose bias circuit is specified in Figure 13. 3.12 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A, except for the following: Topside glassivation thickness shall be a minimum of 4KÅ. 3.13 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018 and copies of SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when specified as a customer purchase order line item. VERIFICATION (QUALITY ASSURANCE PROVISIONS) 4.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF-38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified Class S manufacturing lines. 4.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with MIL-STD-883, Method 5005 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1.1, 3.2.1, and 3.4 of the test method. 4.3 Screening: Screening requirements shall be in accordance with MIL-STD-883, Method 5004 with QML allowed and TRB approved deviations in conjunction with paragraphs 3.1, 3.1.1, and 3.4 of the test method. Electrical testing shall be as specified in Table IV herein. 4.3.1 4.4 Analysis of catastrophic (open/short) failures from burn-in will be conducted only when a lot fails the burn-in or re-burn-in PDA requirements. Quality Conformance Inspection: Quality conformance inspection shall be in accordance with 4.2 and 4.3 herein and as follows: 4.4.1 Group A Inspection: Group A inspection shall be performed in accordance with 4.1 herein, per MIL-STD-883, Method 5005, and specified in Table IV herein. 4.4.2 Group B Inspection: When purchased, a full Group B is performed on an inspection lot. As a minimum, subgroups 1-4 plus 6 are performed on every assembly lot, and Subgroup B2 (Resistance to Solvents / Mark Permanency) and Subgroup B3 (Solderability) are performed prior to the first shipment from any inspection lot and Attributes provided when a Full Space Data Pack is ordered. Subgroup B5 (Operating Life) is performed on each wafer lot. This subgroup may or may not be from devices built in the same package style as the current inspection lot. Attributes and variables data for this subgroup will be provided upon request at no charge. 4.4.2.1 Group B, Subgroup 2c = 10% Group B, Subgroup 5 = *5% (*per wafer or inspection lot Group B, Subgroup 3 = 10% whichever is the larger quantity) Group B, Subgroup 4 = 5% Group B, Subgroup 6 = 15% ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 6 of 22 SPEC NO. 05-08-5029 REV. V 4.4.2.2 4.4.3 4.5 4.6 RH27, PRECISION OPERATIONAL AMPLIFIER All footnotes pertaining to Table IIa in MIL-STD-883, Method 5005 apply. The quantity (accept number) of all other subgroups are per MIL-STD-883, Method 5005, Table IIa. Group D Inspection: When purchased, a full Group D is performed on an inspection lot. As a minimum, periodic full Group D sampling is performed on each package family for each assembly location every 26 weeks. A generic Group D Summary is provided when a full Space Data Pack is ordered. 4.4.3.1 Group D, Subgroups 3, 4 and 5 = 15% each (Sample Size Series). 4.4.3.2 All footnotes pertaining to Table IV in MIL-STD-883, Method 5005 apply. The quantity (accept number) or sample number and accept number of all other subgroups are per MIL-STD-883, Method 5005, Table IV. Source Inspection: 4.5.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal visual. 4.5.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to shipment for each lot of deliverables when specified as a customer purchase order line item. This may include wafer lot acceptance and final data review. Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered: 4.6.1 Lot Serial Number Sheets identifying all devices accepted through final inspection by serial number. 4.6.2 100% attributes (completed lot specific traveler; includes Group A Summary) 4.6.3 Burn-In Variables Data and Deltas (if applicable) 4.6.4 Group B2, B3, and B5 Attributes (Variables data, if performed on lot shipping) 4.6.5 Generic Group D data (4.4.3 herein) 4.6.6 SEM photographs (3.13 herein) 4.6.7 Wafer Lot Acceptance Report (3.13 herein) 4.6.8 X-Ray Negatives and Radiographic Report 4.6.9 A copy of outside test laboratory radiation report if ordered 4.6.10 Certificate of Conformance certifying that the devices meet all the requirements of this specification and have successfully completed the mandatory tests and inspections herein. Note: Items 4.6.1 and 4.6.10 will be delivered as a minimum, with each shipment. This is noted on the Purchase Order Review Form as “No Charge Data”. 5.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All devices shall be packaged in conductive material or packaged in anti-static material with an external conductive field shielding barrier. ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 7 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER DEVICE OPTION # 1, 5 (H) TO5 / 8 LEADS CASE OUTLINE θja = +150°C/W θjc = +40°C/W FIGURE 1 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 8 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER DEVICE OPTION # 2 (J8) CERAMIC DIP / 8 LEADS CASE OUTLINE NOTE: 1. LEAD DIMENSIONS APPLY TO SOLDER DIP OR TIN PLATE LEADS. 2. 8 LEAD D MAX = .405 (10.287) θja = +110°C/W θjc = +30°C/W FIGURE 2 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 9 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER DEVICE OPTION # 3, 4, 6 (W10) GLASS SEALED FLATPACK / 10LEADS CASE OUTLINE NOTE: 1. THIS DIMENSION ALLOWS FOR OFFCENTER LID, MENISCUS AND GLASS OVER RUN. NOTE: 2. INCREASE DIMENSION BY 0.003 INCH WHEN LEAD FINISH IS APPLIED (SOLDER DIPPED). θja = +170°C/W θjc = +40°C/W FIGURE 3 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 10 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER TERMINAL CONNECTIONS DEVICE OPTION #1, 5 TO5 10 LEAD METAL CAN FIGURE 4 DEVICE OPTION #2, 8 LEAD CERAMIC DIP DEVICE OPTION #3, 4, 6 GLASS SEALED 10 LEAD FLATPACK FIGURE 5 FIGURE 6 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 11 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER STATIC BURN-IN CIRCUIT OPTION 1, 5 TO5 METAL CAN / 8 LEADS FIGURE 7 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 12 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER DYNAMIC BURN-IN CIRCUIT OPTION 1, 5 TO5 METAL CAN / 8 LEADS FIGURE 8 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 13 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER STATIC BURN-IN CIRCUIT OPTION #2, CERDIP / 8 LEADS FIGURE 9 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 14 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER DYNAMIC BURN-IN CIRCUIT OPTION 2, CERDIP / 8 LEADS FIGURE 10 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 15 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER STATIC BURN-IN CIRCUIT OPTION 3, 4, 6 GLASS SEALED FLATPACK / 10 LEAD Notes: 1. Unless otherwise specified, components tolerances shall be per military specification. 2. Tj = 150°C maximum * 3. Ta = 125°C 4. Burn-in Voltages: V1 = +18V to +19.8V V2 = -18V to -19.8V *Tj Calculation is based on: a) Icc = 3.85mA maximum @ ±19.8V b) θja of 112°C/W as supplied by customer FIGURE 11 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 16 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER DYNAMIC BURN-IN CIRCUIT OPTION 3, 4, 6 GLASS SEALED FLATPACK / 10 LEAD FIGURE 12 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 17 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER TOTAL DOSE BIAS CIRCUIT FIGURE 13 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 18 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER TABLE I: ELECTRICAL CHARACTERISTICS (PRE-IRRADIATION) NOTE 9 NOTES ARE ON THE NEXT PAGE. ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 19 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER TABLE II: ELECTRICAL CHARACTERISTICS (POST-IRRADIATION) NOTE 10 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 20 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER 0.1Hz TO 10Hz NOISE TEST CIRCUIT FIGURE 14 __________________________________________________________________________________________________ CURRENT NOISE MEASUREMENT Current Noise is measured and calculated by the following formula: FIGURE 15 ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 21 of 22 SPEC NO. 05-08-5029 REV. V RH27, PRECISION OPERATIONAL AMPLIFIER TABLE III: POST BURN-IN ENDPOINTS AND DELTA LIMIT REQUIREMENTS TA = 25°C, VCC = +15V PARAMETER VOS +IB -IB ENDPOINT LIMIT MIN MAX -100 100 -80 80 -80 80 DELTA MIN -75 -30 -30 MAX 75 30 30 UNITS µV nA nA TABLE IV: ELECTRICAL TEST REQUIREMENTS MIL-STD-883 TEST REQUIREMENTS FINAL ELECTRICAL TEST REQUIREMENTS (METHOD 5004) GROUP A TEST REQUIREMENTS (METHOD 5005) GROUP B AND D FOR CLASS S ENDPOINT ELECTRICAL PARAMETERS (METHOD 5005) SUBGROUP 1*, 2, 3, 4, 5, 6, 7 1, 2, 3, 4, 5, 6, 7 1, 2, 3 *PDA APPLIES TO SUBGROUP 1. PDA TEST NOTE: The PDA is specified as 5% based on failures from Group A, Subgroup 1, tests after cooldown as the final electrical test in accordance with method 5004 of MIL-STD-883. The verified failures of Group A, Subgroup 1 and delta rejects after burn-in divided by the total number of devices submitted for burn-in in that lot shall be used to determine the percent for the lot. ___________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 22 of 22