SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE REVISION RECORD REV DATE DESCRIPTION 0 A INITIAL RELEASE PAGE 11, REMOVE UNNECESSARY TEST CONDITIONS FROM PSRR AND CMRR. CHANGED TEST CONDITIONS ON PSRR. 02/12/09 04/13/09 B CORRECT REVISION TYPOS ON PAGE 1 OF DOCUMENT; UP-REV FROM ‘0’ TO ‘B’ 09/24/09 C Page 2, amended section 3.3, Special Handling of Dice, to more accurately describe our current procedures and requirements. Page 13, Changed RH Canned Sample Table for Qualifying Dice Sales: Subgroup 6 Sample Size Series changed from 45 (3) to 65 (3). First note had the Sample Size Series from “15%” to “10%”. ECN #: 13C13929 Updated Die Sales table on pg 13. Replace electrical characteristic Table II on page 12 03/30/12 D E F 09/24/13 03/25/15 04/16/15 CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION INDEX REVISION INDEX PAGE NO. REVISION PAGE NO. REVISION 1 F 2 F 3 F 4 F 5 F PROG FUNCT 7 F 8 F 9 F 10 F 11 F 12 F 13 F LINEAR TECHNOLOGY CORPORATION MILPITAS, CALIFORNIA ORIG DSGN ENGR MFG CM QA APPLICATION 6 F TITLE: MICROCIRCUIT, LINEAR, RH1028 / RH1128 ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE SIZE SIGNOFFS CAGE CODE 64155 DATE CONTRACT: DRAWING NUMBER REV 05-08-5238 F FOR OFFICIAL USE ONLY ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 1 of 13 SPEC NO. 05-08-5238 REV. F 1.0 SCOPE: 1.1 2.0 RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE This specification defines the performance and test requirements for a microcircuit processed to a space level manufacturing flow. APPLICABLE DOCUMENTS: 2.1 Government Specifications and Standards: the following documents listed in the Department of Defense Index of Specifications and Standards, of the issue in effect on the date of solicitation, form a part of this specification to the extent specified herein. SPECIFICATIONS: 2.2 3.0 MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General Specification for MIL-STD-883 Test Method and Procedures for Microcircuits MIL-STD-1835 Microcircuits Case Outlines Order of Precedence: In the event of a conflict between the documents referenced herein and the contents of this specification, the order of precedence shall be this specification, MIL-PRF-38535 and other referenced specifications. REQUIREMENTS: 3.1 General Description: This specification details the requirements for the RH1028M / RH1128M, Ultra Noise Precision High Speed Op Amps Dice and Element Evaluation Test Samples, processed to space level manufacturing flow as specified herein. 3.2 Part Number: 3.3 Special Handling of Dice: Rad Hard dice require special handling as compared to standard IC dice. Rad Hard dice are susceptible to surface damage due to the absence of silicon nitride passivation that is present on most standard dice. Silicon nitride protects the dice surface from scratches by its hard and dense properties. The passivation on Linear Technology’s Rad Hard dice is silicon dioxide which is much “softer” than silicon nitride. During the visual and preparation for shipment, ESD safe Tweezers are used and only the edge of the die are touched. RH1028M Dice / RH1128M Dice LTC recommends that dice handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die in or out of the chip shipment tray (waffle pack), use an ESD-Safe-Plastic-tipped Bent Metal Vacuum Probe, preferably .020” OD x .010” ID (for use with tiny parts). The wand should be compatible with continuous air vacuums. The tip material should be static dissipative Delrin (or equivalent) plastic. During die attach, care must be exercised to ensure no tweezers, or other equipment, touch the top of the dice. ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 2 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE 3.4 The Absolute Maximum Ratings (Note 1) Supply Voltage (-55°C TO 125°C) . . . . . . . . . . . . . +16V Differential Input Current (Note 9) . . . . . . . . . . . . . +25mA . . . . . . . . . . . . . Input Voltage Equal to Supply Voltage . . . . . . . . . . . . . Output Short Circuit Duration Indefinite Operating Temperature Range . . . . . . . . . . . -55C to 125C . . . . . . . . . . . . Storage Temperature Range -65C to 150C Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . 300C Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. 3.5 Design, Construction, and Physical Dimensions: Detail design, construction, physical dimensions, and electrical requirements shall be specified herein. 3.6 Outline Dimensions and Pad Functions: Dice outline dimensions, pad functions, and locations shall be specified in Figure 1. 3.7 Radiation Hardness Assurance (RHA): 3.7.1 The manufacturer shall perform a lot sample test as an internal process monitor for total dose radiation tolerance. The sample test is performed with MIL-STD-883 TM1019 Condition A as a guideline. 3.7.2 For guaranteed radiation performance to MIL-STD-883, Method 1019, total dose irradiation, the manufacturer will provide certified RAD testing and report through an independent test laboratory when required as a customer purchase order line item. 3.7.3 Total dose bias circuit is specified in Figure 2. 3.8 Wafer (or Dice) Probe: Dice shall be 100% probed at Ta = +25C to the limits shown in Table I herein. All reject dice shall be removed from the lot. This testing is normally performed prior to dicing the wafer into chips. Final specifications after assembly are sample tested during the element evaluation. 3.9 Wafer Lot Acceptance: Wafer lot acceptance shall be in accordance with MIL-PRF-38535, Appendix A, except for the following: Top side glassivation thickness shall be a minimum of 4KÅ. 3.10 Wafer Lot Acceptance Report: SEM is performed per MIL-STD-883, Method 2018. Copies of SEM photographs shall be supplied with the Wafer Lot Acceptance Report as part of a Space Data Pack when specified as a customer purchase order line item. 3.11 Traceability: Wafer Diffusion Lot and Wafer traceability shall be maintained through Quality Conformance Inspection. 4.0 QUALITY CONFORMANCE INSPECTION: Quality Conformance Inspection shall consist of the tests and inspections specified herein. 5.0 SAMPLE ELEMENT EVALUATION: A sample from each wafer supplying dice shall be assembled and subjected to element evaluation per Table III herein. ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 3 of 13 SPEC NO. 05-08-5238 REV. F 6.0 RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE 5.1 100 Percent Visual Inspection: All dice supplied to this specification shall be inspected in accordance with MIL-STD-883, Method 2010, Condition A. All reject dice shall be removed from the lot. 5.2 Electrical Performance Characteristics for Element Evaluation: The electrical performance characteristics shall be as specified in Table I and Table II herein. 5.3 Sample Testing: Each wafer supplying dice for delivery to this specification shall be subjected to element evaluation sample testing. No dice shall be delivered until all the lot sample testing has been performed and the results found to be acceptable unless the customer supplies a written approval for shipment prior to completion of wafer qualification as specified in this specification. 5.4 Part Marking of Element Evaluation Sample Includes: 5.4.1 LTC Logo 5.4.2 LTC Part Number 5.4.3 Date Code 5.4.4 Serial Number 5.4.5 ESD Identifier per MIL-PRF-38535, Appendix A 5.4.6 Diffusion Lot Number 5.4.7 Wafer Number 5.5 Burn-In Requirement: Burn-In circuit for W package is specified in Figure 3. 5.6 Mechanical/Packaging Requirements: Case Outline and Dimensions are in accordance with Figure 4. 5.7 Terminal Connections: The terminal connections shall be as specified in Figure 5. 5.8 Lead Material and Finish: The lead material and finish shall be alloy 42 with hot solder dip (Finish letter A) in accordance with MIL-PRF-38535. VERIFICATION (QUALITY ASSURANCE PROVISIONS) 6.1 Quality Assurance Provisions: Quality Assurance provisions shall be in accordance with MIL-PRF38535. Linear Technology is a QML certified company and all Rad Hard candidates are assembled on qualified Class S manufacturing lines. 6.2 Sampling and Inspection: Sampling and Inspection shall be in accordance with Table III herein. 6.3 Screening: Screening requirements shall be in accordance with Table III herein. 6.4 Source Inspection: ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 4 of 13 SPEC NO. 05-08-5238 REV. F 6.5 RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE 6.4.1 The manufacturer will coordinate Source Inspection at wafer lot acceptance and pre-seal internal visual. 6.4.2 The procuring activity has the right to perform source inspection at the supplier’s facility prior to shipment for each lot of deliverables when specified as a customer purchase order line item. This may include wafer lot acceptance, die visual, and final data review. Deliverable Data: Deliverable data that will ship with devices when a Space Data Pack is ordered: 6.5.1 Lot Serial Number Sheets identifying all Canned Sample devices accepted through final inspection by serial number. 6.5.2 100% attributes (completed element evaluation traveler). 6.5.3 Element Evaluation variables data, including Burn-In and Op Life 6.5.4 SEM photographs (3.10 herein) 6.5.5 Wafer Lot Acceptance Report (3.9 herein) 6.5.6 A copy of outside test laboratory radiation report if ordered 6.5.7 Certificate of Conformance certifying that the devices meet all the requirements of this specification and have successfully completed the mandatory tests and inspections herein. Note: Items 6.5.1 and 6.5.7 will be delivered as a minimum, with each shipment. 7.0 Packaging Requirements: Packaging shall be in accordance with Appendix A of MIL-PRF-38535. All dice shall be packaged in multicavity containers composed of conductive, anti-static, or static dissipative material with an external conductive field shielding barrier. ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 5 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE DICE OUTLINE DIMENSIONS AND PAD FUNCTIONS FIGURE 1 ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 6 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE TOTAL DOSE BIAS CIRCUIT FIGURE 2 ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 7 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE BURN-IN CIRCUIT FIGURE 3 ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 8 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE (W10) GLASS SEALED FLATPACK / 10LEADS CASE OUTLINE θja = +170C/W θjc = +40C/W FIGURE 4 ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 9 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE TERMINAL CONNECTIONS FIGURE 5 ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 10 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE TABLE I DICE ELECTRICAL CHARACTERISTICS – Element Evaluation (Notes 1, 2) (PRE-IRRADIATION) Note 1: Input offset voltage measurements are performed by automatic test equipment approximately 0.5 seconds after application of power. Note 2: Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please refer to LTC standard product data sheet for other applicable product information. Please consult factory For more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 11 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE TABLE II: ELECTRICAL CHARACTERISTICS (NOTE 4) (POST-IRRADIATION) Note 3: Input offset voltage measurements are performed by automatic test equipment approximately 0.5 seconds after application of power. In addition, at TA = 25°C, offset voltage is measured with the chip heated to approximately 55°C to account for the chip temperature rise when the device is fully warmed up. Note 4: Post-Irradiation electrical characteristics are based on LTC standard product data sheet. ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 12 of 13 SPEC NO. 05-08-5238 REV. F RH1028M / RH1128M, ULTRALOW NOISE PRECISION HIGH SPEED OP AMP DICE TABLE III RH ELEMENT EVALUATION TABLE QUALIFICATION OF DICE SALES ________________________________________________________________________________________________ LINEAR TECHNOLOGY CORPORATION Page 13 of 13