DICE/DWF SPECIFICATION RH1028M/RH1128M Ultralow Noise Precision High Speed Op Amps PAD FUNCTION 1 2 8 7 3 1. 2. 3. 4. 5. 6. 7. 8. VOS TRIM –IN +IN V– OVER-COMP OUT V+ VOS TRIM X = 0 for LT1028B, 1 for LT1128B DIE CROSS REFERENCE LTC Finished Part Number Order Part Number RH1028MW RH1028MW RH1028 DICE RH1028 DWF* RH1128MW RH1128MW RH1128 DICE RH1128 DWF* Please refer to LTC standard product data sheet for other applicable product information. *DWF = DICE in wafer form. 6 4 5 114mils × 81mils, Backside (substrate) metal: Alloyed gold layer Backside potential: Connect to V – L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. DICE/DWF ELECTRICAL TEST LIMITS SYMBOL PARAMETER VOS Input Offset Voltage (Note 1) IOS Input Offset Current IB Input Bias Current VIN Input Voltage Range CMRR Common Mode Rejection Ratio PSRR VS = ±15V, TA = 25°C, VCM = 0V, unless otherwise noted. CONDITIONS MIN MAX UNITS 300 μV VCM = 0V 150 nA VCM = 0V ±400 nA ±11 V VCM = ±11V VCM = ±10.3V 110 dB Power Supply Rejection Ratio VS = ±4V to ±16V VS = ±4.5V to ±16V 110 dB A VOL Large Scale Voltage Gain RL ≥ 2k, VO = ±10V RL ≥ 1k, VO = ±10V RL ≥ 600Ω, VO = ±10V 5 3.5 2 V/μV V/μV V/μV VOUT Maximum Output Voltage Swing RL ≥ 2k RL ≥ 600Ω ±12 ±10.5 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. V V 1 DICE/DWF SPECIFICATION RH1028M/RH1128M DICE/DWF ELECTRICAL TEST LIMITS VS = ±15V, TA = 25°C, VCM = 0V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN SR Slew Rate A VCL = –1 (RH1028) A VCL = –1 (RH1128) 11 4.5 IS Supply Current MAX UNITS V/μs V/μs 10.5 mA Note 1: Input offset voltage measurements are performed by automatic test equipment approximately 0.5 seconds after application of power. Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production. I.D.No. 66-13-1028 2 Linear Technology Corporation LT 0908 • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2008