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Final Product/Process Change Notification
Document # : FPCN20461X
Issue Date: 26 November 2015
Title of Change:
Qualification of ON Semiconductor’s Trench IGBT fab in Niigita (Japan) for 600V/650V and ON Semiconductor
Vietnam (OSV) Assembly-Test operations of TO247 package IGBTs for Co-pack dual die.
Proposed first ship date:
4 March 2016
Contact information:
Contact your local ON Semiconductor Sales Office or <[email protected]>; <[email protected]>
Samples:
Contact your local ON Semiconductor Sales Office
Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <[email protected]>;
<[email protected] >
Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior
to implementation of the change. ON Semiconductor will consider this change accepted, unless an inquiry is
made in writing within 30 days of delivery of this notice. To do so, contact <[email protected]>.
Change Part Identification:
VN site code on the marking, effective NH08G product may be sourced from either fab.
Change category:
☒ Wafer Fab Change
☒ Assembly Change
Change Sub-Category(s):
☒ Manufacturing Site Change/Addition
☐ Manufacturing Process Change
Sites Affected:
☐ All site(s)
☐ not applicable
☒ Test Change
☐ Other _______________
☐ Material Change
☐ Product specific change
☐ Datasheet/Product Doc change
☐ Shipping/Packaging/Marking
☐ Other: _______________________
☒ ON Semiconductor site(s) :
☐ External Foundry/Subcon site(s)
ON Dong Nai Province, Vietnam
ON Niigata, Japan
Description and Purpose:
This FPCN announces the planned capacity expansion of ON Semiconductor’s TIGBT fab and assembly/test operations of TO247 package IGBTs
Co-pack dual die.
Wafer fabrication of the 600V/650V devices are sourced from ON Semiconductor at Czech Republic (CZ4). ON Semiconductor Niigata, Japan is
added as additional fabrication site. Upon the expiration of this FPCN, 600V and 650V TIGBT devices will be produced in either of the two
locations, ON Semiconductor at Czech Republic (CZ4) or On Semiconductor Niigata (JPF) effective February 2016. These products have been
qualified to industrial requirements.
Currently, assembly and test of these devices is performed at Nantong Fujitsu Microelectronics (NMFE), China. ON Semiconductor Vietnam (OSV)
is being added as an additional assembly and test site. Upon the expiration of this FPCN, TO247 packaged IGBTs Co-pack dual die for the affected
devices will be produced in either of the two locations, Nantong Fujitsu Microelectronics (NMFE) or On Semiconductor Vietnam (OSV). These
products have been qualified to industrial requirements. These products will be Pb-free, Halide free and RoHS compliant.
TEM001092 Rev. F
Page 1 of 4
Final Product/Process Change Notification
Document # : FPCN20461X
Issue Date: 26 November 2015
Reliability Data Summary for Assembly Expansion:
QV DEVICE NAME: NGTB75N65FL2WG
PACKAGE: TO247
Test
Specification
Condition
Interval
Results
HTRB
JESD22-A108
Ta = 145°C, 80% max rated V
1008 hrs
0/240
HTGB
JESD22-A108
Ta = 150°C, 100% max rated Vgss
1008 hrs
0/240
HTSL
JESD22-A103
Ta = 175°C
1008 hrs
0/240
IOL
MIL-STD-750
(M1037)
AEC-Q101
Ta = +25°C, delta Tj=100°C
On/off = 5 min
6000 cyc
0/240
TC
JESD22-A104
Ta = -55°C to +150°C
1000 cyc
0/240
H3TRB
JESD22-A101
85°C, 85% RH, 18.8psig, bias
1008 hrs
0/240
uHAST
JESD22-A102
121°C, 100% RH, 15psig, unbiased
96 hrs
0/240
RSH
JESD22- B106
Ta = 265°C, 10 sec
0/90
SD
JSTD002
Ta = 245°C, 10 sec
0/45
QV DEVICE NAME: NGTB50N120FL2WG
PACKAGE: TO247
Test
Specification
Condition
Interval
Results
HTRB
JESD22-A108
Ta = 145°C, 80% max rated V
1008 hrs
0/240
HTGB
JESD22-A108
Ta = 150°C, 100% max rated Vgss
1008 hrs
0/240
HTSL
JESD22-A103
Ta = 175°C
1008 hrs
0/240
IOL
MIL-STD-750
(M1037)
AEC-Q101
Ta = +25°C, delta Tj=100°C
On/off = 5 min
6000 cyc
0/240
TC
JESD22-A104
Ta = -55°C to +150°C
1000 cyc
0/240
H3TRB
JESD22-A101
85°C, 85% RH, 18.8psig, bias
1008 hrs
0/240
uHAST
JESD22-A102
121°C, 100% RH, 15psig, unbiased
96 hrs
0/240
RSH
JESD22- B106
Ta = 265°C, 10 sec
0/90
SD
JSTD002
Ta = 245°C, 10 sec
0/45
TEM001092 Rev. F
Page 2 of 4
Final Product/Process Change Notification
Document # : FPCN20461X
Issue Date: 26 November 2015
Niigata Fab 600V/650V Trench IGBT Reliability Data Summary:
QV DEVICE NAME: NGTB75N60FL2WG
PACKAGE: TO247
Test
Specification
Condition
Interval
Results
HTRB
JESD22-A108
Ta = 145°C, 80% max rated V
1008 hrs
0/240
HTGB
JESD22-A108
Ta = 175°C, 100% max rated Vgss
1008 hrs
0/240
HTSL
JESD22-A103
Ta = 150°C
1008 hrs
0/240
IOL
MIL-STD-750
(M1037)
AEC-Q101
Ta = +25°C, delta Tj=100°C
On/off = 5 min
6000 cyc
0/240
TC
JESD22-A104
Ta = -55°C to +150°C
1000 cyc
0/240
H3TRB
JESD22-A101
85°C, 85% RH, 18.8psig, bias
1008 hrs
0/240
uHAST
JESD22-A102
121°C, 100% RH, 15psig, unbiased
96 hrs
0/240
RSH
JESD22- B106
Ta = 265°C, 10 sec
0/90
SD
JSTD002
Ta = 245°C, 10 sec
0/45
Electrical Characteristic Summary:
Electrical characteristics are not impacted.
List of Affected Standard Parts: (Trench IGBT Copack 1200V)
TEM001092 Rev. F
Part Number
Qualification Vehicle
NGTB15N120FL2WG
NGTB50N120FL2WG
NGTB25N120FL2WG
NGTB50N120FL2WG
NGTB25N120SWG
NGTB50N120FL2WG
NGTB30N120FL2WG
NGTB50N120FL2WG
NGTB30N120L2WG
NGTB50N120FL2WG
NGTB40N120FL2WG
NGTB50N120FL2WG
NGTB40N120SWG
NGTB50N120FL2WG
NGTB50N120FL2WG
NGTB50N120FL2WG
Page 3 of 4
Final Product/Process Change Notification
Document # : FPCN20461X
Issue Date: 26 November 2015
List of Affected Standard Parts: (Trench IGBT Copack 600V/650V)
Part Number
TEM001092 Rev. F
Qualification Vehicle
NGTB30N60IHLWG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB30N65IHL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB35N60FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB35N65FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB40N60IHLWG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB40N60L2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB40N65IHL2WG
NGTB45N60S1WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB45N60S2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB45N60SWG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB50N60FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB50N60L2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB50N60S1WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB50N60SWG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB50N65FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB75N60FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB75N60SWG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB75N65FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB40N60FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
NGTB40N65FL2WG
NGTB75N65FL2WG, NGTB75N60FL2WG
Page 4 of 4
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