Silicon Piezoresistive Pressure Sensor KPY 62-RK KPY 66-RK Features • • • • Low pressure and temperature hysteresis Fast response High sensitivity and linearity Fatigue free monocrystaline silicon diaphragm giving high load cycle stability • High long term stability • Built in silicon temperature sensor • Metal housing Similar to TO-39-3 Type and Marking Symbol Pressure Range Unit Ordering Code KPY 62 RK P0 … PN 0 … 600 mbar Q62705-K319 KPY 63 RK 0 … 1.6 bar Q62705-K320 KPY 64 RK 0…4 Q62705-K321 KPY 65 RK 0 … 10 Q62705-K322 KPY 66 RK 0 … 25 Q62705-K292 Pin Configuration 1 Temp.- Sensor (typ. R25 = 2 kΩ) 2 Not connected 3 + VIN; Temperature sensor 4 − VOUT 5 No pin 6 Shielding, to be connected to + VIN 7 − VIN 8 + VOUT Semiconductor Group 1 1998-05-11 KPY 62-RK KPY 66-RK Absolute Maximum Ratings Parameter Limit Values1) Symbol Unit Frontside Rearside PMAX Pressure overload bar KPY 65 RK KPY 66 RK 20 50 TA Tstg VIN Operating temperature range Storage temperature range Supply voltage 10 10 − 40 … + 125 ˚C − 40 … + 125 ˚C 12 V 1) Frontside coupling applies pressure onto chip face. Rearside coupling applies pressure through Kovar centre tube. Electrical Characteristics at TA = 25 ˚C and VIN = 5 V, unless otherwise specified. Parameter Symbol Bridge resistance RB Sensitivity s KPY 65 RK KPY 66 RK min. typ. max. 4 − 8 3.6 1.1 5.2 2.1 8.0 3.0 180 150 260 260 400 370 Vfin Output voltage KPY 65 RK KPY 66 RK Offset voltage P = P0 V0 Linearity error (Best fit straight line) P0 = P0 … PN FL KPY 65 … 66 RK Pressure hysteresis PH P1 = P0, P2 = PN, P3 = P0 KPY 65 … 66 RK Semiconductor Group Limit Values 2 Unit kΩ mV/ Vbar mV mV − 25 − + 25 % Vfin − − ± 0.3 ± 0.1 ± 0.5 − % Vfin 1998-05-11 KPY 62-RK KPY 66-RK Electrical Characteristics at T1 = 25 ˚C, T2 = 125 ˚C, T3 = 25 ˚C and VIN = 5 V, unless otherwise specified. Parameter Symbol Limit Values min. Temperature coefficient of Vfin typ. Unit max. TCVfin KPY 65 … 66 RK Temperature coefficient of V0 %/K − 0.22 − 0.18 − 0.15 TCV0 KPY 65 … 66 RK Temperature coefficient of RB %/K − 0.02 − + 0.02 TCRB KPY 65 … 66 RK Temperature hysteresis of V0; Vfin %/K − + 0.23 − % v. Vfin TH KPY 65 … 66 RK − ± 0.2 − Package Outline Similar to TO-39-3 Basic Component View on Chip 12 ±0.1 8 ±0.5 9.3 -0.2 ø0.65 -0.1 5 6 7.6 ±0.1 ø1.05 ±0.1 ø1.55 ±0.1 16 ±0.1 7 3 8 2.6 max 4 1 2 Bond Wire Loop Component Delivery Form 22.2±0.6 5.08 18.2±0.6 3.59 5 ±0.6 6.2 ±0.6 8±0.6 5.08 ø11.5-0.5 3.59 14.2±0.6 45˚ GMT05804 Weight approx. 2.0 g Dimensions in mm Exterior Packaging I.e. tubes, trays, boxes are shown in our Data Book “Package Information”. Semiconductor Group 3 1998-05-11