MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide Doc. # 002-07494 Rev. *A Cypress Semiconductor 198 Champion Court San Jose, CA 95134-1709 Phone (USA): 800.858.1810 Phone (Intnl): +1.408.943.2600 www.cypress.com Copyrights © Cypress Semiconductor Corporation, 2007-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document, including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or other intellectual property rights. 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You shall indemnify and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 2 Preface Thank you for purchasing the SSOP-30P (0.65mm pitch)*1 header board (model number: MB2146-271) for the F2MC-8FX family. The MB2146-271 is a header board that is used to connect an MCU board (model number: MB2146-301A/303A) that is fitted with a F2MC-8FX family evaluation MCU to a user system. This manual explains how to handle the MB2146-271 header board. Read this manual thoroughly before using the MB2146-271 header board. Consult the Sales representatives or the Support representatives of Cypress for details on the massproduced MCUs and evaluation MCUs that are supported by this product. *1: The lead pitch of the package (FPT-30P-M02) is 0.65mm and the body size is 5.6mm × 9.7mm. ■ Caution of the products described in this document The following precautions apply to the product described in this manual. CAUTION The wrong use of a device will give an injury and may cause malfunction on customers system. Cuts This product has parts with sharp points that are exposed. Take care when handling the product as there is a risk of injury if the exposed sharp edges are touched. Damage When connect the header board to the user system, correctly position the index mark (▲) on the conversion board mounted on the user system with the 1 pin direction (1) on the header board, otherwise the MCU board and user system might be damaged. Damage When mounting a mass production MCU, correctly position pin 1, otherwise the mass production MCU and user system might be damaged. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 3 Contents 1. Product Outline 1.1 1.2 5 Product Outline ............................................................................................................5 Product Configuration ..................................................................................................6 2. Checking the Delivered Product 7 3. Procedure for Connecting to a User System 8 3.1 3.2 Connecting...................................................................................................................8 Disconnection ..............................................................................................................8 4. Notes 9 4.1 4.2 Handling precautions ...................................................................................................9 Notes on designing ....................................................................................................10 4.2.1 Notes on designing the printed circuit board for the user system .................10 4.2.2 MCU Footprint Design Precautions ...............................................................11 4.2.3 Notes on Mounting Mass-produced MCUs ...................................................11 5. Specifications 5.1 5.2 5.3 5.4 5.5 12 General Specifications...............................................................................................12 Main Parts..................................................................................................................12 Function Block Diagram.............................................................................................13 MCU Board I/F Connectors (CN1/CN2/CN3) ............................................................14 Pin Assignments for I/F between Header Board and Conversion Board (Connection Table) ......................................................................16 Revision History MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 17 4 1. 1.1 Product Outline Product Outline This product consists of a header board (referred to as the “header board”) that is used to connect an MCU board (model number: MB2146-301A/303A) that has an evaluation MCU of Cypress 8-bit microcontrollers F2MC-8FX family mounted on it to a user system, and a package product signal line conversion board (referred to as the “conversion board”) for connecting to a target board. An F2MC-8FX evaluation environment can be constructed by combining four products shown in Figure 1-1: the header board, conversion board, MCU board, and BGM adapter (model number: MB2146-09). For more information please visit our following websites: www.cypress.com/documentation/development-kitsboards/mb2146-271 www.cypress.com/documentation/development-kitsboards/mb2146-09a-e www.cypress.com/documentation/development-kitsboards/mb2146-301a-e www.cypress.com/documentation/development-kitsboards/mb2146-303a-e Figure 1-1. System configuration MCU board BGM adapter Header board, Conversion board MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 5 Product Outline 1.2 Product Configuration Table 1-1 lists the product configuration of the header board, and Table 1-2 lists the optional parts. Table 1-1. Product configuration Name Description Header board for the SSOP-30P (0.65mm pitch) package Remarks A board that converts the signal lines of a package product from an MCU board Conversion board for the A package signal line conversion SSOP-30P (0.65mm connector for mounting on the user pitch) package system Capable of purchasing as option individually Model number: SSA-30BK1-M02(from Tokyo Eletech Corporation.) Table 1-2. Optional parts Name BGM adapter (Model number: MB2146-09) MCU board (Model number: MB2146-301A/303A) Description Remarks ICE unit for F2MC-8FX 2 Built-in MB95FV100D-101/103 Built-in F MC-8FX evaluation MCU* * : Several types of evaluation MCUs are available depending on the application and the power supply voltage. Purchase the one that satisfies the service conditions. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 6 2. Checking the Delivered Product Before using the MB2146-271, confirm that the following components are included in the box: ■ SSOP-30P (0.65mm pitch) header board*1 :1 2 ■ Signal line conversion board for SSOP-30P (0.65mm pitch)* :1 ■ Operation manual (English version, this manual) :1 ■ Operation manual (Japanese version) :1 *1: Referred to as the “header board”. *2: Referred to as the “conversion board”. The footprint of a mass-produced MCU is prepared on a user's target board, and it mounts there directly. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 7 3. 3.1 Procedure for Connecting to a User System Connecting 1. Mount the conversion board on the user system. The location of pin 1 of the device is indicated by the cut-away corner of the conversion board. 2. Connect the header board to the user system on which the conversion board is mounted (The connector shape prevents incorrect connections) (See Figure 3-1). Figure 3-1. Connection position (Top view) CN3 2 2 1 CN2 1 CN1 CN2 CN1 Conversion board 120 119 120 119 Header board 3.2 Disconnection When removing the conversion board from the header board, do not apply excessive force to avoid stripping the conversion board from the target board. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 8 4. 4.1 Notes Handling precautions Please take note of the following points to ensure that the header board and conversion board are always used correctly in a suitable environment. ■ Do not apply excessive force to the conversion board mounted on the user system when the header board and conversion board are connected. ■ Take care not to apply excessive force to the conversion board mounted on the user system when connecting or disconnecting the header board and conversion board. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 9 Notes 4.2 Notes on designing 4.2.1 Notes on designing the printed circuit board for the user system When the header board is connected to the user system, parts mounted around the conversion board on the user system may come into contact with the header board if the heights of the parts are too large. To prevent this, design the printed circuit board for the user system such that the components do not exceed the height shown in Figure 4-1. Figure 4-1 shows the dimensions of the header board and conversion board. Figure 4-1. Header board and conversion board dimensions 40.0mm 8.2mm CN3 1 40.0mm CN2 20 CN1 CN2 CN1 2 119 120 20 120 17.5mm 2 1 2 2 Conversion board 119 Header board Approx. 11.0mm Engaged diagram CN3 : Incorrect insertion prevention socket CN1/CN2 : MCU board I/F connector MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 10 Notes 4.2.2 MCU Footprint Design Precautions Figure 4-2 shows the recommended footprint dimensions for the conversion board mounted on the printed circuit board of the user system. Take the footprint in Figure 4-2 into consideration as well as the footprint of the mass-produced MCU when designing the printed circuit board for the user system. Figure 4-2. Recommended footprint dimensions for mounting conversion board 0.65mm × 14 = 9.1mm 9.2 mm 5.6 mm 0.65 mm Pin 1 4.2.3 Notes on Mounting Mass-produced MCUs Unlike previous header boards, this product does not use the YQPACK manufactured by Tokyo Eletech Corporation. As a result, you cannot perform evaluation by mounting a mass-produced MCU on the conversion board. MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 11 5. 5.1 Specifications General Specifications Table 5-1 lists the general specifications of the header board. Table 5-1. General specifications Item Operating temperature and storage temperature Operation: +10°C to +35°C Operating humidity and storage humidity Operation: 35% to 85% External dimensions 5.2 Description Header board Conversion board Storage: Storage: Remarks -10°C to +50°C 35% to 85% No condensation Approximately: 40.0mm × 40.0mm × 8.0mm (The height includes the connector) Approximately: 17.5mm × 8.2mm × 8.0mm (The height includes the connector) Main Parts Table 5-2 lists the main parts of the header board and conversion connector. Table 5-2. Main parts Part MCU board I/F connector (Header board side) Incorrect insertion prevention socket (Header board side) I/F connector between header board and conversion board (Header board side, conversion board side) I/F connector between header board and conversion board (Header board side, conversion board side) Description 120 pins, 0.5mm pitch, 2-piece connector (Straight) × 2 Model number: WR-120SB-VF-N1 (from Japan Aviation Electronics Industry, Ltd.) 2 pins, 2.54mm pitch, 1-piece socket (Straight) Model number: PCW-3-1-1PW (from Mac Eight Co. Ltd.) Socket 20 pins, 0.5mm pitch × 1 each Model number: AXK5S20535 (from Matsushita Electric Works Ltd.) Socket 20 pins, 0.5mm pitch × 1 each Model number: AXK5S20330 (from Matsushita Electric Works Ltd.) MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 12 Specifications 5.3 Function Block Diagram The header board connects to the mass-produced MCU's pin signals via the MCU board I/F connector and the conversion board connected to the target board. The header board does not contain any ICs or other internal components. Figure 5-1 shows the block diagram. Figure 5-1. Function Block Diagram MCU board I/F connector (from Japan Aviation Electronics Industry, Ltd.) Header board I/F connector (from Japan Aviation Electronics Industry, Ltd.) Header board Conversion board I/F connector (from Matsushita Electric Works Ltd.) Conversion board I/F connector (from Matsushita Electric Works Ltd.) Conversion board User target system (Footprint for package) MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 13 Specifications 5.4 MCU Board I/F Connectors (CN1/CN2/CN3) CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of the MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5-3, and the pin assignment of the MCU board I/F connector CN2 is shown in Table 5-4. Table 5-3. Pin assignment of the MCU board I/F connector CN1 Connector pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Evaluation MCU pin number A9 B9 C9 D9 A8 B8 C8 D8 A7 B7 C7 D7 A6 B6 C6 D6 A5 B5 C5 D5 A4 A3 A2 A1 B4 B3 B2 B1 C4 C3 C2 C1 D4 D3 D2 D1 E4 E3 Signal name PC4 PC1 PC2 PC3 PC0 PB4 PB5 PB6 PB7 PB2 PB0 PB1 PB3 PA2 P95 PA0 PA3 P94 P90 P91 PA1 P93 GND GND CSVENX Vss P92 TCLK LVCC LVDIN Cpin Vcc51 LVDENX2 LVR4 TESTO LVDOUT LVR2 BGOENX LVR1 LVR0 Connector pin number 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Evaluation MCU pin number E2 E1 F4 F3 F2 F1 G4 G3 G2 G1 H4 H3 H2 H1 J4 J3 J2 J1 K1 K2 K3 K4 L1 L2 L3 L4 M1 M2 M3 M4 N1 N2 N3 N4 P1 P2 Signal name LVR3 LVSS LVDREXT LVDBGR LVDENX P22A GND GND P20A NC1 P21A P23A P24A P25A P26A P27A P24B P50 P23B P51 P52 P55 P54 P53 P70 P74 P73 P72 P71 P76 P80 P77 GND GND P75 P82 PG0 P84 P81 ROMS0 Connector pin number 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 Evaluation MCU pin number P3 P4 R1 R2 R3 R4 T1 T2 T3 T4 U1 U2 U3 U4 V1 V2 V3 V4 R5 T5 U5 V5 R6 T6 U6 V6 R7 T7 U7 V7 R8 T8 U8 V8 R9 T9 U9 V9 Signal name BSOUT BDBMX P83 BRSTX X0A RSTX ROMS1 BSIN Vss X0 BEXCK X1 MOD PF2 X1A Vcc53 GND GND PINT0 PSEL_EXT PF1 PF0 NC2 PENABLE APBENX PINT1 PCLK PADDR0 PACTIVE PLOCK PWRITE PADDR1 PADDR2 PADDR3 PADDR4 PADDR5 PADDR7 PRDATA0 PADDR6 PRDATA1 MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 14 Specifications Table 5-4. Pin assignment of the MCU board I/F connector CN2 Connector pin number Evaluation MCU pin number Signal name Connector pin number Evaluation MCU pin number 1 A10 PC5 41 E17 NC4 81 P16 P34 2 B10 PD0 42 E18 SEL0 82 P15 P35 3 C10 PC6 43 F15 SEL3 83 R18 P44 4 D10 PC7 44 F16 SEL4 84 R17 P36 Signal name Connector pin number Evaluation MCU pin number Signal name 5 A11 PD1 45 F17 SEL1 85 R16 P31 6 B11 PD2 46 F18 P04C 86 R15 AVcc3 7 C11 PD3 47 GND 87 T18 P40 8 D11 PD4 48 GND 88 T17 P32 9 A12 PD5 49 G15 P06C 89 T16 AVss 10 B12 PD7 50 G16 P07C 90 T15 AVR 11 C12 P61 51 G17 P05C 91 U18 P33 12 D12 P60 52 G18 P00C 92 U17 P30 13 A13 PD6 53 H15 P01C 93 U16 AVR3 14 B13 P64 54 H16 P02C 94 U15 P15 15 C13 P66 55 H17 P03C 95 V18 AVcc 16 D13 P65 56 H18 P07A 96 V17 DA0 17 A14 P62 57 J15 P04A 97 GND 18 B14 PE0A 58 J16 P05A 98 GND 19 C14 PE3A 59 J17 P06A 99 V16 P14 20 D14 PE2A 60 J18 P03A 100 V15 P10 21 A15 P63 61 K18 P02A 101 R14 P16 22 A16 P67 62 K17 P07B 102 T14 DA1 23 GND 63 K16 P01A 103 U14 P13 24 GND 64 K15 P00A 104 V14 PWDATA7 25 A17 PE4A 65 L18 P06B 105 R13 P11 26 A18 Vcc54 66 L17 P05B 106 T13 P12 27 B15 PE1A 67 L16 P04B 107 U13 NC3 28 B16 PE5A 68 L15 P03B 108 V13 PWDATA3 29 B17 PE7A 69 M18 P02B 109 R12 PWDATA5 30 B18 PE3B 70 M17 P00B 110 T12 PWDATA6 31 C15 PE6A 71 M16 P46 111 U12 PWDATA4 32 C16 Vss 72 M15 P47 112 V12 PRDATA7 33 C17 PE2B 73 GND 113 R11 PWDATA0 34 C18 PE7B 74 GND 114 T11 PWDATA1 35 D15 PE1B 75 N18 P01B 115 U11 PWDATA2 36 D16 PE0B 76 N17 P43 116 V11 PRDATA6 37 D17 PE6B 77 N16 P41 117 R10 PRDATA3 38 D18 SEL2 78 N15 P42 118 T10 PRDATA4 39 E15 PE5B 79 P18 P45 119 U10 PRDATA5 40 E16 PE4B 80 P17 P37 120 V10 PRDATA2 MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 15 Specifications 5.5 Pin Assignments for I/F between Header Board and Conversion Board (Connection Table) Table 5-5 lists the pin assignments for the interface between the header board and conversion board. Table 5-5. Pin assignments (connection table) Conversion board edge face through hole part Matsushita Electric Works Ltd. connector part (Conversion board/header board) Japan Aviation Electronics Industry Ltd. connector part (Header board) 1 CN1- 2 CN2- 101 2 CN1- 6 CN1- 102 3 CN1- 4 CN1- 101 4 CN1- 1 CN1- 93 5 CN1- 5 CN1- 90 6 CN1- 7 CN1- 92 7 CN1- 3, CN1- 8, CN1- 16, CN2- 8, CN2- 16 CN1- 89 VSS CN1- 96 VCC 8 CN2- 19 9 CN2- 15 CN1- 77 10 CN2- 13 CN1- 95 11 CN2- 17 CN1- 85 12 CN2- 20 CN1- 86 13 CN2- 14 CN2- 95 14 CN2- 18 CN2- 89 15 CN2- 2 CN2- 70 16 CN2- 6 CN2- 75 17 CN2- 4 CN2- 69 18 CN2- 1 CN2- 68 19 - - 20 CN2- 5 CN2- 67 21 CN2- 7 CN2- 66 22 CN2- 3 CN2- 65 23 CN1- 19 CN2- 62 24 CN1- 15 CN2- 100 25 CN1- 13 CN2- 105 26 - - 27 CN1- 17 CN2- 106 28 CN1- 20 CN2- 103 29 CN1- 14 CN2- 99 30 CN1- 18 CN2- 94 Remarks MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 16 Revision History Document Revision Document Title: MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide Document Number: 002-07494 Revision ** *A ECN# Issue Date Origin of Change Description of Change 08/06/2007 HUAL Initial release 5287117 06/01/2016 HUAL Migrated Spansion Guide from SS01-26025-1E to Cypress format MB2146-271 F2MC-8FX Family SSOP-30P (0.65mm pitch) Header Board Operation Guide, Doc. # 002-07494 Rev. *A 17