F2MC-8FX FAMILY LQFP-52P(0.65mm Pitch)HEADER BOARD MB2146-260 OPERATION MANUAL

The following document contains information on Cypress products.
FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-26014-1E
F2MC-8FX Family
LQFP-52P (0.65 mm pitch) HEADER BOARD
MB2146-260
OPERATION MANUAL
PREFACE
Thank you for purchasing the LQFP-52P (0.65 mm pitch) * 1 header board (model number :
MB2146-260) for the F2MC *2 -8FX family.
MB2146-260 is a header board used to connect the MCU board (model number : MB2146-301,
MB2146-303) which mounts the F2MC-8FX family evaluation MCU to a user system.
This manual explains the handling of the MB2146-260. Before using MB2146-260, be sure to read
this manual.
Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-produced MCUs and evaluation MCUs which correspond on MB2146-260.
*1 : The lead pitch of package (FPT-52P-M01) is 0.65 mm and the body size is 10 mm × 10 mm.
*2 : F2MC is the abbreviation used for FUJITSU Flexible Microcontroller.
■ Caution of the products described in this document
The following precautions apply to the product described in this manual.
CAUTION
The wrong use of a device will give an injury and may cause malfunction on customers system.
Cuts
This product has parts with sharp points that are exposed.
Do not touch an edge of the product with your bare hands.
Damage
When connecting the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1)
on the header board, otherwise the MCU board and user system might be damaged.
Damage
When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.
i
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
Copyright ©2006 FUJITSU LIMITED All rights reserved
ii
1. Product Outline
■ Product outline
MB2146-260 is a header board (referred to as header board) used to connect the MCU board (model
number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F2MC-8FX family
of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment,
combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapter (model number : MB2146-09).
㪤㪙㪉㪈㪋㪍㪄㪇㪐
MCU board
BGM adapter
Header board
Figure 1 System Configuration
■ Product configuration
Table 1 lists the product configuration in the header board, and Table 2 lists options.
Table 1 Product Cofiguration
Name
Description
Remarks
F2MC-8FX
LQFP-52P (0.65 mm pitch)
header board
[Model number : MB2146-260]
Connector/LQFP52pin
(0.65 mm pitch) Package conversion
[Model number : YQPACK052SB]
(Tokyo Eletech Corporation)
I/F between header board and NQPACK
Accessory (connected)
[Model number : NQPACK052SB]
(Tokyo Eletech Corporation)
For mounted on user system
Accessory
[Model number : HQPACK052SB]
(Tokyo Eletech Corporation)
Used when mounting mass production MCU
Accessory
to NQPACK.
-
Table 2 Options
Name
Description
Remarks
BGM adapter
[Model number : MB2146-09]
ICE unit for F2MC-8FX
MCU board
[Model number : MB2146-301, MB2146-303]
Built-in MB95FV100B-101,
Built-in F2MC-8FX evaluation MCU *
MB95FV100B-103
*:
-
Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies
the service conditions.
1
2. Checking the Delivered Product
Before using the MB2146-260, confirm that the following components are included
in the box:
:1
• LQFP-52P (0.65 mm pitch) header board *1
• Screws for securing header board (M2 × 10 mm, 0.4 mm pitch)
:4
2
:1
• NQPACK052SB *
:1
• HQPACK052SB *3
• Operation manual (English version, this manual)
:1
*1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts
YQPACK052SB.
*2 : IC socket manufactured by Tokyo Eletech Coporation, referred to as “NQPACK”, is supplied
with a special screwdriver and 2 guide pins. A socket offering higher reliability,
NQPACK052SB-SL (manufactured by Tokyo Eletech Corporation and sold separately) , can
be used by making an IC socket mounting hole on the user system board. For more information,
contact Tokyo Eletech Corporation.
*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, is
supplied with 4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) .
3. Handling Precautions
The header board is precision-manufactured to improve the dimensional accuracy and to ensure a
reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct
use of the header board in the proper environment, observe the following:
• Avoid placing a stress on the NQPACK mounted on the user system board when connecting
the header board.
2
4. Notes on Designing
■ Notes on designing printed circuit board for the user system
When the header board is connected to the user system, some part mounted around the NQPACK in
the user system may be contacting the header board if the height of the part is tall. To prevent this,
design the printed circuit board for the user system so that the components do not exceed the height
shown in Figure 2. Figure 2 shows the dimension figure of the header board.
PCW-1-1-1PW
:MAC EIGHT
40.0 mm
30.0 mm
㪈
㪈
㪉
㪚㪥㪈
40.0 mm
㪚㪥㪉
㪉
㪚㪥㪊
㪬㪈
㪈㪈㪐
㪈㪉㪇
㪈㪈㪐
㪈㪉㪇
WR-120SB-VF-N1 : JAE *2
Approximately
13.0 mm *1
WR-120SB-VF-N1 : JAE *2
YQPACK052SB
:Tokyo Eletech Corporation
NQPACK052SB
:Tokyo Eletech Corporation
User system
U1:
CN3:
CN1/CN2:
User system I/F connector
Incorrect insertion prevention socket
MCU board I/F connector
*1 : The height differs slightly depending on how the YQPACK and NQPACK are engaged.
*2 : Japan Aviation Electronics Industry, Limited
Figure 2 Header Board Dimensions
3
■ MCU footprint design notes
Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed circuit board for the user system. Take the footprint in Figure 3 into consideration as well as the footprint of the mass production MCU when designing the printed circuit board for the user system.
To follow the most updated information, be sure to contact Tokyo Eletech Corporation whenever designing the printed circuit board.
0.4 mm
2.0 mm
0.65 mm
Figure 3 Recommended Footprint Dimensions for Mounting the NQPACK
4
13.0 mm
9.0 mm
No.1 Pin
5. Connecting to the User System
■ Connecting
Mount the supplied NQPACK on the user system before using the MB2146-260.
27
13
52
14
40
26
39
1
1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on
the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut
linearly at one place only in silk screen) on the header board and then insert it (see “Figure 4”) .
The pins of YQPACK are thin and easy to bend. Insert NQPACK after confirming that the pins
of YQPACK are not bent.
NQPACK index mark
Header board index mark
Figure 4 Index Position
2. Insert each screw for securing the header board into each of the four tapped holes on the header
board, and then tighten the screws diagonally. The center screw hole is not used. To tighten the
screws, use the special screwdriver supplied with the NQPACK to equally tighten the four screws
in sequence. Tightening the screws too tight might result in a defective contact.
3. Connect the MCU board to the header board while being careful not to excessively force the NQPACK. The MCU board can be connected to the header board only in the correct orientation as
they have an incorrect insertion prevention header socket to prevent a reverse connection. Figure
5 illustrates how the MCU board, header board, NQPACK, and user system are connected together.
5
MCU board
Evaluation
MCU
MCU board
Screws for securing
header board
Header board
Connected
at shipment
YQPACK
NQPACK
User system
Figure 5 Connecting MCU Board/Header Board to User System
■ Disconnection
1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not
excessively forcing the junction with the NQPACK.
2. Remove all of the four screws from the header board. Pull out the header board vertically from
the NQPACK. Remove the header board slowly not excessively forcing the junction with the
NQPACK.
6
6. Mounting Mass Production MCUs
■ Mounting
To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover)
(see “Figure 6”) .
1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the
index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one
place only) .
The pins of HQPACK are thin and easy to bend. Insert NQPACK after confirming that pins of
HQPACK are not bent.
3. Insert each screw for securing HQPACK in each of four tapped holes on the HQPACK, and then
tighten the screws diagonally. To tighten the screws, use the special screwdriver supplied with
the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight
might result in a defective contact.
Screws for securing HQPACK
HQPACK
Mass production MCU
NQPACK
User system
Figure 6 Mounting a Mass Production MCU
■ Disconnection
To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from
the NQPACK. When taking out the mass production MCU, absorb the mass production MCU using
a vacuum pick-up tool special for removing IC. Do not attempt to remove the mass production MCU
forcibly, for example, using a screwdriver to do so can bend the pins of the mass production MCU
or break the NQPACK.
7
7. Product Specifications
■ General specifications
Table 3 lists the general specifications of the header board.
Table 3 General Specifications
Item
Description
Operating temperature and storage temperature
5 °C to 35 °C (operation) , 0 °C to 40 °C (storage)
Operating humidity and storage humidity
20 % to 80 % (operation) , 20 % to 80 % (storage)
Dimensions
Approximately 40 mm × 40 mm × 16 mm
(Height contains that of YQPACK and NQPACK)
■ Main part
The main part of a header board is shown in Table 4.
Table 4 Main Part
Name
Description
MCU board I/F connector
120 pin, 0.5 mm pitch, 2-piece connector
(straight) × 2
[Model number : WR-120SB-VF-N1
(from Japan Aviation Electronics Industry, Limited) ]
Incorrect insertion prevention socket
2 pin, 2.54 mm pitch, 1-piece socket
(Straight)
[Model number : PCW-1-1-1PW (from MAC EIGHT) ]
User target system I/F connector
Socket
52 pin, 0.65 mm pitch
[Model number : YQPACK052SB (from Tokyo Eletech Corporation) ]
■ Functional block diagram
A header board performs socket conversion between the MCU board I/F connector and YQPACK.
The header board does not contain any component such as an IC internally. Figure 7 shows the block
diagram.
MCU board I/F connector
User target system I/F connector
(Socket for package)
Figure 7 Functional Block Diagram
8
■ MCU board I/F connector (CN1, CN2, and CN3)
CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a
MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the
pin assignment of the MCU board I/F connector CN2 is shown in Table 6.
Table 5 Pin Assignment of the MCU Board I/F Connector CN1
Connector Evaluation
MCU Pin
Pin
Number
Number
Signal
name
Connector Evaluation
MCU Pin
Pin
Number
Number
Signal
name
Connector Evaluation
MCU Pin
Pin
Number
Number
Signal
name
1
A9
PC4
41
E2
LVR3
81
P3
BSOUT
2
B9
PC1
42
E1
LVSS
82
P4
BDBMX
3
C9
PC2
43
F4
LVDREXT
83
R1
P83
4
D9
PC3
44
F3
LVDBGR
84
R2
BRSTX
5
A8
PC0
45
F2
LVDENX
85
R3
X0A
6
B8
PB4
46
F1
P22A
86
R4
RSTX
7
C8
PB5
47
-
GND
87
T1
ROMS1
8
D8
PB6
48
-
GND
88
T2
BSIN
9
A7
PB7
49
G4
P20A
89
T3
Vss
10
B7
PB2
50
G3
NC1
90
T4
X0
11
C7
PB0
51
G2
P21A
91
U1
BEXCK
12
D7
PB1
52
G1
P23A
92
U2
X1
13
A6
PB3
53
H4
P24A
93
U3
MOD
14
B6
PA2
54
H3
P25A
94
U4
PF2
15
C6
P95
55
H2
P26A
95
V1
X1A
16
D6
PA0
56
H1
P27A
96
V2
Vcc53
17
A5
PA3
57
J4
P24B
97
-
GND
18
B5
P94
58
J3
P50
98
-
GND
19
C5
P90
59
J2
P23B
99
V3
PINT0
20
D5
P91
60
J1
P51
100
V4
PSEL_EXT
21
A4
PA1
61
K1
P52
101
R5
PF1
22
A3
P93
62
K2
P55
102
T5
PF0
23
-
GND
63
K3
P54
103
U5
NC2
24
-
GND
64
K4
P53
104
V5
PENABLE
25
A2
CSVENX
65
L1
P70
105
R6
APBENX
26
A1
Vss
66
L2
P74
106
T6
PINT1
27
B4
P92
67
L3
P73
107
U6
PCLK
28
B3
TCLK
68
L4
P72
108
V6
PADDR0
29
B2
LVCC
69
M1
P71
109
R7
PACTIVE
30
B1
LVDIN
70
M2
P76
110
T7
PLOCK
31
C4
Cpin
71
M3
P80
111
U7
PWRITE
32
C3
Vcc51
72
M4
P77
112
V7
PADDR1
33
C2
LVDENX2
73
-
GND
113
R8
PADDR2
34
C1
LVR4
74
-
GND
114
T8
PADDR3
35
D4
TESTO
75
N1
P75
115
U8
PADDR4
36
D3
LVDOUT
76
N2
P82
116
V8
PADDR5
37
D2
LVR2
77
N3
PG0
117
R9
PADDR7
38
D1
BGOENX
78
N4
P84
118
T9
PRDATA0
39
E4
LVR1
79
P1
P81
119
U9
PADDR6
40
E3
LVR0
80
P2
ROMS0
120
V9
PRDATA1
9
Table 6 Pin Assignment of the MCU Board I/F Connector CN2
Connector Evaluation
MCU Pin
Pin
Number
Number
10
Signal
name
Connector Evaluation
MCU Pin
Pin
Number
Number
Signal
name
Connector Evaluation
MCU Pin
Pin
Number
Number
Signal
name
1
A10
PC5
41
E17
NC4
81
P16
P34
2
B10
PD0
42
E18
SEL0
82
P15
P35
3
C10
PC6
43
F15
SEL3
83
R18
P44
4
D10
PC7
44
F16
SEL4
84
R17
P36
5
A11
PD1
45
F17
SEL1
85
R16
P31
6
B11
PD2
46
F18
P04C
86
R15
AVcc3
7
C11
PD3
47
-
GND
87
T18
P40
8
D11
PD4
48
-
GND
88
T17
P32
9
A12
PD5
49
G15
P06C
89
T16
AVss
10
B12
PD7
50
G16
P07C
90
T15
AVR
11
C12
P61
51
G17
P05C
91
U18
P33
12
D12
P60
52
G18
P00C
92
U17
P30
13
A13
PD6
53
H15
P01C
93
U16
AVR3
14
B13
P64
54
H16
P02C
94
U15
P15
15
C13
P66
55
H17
P03C
95
V18
AVcc
16
D13
P65
56
H18
P07A
96
V17
DA0
17
A14
P62
57
J15
P04A
97
-
GND
18
B14
PE0A
58
J16
P05A
98
-
GND
19
C14
PE3A
59
J17
P06A
99
V16
P14
20
D14
PE2A
60
J18
P03A
100
V15
P10
21
A15
P63
61
K18
P02A
101
R14
P16
22
A16
P67
62
K17
P07B
102
T14
DA1
23
-
GND
63
K16
P01A
103
U14
P13
24
-
GND
64
K15
P00A
104
V14
PWDATA7
25
A17
PE4A
65
L18
P06B
105
R13
P11
26
A18
Vcc54
66
L17
P05B
106
T13
P12
27
B15
PE1A
67
L16
P04B
107
U13
NC3
28
B16
PE5A
68
L15
P03B
108
V13
PWDATA3
29
B17
PE7A
69
M18
P02B
109
R12
PWDATA5
30
B18
PE3B
70
M17
P00B
110
T12
PWDATA6
31
C15
PE6A
71
M16
P46
111
U12
PWDATA4
32
C16
Vss
72
M15
P47
112
V12
PRDATA7
33
C17
PE2B
73
-
GND
113
R11
PWDATA0
34
C18
PE7B
74
-
GND
114
T11
PWDATA1
35
D15
PE1B
75
N18
P01B
115
U11
PWDATA2
36
D16
PE0B
76
N17
P43
116
V11
PRDATA6
37
D17
PE6B
77
N16
P41
117
R10
PRDATA3
38
D18
SEL2
78
N15
P42
118
T10
PRDATA4
39
E15
PE5B
79
P18
P45
119
U10
PRDATA5
40
E16
PE4B
80
P17
P37
120
V10
PRDATA2
■ User system I/F YQPACK (U1)
The pin assignment of the user system I/F YQPACK in the header board is shown in Table 7.
Table 7 Pin Assignment of the User System I/F YQPACK in Header Board
Connector
Pin Number
Signal name
Connector
Pin Number
Signal name
1
P65/SCK
27
VCC
2
P66/SOT
28
Cpin
3
P67/SIN
29
X1A/PG2
4
P37/AN07
30
X0A/PG1
5
P36/AN06
31
RSTX
6
P35/AN05
32
P00/INT00/HC00
7
NC
33
NC
8
P34/AN04
34
P01/INT01/HC01
9
P33/AN03
35
P02/INT02/HC02
10
P32/AN02
36
P03/INT03/HC03
11
P31/AN01
37
P04/INT04/HC04
12
P30/AN00
38
P05/INT05/HC05
13
AVSS
39
P06/INT06/HC06
14
AVCC
40
P07/INT07/HC07
15
P24/EC0
41
P10/UI0
16
P23/TO01
42
P11/UO0
17
P22/TO00
43
P12/UCK0
18
P21/PPG01
44
P13/TRG0/ADTG
19
P20/PPG00
45
P14/PPG0
20
NC
46
NC
21
P51/SDA0
47
P15
22
P50/SCL0
48
P60/PPG10
23
MOD
49
P61/PPG11
24
X0
50
P62/TO10
25
X1
51
P63/TO11
26
VSS
52
P64/EC1
11
SS01-26014-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
F2MC-8FX Family
LQFP-52P (0.65 mm pitch) HEADER BOARD
MB2146-260
OPERATION MANUAL
April 2006 the first edition
Published FUJITSU LIMITED Electronic Devices
Edited
Business Promotion Dept.
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