April 2009 LTM9002 108LD 15.00mm X 11.25mm X 2.32mm (TABLE OF MATERIAL DECLARATION) The LTM9002 is RoHS compliant per EU RoHS Directive 2003/95/EC. No. 1 2 3 4 5 6 7 6 Note: It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Material Mass Materials Analysis Component Weight Materials Analysis (element) CAS Number Part Name Material Name (gram) (gram) (weight %) Barium Compounds 7727-43-7 0.00262 1.50000 Substrate Circuit Board 0.1748 Filler Substances (Silica 0.06976 39.91457 Crystalline) Copper Metal 7440-50-8 0.09788 56.00000 Copper Compounds 1328-53-6 0.00003 0.01800 Ecotoxic substances 7439-92-1 0.00000 0.00043 Gold metal or alloy 7440-57-5 0.00080 0.46000 Nickel 7440-02-0 0.00367 2.10000 Zinc 7440-66-6 0.00001 0.00700 Solder Paste Alloy 0.0148 Sn 7440-31-5 0.01408 95.00000 Sb 7440-36-0 0.00074 5.00000 Die attach Epoxy Resin 0.0053 epoxy _ 0.00530 100.00000 adhesive Passive/Active 0.0623 Capacitor 0.05564 89.30188 Components Resistor 0.00667 10.70294 Inductor 0.00000 0.00000 Diode 0.00000 0.00000 Active Ics Silicon 0.0062 Silicon 7440-21-3 0.00624 100.00000 Wire Gold 0.0020 Au 7440-57-5 0.00204 99.99000 LTC6400IUD-8 see LTC web site for 0.0409 see LTC website _ 0.04090 Encapsulation Epoxy Resin 0.6247 Fused Silica 60676-86-0 0.48227 77.20000 Epoxy Resin 0.05560 8.90000 Phenol Resin 0.05560 8.90000 Crytalline Silica 14808-60-7 0.01874 3.00000 Carbon Black 1333-86-4 0.00312 0.50000 Metal Hydroxide 0.00937 1.50000 Total Package Weight 0.9311 Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts