SO 24 SOT137-1 plastic small outline package; 24 leads; body width 7.5 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SO24 Package type industry code SO24 Package style descriptive code SO (small outline) Package style suffix code NA (not applicable) Package body material type P (plastic) IEC package outline code 075E05 JEDEC package outline code MS-013 Mounting method type S (surface mount) Issue date 19-2-2003 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 15.2 - 15.3 15.6 mm E package width 7.4 - 7.5 7.6 mm A seated height [tbd] - 2.65 2.65 mm A2 package height 2.25 - 2.35 2.45 mm e nominal pitch - - 1.27 - mm n2 actual quantity of termination - - 24 - SOT137-1 NXP Semiconductors plastic small outline package; 24 leads; body width 7.5 mm 2. Package outline SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 D E A X c HE y v M A Z 24 13 Q A2 A (A 3 ) A1 pin 1 index θ Lp L 1 12 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.019 0.013 0.014 0.009 0.61 0.60 0.30 0.29 0.05 0.419 0.043 0.043 0.055 0.394 0.016 0.039 inches 0.1 0.012 0.096 0.004 0.089 0.01 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT137-1 075E05 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig. 1. Package outline SO24 (SOT137-1) SOT137-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/6 SOT137-1 NXP Semiconductors plastic small outline package; 24 leads; body width 7.5 mm 3. Soldering Footprint information for reflow soldering of SO24 package SOT137-1 Hx Gx P2 (0.125) Hy (0.125) Gy By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 1.270 P2 Ay 1.320 11.200 By C D1 D2 6.400 2.400 0.700 Gx 0.800 15.120 Gy Hx Hy 8.600 17.000 11.450 sot137-1_fr Fig. 2. Reflow soldering footprint for SO24 (SOT137-1) SOT137-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/6 SOT137-1 NXP Semiconductors plastic small outline package; 24 leads; body width 7.5 mm enlarged solder land solder lands C 0.3 1.20 B solder resist A F occupied area board direction 0.60 G 1.27((N- 2)x) MLC745 Fig. 3. Wave soldering footprint for SO24 (SOT137-1) SOT137-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/6 SOT137-1 NXP Semiconductors plastic small outline package; 24 leads; body width 7.5 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT137-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/6 SOT137-1 NXP Semiconductors plastic small outline package; 24 leads; body width 7.5 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 5 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT137-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 6/6