Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC17XS6500EKR2 ESOIC 32 7.5*11*2.3 P.65 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-03-02 00A0K00184D021A1.11 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e3 MC17XS6500EKR2 ESOIC 32 7.5*11*2.3 P.65 ALL 0.482800 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Encapsulant 0.3327 Die Encapsulant Plastics/polymers 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl digycidyl ether 85954-11-6 0.00514354 g Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00060518 g Die Encapsulant Metals Magnesium dihydroxide 1309-42-8 0.01193395 Die Encapsulant Solvents, additives, and other materials Proprietary Material-Other organic phosphorous compounds - Die Encapsulant Plastics/polymers 1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol Die Encapsulant Plastics/polymers Die Encapsulant Glass Die Encapsulant Die Encapsulant Bonding Wire, Aluminum SubstanceWeight SubPart% ARTICLEPPM ARTICLE% UoM SubPart PPM 15460 1.546 10653 1.0653 1819 0.1819 1253 0.1253 g 35870 3.587 24718 2.4718 0.00026383 g 793 0.0793 546 0.0546 25917-04-8 0.00105166 g 3161 0.3161 2178 0.2178 Phenol p-xylylene dimethyl ether copolymer 26834-02-6 0.01209265 g 36347 3.6347 25046 2.5046 Silica, vitreous 60676-86-0 0.28406127 g 853806 85.3806 588381 58.8381 Metals Zinc Hydroxide 20427-58-1 0.00554677 g 16672 1.6672 11488 1.1488 Plastics/polymers Proprietary Material-Other Non-halogenated Epoxy resins - 0.01200115 g 36072 3.6072 24857 2.4857 1000000 100 26304 2.6304 g 0.0127 Bonding Wire, Aluminum Lead Frame Plating Exemption g Metals Aluminum, metal 7429-90-5 0.0127 0.0162 g g Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.00000324 g 200 0.02 6 0.0006 Lead Frame Plating Metals Tin, metal 7440-31-5 0.01619676 g 999800 99.98 33547 3.3547 1000000 100 2899 0.2899 Bonding Wire 0.0014 Bonding Wire Epoxy Die Attach g Metals Gold, metal 7440-57-5 0.0014 0.0016 g g Epoxy Die Attach Metals Aluminum Oxides (Al2O3) 1344-28-1 0.0010176 g 636000 63.6 2107 0.2107 Epoxy Die Attach Biocides Boric acid 10043-35-3 0 g 0 0 0 0 Epoxy Die Attach Metals Boron oxide 1303-86-2 0 g 0 0 0 0 Epoxy Die Attach Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00004 g 25000 2.5 82 0.0082 Epoxy Die Attach Solvents, additives, and other materials Other Bismaleimides - 0.00008096 g 50600 5.06 167 0.0167 Epoxy Die Attach Solvents, additives, and other materials Toluene 108-88-3 0 g 0 0 0 0 Epoxy Die Attach Metals Copper phthalocyanine 147-14-8 0.00000064 g 400 0.04 1 0.0001 Epoxy Die Attach Solvents, additives, and other materials Boron nitride 10043-11-5 0.0002208 g 138000 13.8 457 0.0457 Epoxy Die Attach Solvents, additives, and other materials Triethylamine 121-44-8 0 g 0 0 0 0 Epoxy Die Attach Solvents, additives, and other materials Isobornyl acrylate 5888-33-5 0.00024 g 150000 15 497 0.0497 Copper Lead Frame 0.1128 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.10873412 g 963955 96.3955 225215 22.5215 Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00009306 g 825 0.0825 192 0.0192 Copper Lead Frame Metals Iron, metal 7439-89-6 0.0026508 g 23500 2.35 5490 0.549 Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.00001918 g 170 0.017 39 0.0039 Copper Lead Frame Metals Silver, metal 7440-22-4 0.001128 g 10000 1 2336 0.2336 Copper Lead Frame Metals Tin, metal 7440-31-5 0.00003384 g 300 0.03 70 0.007 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.000141 g 1250 0.125 292 0.0292 Epoxy Die Attach 0.0016 g Epoxy Die Attach Metals Silver, metal 7440-22-4 0.001216 g 760000 76 2518 0.2518 Epoxy Die Attach Plastics/polymers Other Non-halogenated Epoxy resins - 0.0000697 g 43560 4.356 144 0.0144 Epoxy Die Attach Solvents, additives, and other materials Polymethylene polyphenyl isocyanate (PAPI) 9016-87-9 0.00000816 g 5100 0.51 16 0.0016 Epoxy Die Attach Metals Dibutyltin dilaurate 77-58-7 0.00000054 g 340 0.034 1 0.0001 Epoxy Die Attach Solvents, additives, and other materials Alkanes, C14-16 90622-46-1 0.000224 g 140000 14 463 0.0463 Epoxy Die Attach Plastics/polymers 1,3-Benzenedicarboxylic acid, polymer with 1,4benzenedicarboxylic acid, 1,4-butanediol and hexanedi 66027-02-9 0.0000816 g 51000 5.1 169 0.0169 Silicon Semiconductor Die 0.0019 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000038 g 20000 2 78 0.0078 Silicon Semiconductor Die Glass Silicon, doped - 0.001862 g 980000 98 3856 0.3856 Silicon Semiconductor Die 0.0019 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000038 g 20000 2 78 0.0078 Silicon Semiconductor Die Glass Silicon, doped - 0.001862 g 980000 98 3856 0.3856 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC17XS6500EKR2_IPC1752_v11.xml http://www.freescale.com/mcds/MC17XS6500EKR2_IPC1752A.xml