FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16550 Generic Copy Issue Date: 07-Dec-2010 TITLE: Final Notification for Transfer of PS5LV Analog Integrated Circuits Die Manufacturing from ON Semiconductor Piestany (Slovakia) to the I2T100 Process at ON Semiconductor Oudenaarde (Belgium) PROPOSED FIRST SHIP DATE: 15-Mar-2011 AFFECTED CHANGE CATEGORY(S): ON Semiconductor Wafer Fab Site FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Jan Polfliet < [email protected] > SAMPLES: Contact your local ON Semiconductor Sales Office ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Peter Turlo < [email protected] > NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: The transfer and qualification of die manufactured on the Power Sense 5 LV process from the ON Semiconductor Piestany facility (Slovakia) to the I2T100 process at ON Semiconductor Oudenaarde facility (Belgium) The Oudenaarde site is certified according to ISO/TS16949 standards. A full electrical characterization over the temperature range has been performed for each product to check the device functionality and electrical specifications. Qualification tests are designed to show that the reliability of transferred devices will continue to meet or exceed ON Semiconductor standards. ON Semiconductor recommends that customers evaluate sample units in each associated application circuit to ensure there are no unexpected electrical incompatibilities. Issue Date: 07-Dec-2010 Rev. 06-Jan-2010 Page 1 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16550 RELIABILITY DATA SUMMARY: Results Test PC HAST AC Test Conditions High Temperature Operational Life: (Test @ R/H) Tj=150°C for 504hrs. Lots/SS all 3 / 77 3 / 80 3 / 80 1 / 80 3 / 80 Wire Bond Shear Test: Cpk >1.33 30bonds Wire Bond Pull: >2.5gr. Condition C. 0 fails or Cpk>1.33. 30bonds Preconditioning: (Test @ R/H) SMD only; Moisture Load and Reflow Highly Acc. Stress Test: (Test @ R/H) 130°C/85%RH,18.8psi, bias, 96hrs Autoclave: (Test @ R) 121°C/100% RH, 15 psi for 96 hrs TC HTSL HTOL WBS WBP SD PD Temperature Cycle: (Test @ H) -65°C to+150°C; for 500cyc HBM MM CDM LU ED Electrostatic Discharge, Human Body Model (Test @ R/H) Electrostatic Discharge, Machine Model (Test @ R/H) High Temperature Storage Life (Test @ R/H) Ta=175°C for 500 hrs. Solderability, 8hr steam age, 245°C PbSn solder, >95% coverage Physical Dimension Electrostatic Discharge, Charge Device Model: (Test @ R/H) Latch-up: (Test @ R/H) Electrical Distribution: (Test @ C/ R/ H) 1 / 15 3 / 10 0 / all 0 / 231 0 / 240 0 / 240 0 / 80 0 / 240 0 / 30 0 / 30 0 / 15 0 / 30 Comments/ Test Results For AC, TC, HAST(MSL= 3 @ 260°C) Pass. Pass. Pass. Pass. Pass. Cpk>1.33 Pass. Pass Cpk>1.33 1 / spec 1 / spec 1/6 4 / 30 >>> >>> 0/6 >>> HBM - Pass 4.0kV. MM - Pass 200V CDM - Pass 1kV All pins Pass. Class II, Level A, Trig I +/-100mA Pass. Cpk > 1.67 Fail/Total CHANGED PART IDENTIFICATION: A letter “B” will be added to the package marking to identify parts from the new wafer fab. Issue Date: 07-Dec-2010 Rev. 06-Jan-2010 Page 2 of 3 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16550 List of affected General Parts: Replacement Parts: NCV7513FTG NCV7513FTR2G NCV7517FTG NCV7517FTR2G NCV7513BFTR2G NCV7513BFTR2G NCV7517BFTR2G NCV7517BFTR2G Issue Date: 07-Dec-2010 Rev. 06-Jan-2010 Page 3 of 3