Final Product/Process Change Notification Document # : FPCN20776Z Issue Date: 24 November 2015 Title of Change: Final Notification of the Transfer to ASE-SH (Shanghai) Assembly of the 32 Lead of Low Profile Quad Flat Package (LQFP). Proposed first ship date: 24 November 2016 Contact information: Contact your local ON Semiconductor Sales Office or <[email protected]> Samples: Contact your local ON Semiconductor Sales Office Additional Reliability Data: Contact your local ON Semiconductor Sales Office or <[email protected]> Type of notification: This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 12 months prior to implementation of the change. ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. Change Part Identification: Products built in ASE-SH will have datecode marking ASWLYYWW while products built in Unisem will have datecode 5WLYYWW Change category: Wafer Fab Change Change Sub-Category(s): Manufacturing Site Change/Addition Manufacturing Process Change Assembly Change Material Change Product specific change Test Change Other _______________ Datasheet/Product Doc change Shipping/Packaging/Marking Other: _______________________ Sites Affected: All site(s) not applicable ON Semiconductor site(s) : External Foundry/Subcon site(s) Unisem Batam – ON ASE Assembly & Test (Shanghai) Description and Purpose: This is the Final Product Change Notice to make customers aware that ASE-SH, located in Shanghai, China is being qualified as the assembly source for ON Semiconductor's 32 pin LQFP packages. The devices listed on this FPCN have historically been assembled at the Unisem located in Batam, Indonesia. These products which were previously rated as MSL3 have been qualified as MSL2. Upon expiration of the Final PCN, products listed in this PCN will be assembled in ASE-SH. TEM001092 Rev. E Page 1 of 2 Final Product/Process Change Notification Document # : FPCN20776Z Issue Date: 24 November 2015 Reliability Data Summary: QV DEVICE NAME: NCV7517BFTR2G PACKAGE: LQFP 32 Test Specification Condition Interval Results HTOL JESD22-A108 Ta=125°C, 100 % max rated Vcc 1008 hrs 0/240 HTSL JESD22-A103 Ta=150°C 1008 hrs 0/80 TC JESD22-A104 Ta= -65°C to +150°C 500 cyc 0/240 HAST JESD22-A110 130°C, 85% RH, 18.8psig, bias 96 hrs 0/239 uHAST JESD22-A118 130°C, 85% RH, 18.8psig, unbiased 96 hrs 0/240 PC J-STD-020 JESD-A113 MSL 2 @ 260 °C 0/720 SD JSTD002 Ta = 245C, 10 sec 0/ 45 To access file attachments on pdf copy of PCN, please be guided by the steps below: 1. Download pdf copy of the PCN to your computer 2. Open the downloaded pdf copy of the PCN 3. Click on the paper clip icon available on the menu provided in the left/bottom portion of the screen to reveal the Attachment field 4. Then click on the attached file/s Electrical Characteristic Summary: Device parameters will continue to meet all Datasheet specifications and reliability will meet or exceed ON Semiconductor established standards. List of Affected Standard Parts: TEM001092 Rev. E Part Number Qualification Vehicle NCV7513BFTR2G NCV7517BFTR2G NCV7517BFTR2G NCV7517BFTR2G Page 2 of 2