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Datasheet
4-wire Resistive
Touch Screen Controller
BU21025GUL
●General Description
BU21025GUL is a low power 4-wire resistive touch
screen controller. BU21025GUL measures coordinates
and touch pressures with a 12bit A/D converter.
BU21025GUL has a digital filter for noise reduction.
●Key Specifications
■ Power supply voltage
■ Temperature range
■ Standby current
■ Operating current
■ Coordinate resolution
●Features
■ 4-wire resistive touch screen controller
■ Single 1.65V to 3.60V supply.
■ Low standby current ( 0.8uA max)
■ 12bit SAR A/D converter
■ 2-wire serial interface
■ Command base interface
■ Digital filter
■ Touch pressure measurement
■ Auto power down control
■ Built-in clock oscillation circuit
●Package
VCSP50L2
1.65V to 3.60V
-30℃ to 85℃
0.8uA (Max.)
120uA (Typ.)
12Bits
W (Typ.) x D (Typ.) x H (Max.)
2.00 mm x 1.50 mm x 0.55mm
●Applications
■ Equipment with a built in user interface of 4-wire
resistive touch screen
■ Portable device such as smart phone, tablet, PDA.
■ Digital still camera, digital video camera, portable
TV.
■ PC / PC peripheral equipment such as laptop PC,
touch screen monitor, printer.
●Typical Application Circuit
VDD
3
1.0μF 0.1μF
2
2.2kΩ
GND
AUX
SDA
Master
( 2-wire serial
interface )
SDA
XP
SCL
SCL
INT
GPIO
VDD
Auxilary Input
2.2kΩ
10Ω
0.1μF
10Ω
0.1μF
YP
BU21025
10Ω
10Ω
1
XN
AD1
YN
AD0
GND
0.1μF
Touch
Screen
0.1μF
5
4
1.
2.
3.
4.
5.
GND
GND
GND
4-wire resistive touch screen
Pull-up resistor for 2-wire serial interface
Bypass capacitors
Diodes for EDS protection
Low pass filter for noise reduction
○Product structure:Silicon monolithic integrated circuit
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Datasheet
BU21025GUL
●Pin Configurations
●Pin Descriptions
PIN NO.
A1
A2
A3
A4
B1
B2
B3
B4
C1
C2
C3
C4
NAME
XP
YP
XN
YN
VDD
AD0
AD1
GND
AUX
INT
SDA
SCL
●Absolute Maximum Ratings
PARAMETER
Power supply voltage
Input voltage
Power dissipation
Storage temperature range
I/O
I/O
I/O
I/O
I/O
I
I
I
O
I/O
I/O
DESCRIPTION
Screen interface
Screen interface
Screen interface
Screen interface
Power supply
Slave address bit0 input
Slave address bit1 input
Ground
Auxiliary input
Interrupt output. Pin polarity is active low.
Serial data
Serial clock
SYMBOL
VDD
VIN
Pd
Tstg
RATING
-0.3 to 4.5
-0.3 to VDD+0.3
600
-50 to 125
UNIT
V
V
mW
℃
CONDITION
(*1)
(*1) Ambient temperature reduces a permission loss by 6.00mW per case more than 25 degree Celsius, 1degree Celsius.
●Recommended Operating Ratings
PARAMETER
Power supply voltage
Operating temperature range
SYMBOL
VDD
Topr
MIN.
1.65
-30
RATING
TYP.
3.00
25
MAX.
3.60
85
UNIT
V
℃
●Electrical Characteristics
All specifications typical at 25℃, VDD = 3.00V, GND=0.00V unless otherwise noted.
RATING
PARAMETER
SYMBOL
UNIT
MIN.
TYP.
MAX.
Low-level input voltage
VIL
-0.3
0.3xVDD
V
High-level input voltage
VIH
0.7xVDD
VDD+0.3
V
Low-level output voltage
VOL
0
0.2
V
High-level output voltage
VOH
VDD-0.2
VDD
V
A/D converter resolution
AD
12
Bits
Differential non-linearity error
DNL
-3.5
3.5
LSB
Integral non-linearity error
INL
-5
5
LSB
Internal clock frequency
Freq
2.6
4.0
5.1
MHz
Active current
Idd
120
450
uA
Standby current
Ist
0.8
uA
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CONDITION
CONDITION
IL = 3.6mA
IL = -3.6mA
Programmable 8/12 bits
8.2kSPS (operation )
After reset releasing
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7.AUG.2012 Rev.002
Datasheet
BU21025GUL
●Power On Reset Timing Chart
All specifications at 25℃, GND=0.00V unless otherwise noted.
PARAMETER
SYMBOL
Off period of VDD
Rise time for VDD
Fall time for VDD
Ready time for device
tOFF_VDD
tR_VDD
tF_VDD
tRDY
MIN.
0.3
0.5
-
RATING
TYP.
-
MAX.
100
2
RATING
TYP.
-
MAX.
400
0.9
300
300
-
UNIT
CONDITION
s
us
ms
ms
●2-wire Serial Interface Timing Chart
All specifications at 25℃, VDD = 3.00V, GND=0.00V unless otherwise noted.
PARAMETER
SCL clock frequency
Hold time for (repeated) START condition
Low period of SCL
High period of SCL
Setup time for repeated START condition
Data hold time
Data setup time
Rise time for both SCL and SDA
Fall time for both SCL and SDA
Setup time for STOP condition
Bus free time between a STOP and START condition
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SYMBOL
fSCL
tHD_STA
tLOW
tHIGH
tSU_STA
tHD_DAT
tSU_DAT
tR
tF
tSU_STO
tBUF
3/15
MIN.
0
0.6
1.3
0.6
0.6
0
100
20
20
0.6
1.3
UNIT
CONDITION
KHz
us
us
us
us
us
ns
ns
ns
us
us
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7.AUG.2012 Rev.002
Datasheet
BU21025GUL
●2-wire Serial Interface
BU21025GUL supports a 2-wire serial interface A device that controls transfer is called a master. A device that controlled by
the master is called a slave. BU21025GUL is a slave device.
BU21025GUL has a write protocol and a read protocol. The write protocol consists of a start condition, an address byte, a
command byte, and a stop condition. The read protocol consists of a start condition, an address byte, one or two data bytes,
and a stop condition.
Start Condition
BU21025GUL recognizes as a start condition that falling edge of SDA while SCL is set “H”. If the start condition is received,
BU21025GUL will be in the state that can be transfer and received data. When the start condition is fulfilled, BU21025GUL
recognize the (repeated) start condition also in data transfer.
Stop Condition
BU21025GUL recognizes as a stop condition that rising edge of SDA while SCL is set “H”. If the stop condition is received,
BU21025GUL will be in the state that can not be transfer and received data.
Data Transfer
Data is transferred with the most significant bit (MSB) first and 8-bits long. Each byte has to be followed by an acknowledge
bit. A Timing of SDA data receiving is rising edge of SCL. A state of SDA can only change when SCL set to “L”. If SDA is
changed while SCL is set “H”, a start or stop condition will recognized by BU21025GUL.
Acknowledge Bit (sending)
After the master sends a byte to BU21025GUL, an acknowledge bit is used in order that BU21025GUL may return a
response to the master. At this time, the master needs to set SDA into a high impedance state. When BU21025GUL
receives effectively data, it sets SDA to “L” (ACK). Otherwise SDA is set to “H” (NACK).
Acknowledge Bit (receiving)
After the master receives a byte from BU21025GUL, an acknowledge bit is used for judgment of whether BU21025GUL
continues data transfer. In this case, the master needs to set SDA. When SDA is set to “L” (ACK), BU21025GUL continues
data transfer. When SDA is set to “H” (NACK), BU21025GUL ends data transfer.
Address Byte
BU21025GUL recognizes one byte data as an address byte after a start condition. The address byte is consisted a 7-bit
slave address and a read-write bit. If a received slave address is matched with its one, BU21025GUL issues an
acknowledge to the master. Otherwise BU21025GUL doesn’t issue an acknowledge to the master and stops data transfer.
Upper 5 bits of the 7-bit slave address are “10010”. And lower 2 bits of the 7-bit slave address are programmable by AD1
and AD0. The read-write bit (R/WB) determines direction. When it is ‘1’, the master reads from BU21025GUL. When it is ‘0’,
the master writes to BU21025GUL.
Table 1. Address Byte
BIT
NAME
SLAVE
MSB
7
S6
1
6
S5
0
5
S4
0
4
S3
1
3
S2
0
2
S1
AD1
1
S0
AD0
LSB
0
R/WB
-
BIT 7-1 : S6-0
Slave address
BIT 0 : R/WB
0: The master writes to BU21025GUL
1: The master reads from BU21025GUL.
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Datasheet
BU21025GUL
Command Byte
BU21025GUL has a command byte after the address byte. Upper 4 bits of the command byte select an operation code. And
lower 4 bits of the command byte select an operand. Effects of the operands are changed by the operation code.
Table 2. Command Byte
MSB
7
C3
BIT
NAME
BIT 7-4 : C3-0
Operation code:
BIT 3-0 : O3-0
Operand:
6
C2
5
C1
4
C0
3
O3
2
O2
1
O1
LSB
0
O0
It is select an operation of the command. Detail is shown in Table 3.
It has 3 types. The operand type is selected by the operation code. When the operation
code is not “0101” or “1011”, the option type is 0. When it is “1011”, the option type is 1.
When it is “0101” option type is 2. Detail is shown in Table 3 and 4.
Table 3. Operation Code Function
C3
C2
C1
C0
FUNCTION
AD-INPUT
X-DRIVER
Y-DRIVER
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Set Power
Reserved
Measure AUX
Reserved
Set Power
Software Reset
Reserved
Reserved
Drive X
Drive Y
Drive Z
Setup
Measure X
Measure Y
Measure Z1
Measure Z2
OFF
AUX
OFF
OFF
OFF
OFF
OFF
Keep
YP
XP
YN
XP
OFF
OFF
OFF
OFF
ON
OFF
XN-ON
Keep
ON
OFF
XN-ON
XN-ON
OFF
OFF
OFF
OFF
OFF
ON
YP-ON
Keep
OFF
ON
YP-ON
YP-ON
INT
POLARITY
H
H
H
H
L
L
L
Keep
L
L
L
L
OPERAND
TYPE
0
0
0
2
0
0
0
1
0
0
0
0
Set Power (0000, 0100)
This code is used for returning to a state for touch detection without A/D conversion after sending screen drive command.
After this command, A/D converted data is set to 0.
Software Reset (0101)
BU21025GUL resets an A/D converted data, setup settings, and state of analog blocks to the initial state. If BU21025GUL
receives this code during an A/D conversion, the A/D conversion is stopped.
Drive X (1000), Drive Y (1001), Drive Z (1010)
BU21025GUL starts driving screen voltage by each code. PD is not effective. So, Driving is continuous until reserving
another command that changes state of driving screen voltage.
Measure AUX (0010), Measure X (1100), Measure Y (1101), Measure Z1 (1110), Measure Z2 (1111)
BU21025GUL starts driving screen voltage and A/D conversion. A PD of operand set,state of BU21025GUL after A/D
conversion is finished.
Setup (1011)
The setup command has a special operand (type is 1). The operand has MAF and pull-up resistor settings. Detail is
shown in Table 4.
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Datasheet
BU21025GUL
Table 4.Operands of Each Type
OPERAND
TYPE
0
1
2
O3
O2
C1
C0
X
L1
X
PD
L0
X
M
MAF
X
X
PU90
X
Operand Type 0
O3 : X
Don’t care
O2 : PD
Power down setting.
0 : The analog blocks off and touch detection is enable automatically after A/D conversion is finished.
1 : The analog blocks keep measuring state after A/D conversion is finished.
O1 : M
A/D comversion mode setting.
0 : The resolution of A/D conversion is 12-bit. The Conversion clock frequency is 1MHz.
1 : The resolution of A/D conversion is 8-bit. The conversion clock frequency is 2MHz
O0 : X
Don’t care
Operand Type 1
O3 -2: L1-0
Fixed. Must write “00”.
O1 : MAF
Median Average Filter (MAF) Setting
0 : MAF is enabled (default).
1 : MAF is disabled.
O0 : PU90
pull-up resistor Setting.
0 : 50 kohm (default).
1 : 90 kohm
Operand Type 2
O3 -0: X
Don’t care
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Datasheet
BU21025GUL
Write Protocol
An command write is started in BU21025GUL when the master sends the start condition, the slave address of
th
BU21025GUL, and zero in bit 0( 8 bit) for writing, as shown in Table 1. If the slave address is matched with its own,
BU21025GUL issues an acknowledge to the master. When the master receives the acknowledge from BU21025GUL, the
master send the command byte. When BU21025GUL received next 8 bits, it issues another acknowledge to the master.
After the acknowledge is received by the master, the master sends the stop or repeated start condition for ending write.
Figure 1. Write Protocol
If a receiving command in BU21025GUL is not the software reset or setup, BU21025GUL starts driving screen voltage
when C0 is latched by rising edge of SCL. Next, if the received type of operation code is measurement, BU21025GUL starts
acquisition in A/D converter when next falling edge of SCL. BU21025GUL stops acquisition and starts A/D conversion when
BU21025GUL receive the stop or repeated start condition.
When BU21025GUL receives a command other than software reset during the A/D conversion, the command is ignored.
And if the command is ignored, BU21025GUL doesn’t return an acknowledge at the ACK timing behind the command byte.
th
(18 timing in Figure. 1)
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Datasheet
BU21025GUL
Read Protocol
A data read is started in BU21025GUL when the master sends the start condition, the slave address of BU21025GUL, and
th
one in bit 0( 8 bit) for reading, as shown in Table 1. If the slave address is matched with its own, BU21025GUL issues an
acknowledge to the master. Next, BU21025GUL send upper 8-bit (D11-4) of an A/D converted 12-bit data as data byte 1
and wait an acknowledge from the master. After receiving the acknowledge, the data byte 2 is sent. Upper 4 bits of it are
lower 4 bits (D3-0) of the A/D converted 12-bit data, and lower 4 bits of it are all zero. In next acknowledge timing, the
master send a not-acknowledge and the stop or repeated start condition for ending read. In the last acknowledge timing,
BU21025GUL doesn’t check the acknowledge and stop sending data. So if the master send an acknowledge and continue
reading a byte, the read data become 0xFF. In the 8-bit mode, all of an A/D converted 8-bit data is in the data byte 1. So,
the master doesn’t need to read the data byte 2.
Figure 2. Read Protocol
If an A/D conversion is not finished until falling edge SCL after first acknowledge timing with read mode, SCL pin is
stretched by BU21025GUL.In this state, SCL pin is forced to low by BU21025GUL and SDA value is invalid data. This state
is ended when the A/D conversion is finished. After this state end, the master can control the SCL line and read converted
data.
With stretch function, the master can access immediately after sending a conversion command. If performance of an A/D
conversion is needed, the master send the read command after the A/D conversion is finished. Detail of a A/D conversion
time is shown in Table 6.
Figure 3. Read with Stretch
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Datasheet
BU21025GUL
●Block Diagram
●Overview
Power On Reset
BU21025GUL requests that the Power On Reset Timing should be observed. If the Power On Reset Timing not be
observed, BU21025GUL may wakeup with a random state. The touch detection and 2-wire serial interface is enabled after
taking the device ready time.
A/D Converter
BU21025GUL has a 12-bit Successive Approximation Resistor (SAR) Analog to Digital (A/D) converter. This A/D converter
is used for measuring X and Y position and Auxiliary input voltage. Output format is in straight binary as shown in Table 5.
Table 5. A/D Convertor Output Format
INPUT VOLTAGE
OUTPUT
(VREF - 1.5LSB) ~ VREF
FFFh
(VREF - 2.5LSB) ~ (VREF - 1.5LSB)
FFEh
(VREF - 3.5LSB) ~ (VREF - 2.5LSB)
FFDh
:
:
1.5LSB ~ 2.5LSB
002h
0.5LSB ~ 1.5LSB
001h
0 ~ 0.5LSB
000h
Note: VREF = VREFP – VREFN, LSB = VREF / 4096
Touch Screen I/F
A touch screen interface is consisted many switches. These switches are used for the driving screen voltage and selection
an input of the A/D converter. State of these switches is selected by a command that sent from the master.
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Datasheet
BU21025GUL
Touch Detection
A touch detection function of BU21025GUL is automatically enabled after wakeup. BU21025GUL inform that touch screen
is touched or not by INT pin when touch detection is enabled. Output level of INT becomes low during screen is touched. In
this state, XP pin is pulled-up high by pull-up resistor (RPU) and YN pin is connected to GND. A resistance of RPU is
selectable from either 50 kohm (default) or 90 kohm by the setup command. When the screen isn’t touched, XP is
connected to VDD trough the pull-up resistor. When the screen is touched, XP is connected to GND trough the screen and
BU21025GUL detect touch.
When a received command is not setup (1011), the touch detection is disabled and RPU is disconnected from XP pin. And
output level of INT is fixed high or low by each command (see Table 3 for details about operation code).
nd
When BU21025GUL receives software reset command (0101), touch detection is enabled after the 2 acknowledge timing.
When BU21025GUL receives A/D conversion with PD=0 commandn touch detection is enabled after an A/D conversion is
finished.
When BU21025GUL receives a driving screen voltage or an A/D conversion with PD=1 command, touch detection is not
enable automatically. A method for re-enable the touch detection is sending new command that return to enable touch
detection. The set power command is almost same as an A/D conversion command.
VDD
XP
OFF
INT
ON
RPU
YP
Control
logic
XN
YN
ON
GND
Figure 4. Touch Detection Circuit
Digital Filter
BU21025GUL has a Median Average Filter (MAF) as a digital filter for noise reduction. When the MAF is enabled,
BU21025GUL operates A/D conversion 7 times and stores converted data. Next, these stored data are sorted. An output
data of MAF is an average value of middle three values of the sorted data. An abnormal value becomes difficult to affect the
results. So noise reduction performance of MAF is higher than one of normal average filter. When the MAF is disabled,
BU21025GUL operates A/D conversion one times and output the converted data The MAF is enabled in defaults and is
changed by the setup command.
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Datasheet
BU21025GUL
●Operation
Position Detection of Touch Screen
The 4-wire resistive touch screen is mainly constituted in two resistive plates, X and Y. If screen is pressed, these 2 plates
are connected.
A position of touch screen is detected by applying voltage to one plate and measuring voltage of another plate. This
measurement voltage is divided by touch position. In X-position detection, X-plate is applied voltage. And Voltage of Y-plate
is measured. In Y-position detection, Y-plate is applied voltage. And Voltage of Y-plate is measured. The master needs to
detection 2 times for detecting X and Y position
When screen is not touched, a measuring plate is high impedance from another plate. So, it can’t get voltage. And a value
of the A/D conversion became unknown. If unknown values are used for calculating the coordinates, the coordinates will not
show touch points. So it is require to filter unknown values when the calculate coordinates.
VDD
XP
VDD
ON
XP
VREFP
Y-plate
X-plate
YP
Y-plate
X-plate
YP
ON
VREFP
AIN
AIN
VREFN
VREFN
XN
XN
YN
YN
ON
ON
GND
GND
Figure 5. X-Position Detection Mode
Figure 6. Y-Position Detection Mode
Touch Resistance Measurement
These are two methods for measuring touch resistance. The first method requires that a resistance of X-plate (RX-plate) is
known. In this method, the calculation of touch resistance (RTOUCH) needs X position and 2 additional measurement data (Z1
and Z2) that shown in Figure 7 and 8. The equation is as follows,
R TOUCH = R X-plate ⋅
X postion ⎛ Z 2
⎞
⎜
− 1⎟⎟
4096 ⎜⎝ Z 1
⎠
The second method requires that both resistance of X-plate and resistance of Y-plate (RY-plate) are known. In this method,
the calculation of RTOUCH needs X and Y position and Z1. The equation is as follows,
R TOUCH =
R X-plate - X position ⎛ 4096 ⎞
⋅ ⎜⎜
− 1⎟⎟ - R Y -plate
4096
⎝ Z1
⎠
⎛ Yposition
⋅ ⎜⎜14096
⎝
⎞
⎟
⎟
⎠
VDD
XP
VDD
ON
XP
VREFP
Y-plate
X-plate
YP
Y-plate
X-plate
YP
ON
VREFP
AIN
AIN
VREFN
VREFN
XN
XN
YN
YN
ON
ON
GND
GND
Figure 7. Z1-Position Detection Mode
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Figure 8. Z2-Position Detection Mode
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Datasheet
BU21025GUL
A/D Conversion Time
When MAF is disabled, an A/D conversion takes 66 internal core clocks (CCLK) with 12-bit mode and 38 CCLK with 8-bit
mode. When MAF is enabled, it takes 476 CCLK with 12-bit mode and 244 CCLK with 8-bit mode. In MAF mode, the
number of sampling becomes 7. So the A/D conversion cycles become large.
The A/D conversion clocks and time are shown in Table 6. The number of CCLK and time are counted from a stop or
repeated start condition after sending a conversion command. In this table, the time is calculated by CCLK is 4MHz in
typically.
MAF
Enable
Disable
Table 6. A/D Conversion Time (CCLK = 4MHz)
MODE
NUMBER OF CCLK
TIME [us]
12-bit
476
119.0
8-bit
244
61.0
12-bit
66
16.5
8-bit
38
9.5
A/D Sampling Time with 2-wire Serial Interface
The master need to send a conversion command and a read command for getting an A/D converted data. So, a throughput
rate is affected by 2-wire serial interface frequency. Each write cycle takes 20 SCL and each read cycle takes 29 SCL
(12-bit mode) or 20 SCL (8-bit mode). Note that each a start and a stop condition take 1 SCL in this count.
When the 2-wire serial interface frequency is 400 KHz, one period become 2.5us. Each A/D sampling time takes 241.5us
(49 x 2.5 us + 119.0 us) with 12-bit mode and MAF. So, a control throughput rate becomes 4.14 kSPS. In MAF mode,
BU21025GUL operates A/D conversion 7 times. It means that an operation throughput rate is increased 7 times. It becomes
28.99 kSPS.
2-WIRE SERIAL
INTERFACE
FREQENCY
100 kHz
(10us period)
400 kHz
(2.5us period)
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MAF
Enable
Disable
Enable
Disable
Table 7. Control and Operation Throughput
A/D
NUMBER
CYCLE TIME
MODE
CONVERSION
OF SCL
[us]
TIME [us]
12-bit
49
119.0
609.0
8-bit
40
61.0
461.0
12-bit
49
16.5
506.5
8-bit
40
9.5
409.5
12-bit
49
119.0
241.5
8-bit
40
61.0
161.0
12-bit
49
16.5
139.0
8-bit
40
9.5
109.5
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/15
CONTROL
THROUGHPUT
[kSPS]
1.64
2.17
1.97
2.44
4.14
6.21
7.19
9.13
OPERATION
THROUGHPUT
[kSPS]
11.49
15.18
28.99
43.48
-
TSZ02201-0Y2Y0F300050-1-2
7.AUG.2012 Rev.002
Datasheet
BU21025GUL
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC's
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply
terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an
electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem
including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Rush current
The IC with some power supplies has a capable of rush current due to procedure and delay at power-on. Pay attention to
the capacitance of the coupling condensers and the wiring pattern width and routing of the power supply and the GND
lines.
(13) Others
In case of use this LSI, please peruse some other detail documents, we called, Technical note, Functional description,
Application note.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/15
TSZ02201-0Y2Y0F300050-1-2
7.AUG.2012 Rev.002
Datasheet
BU21025GUL
●Ordering Information
●Physical Dimension Tape and Reel Information
VCSP50L2(BU21025GUL)
Tape and Reel information
Tape
Embossed carrier tape
Quantity 3000pcs
1.5±0.05
0.1±0.05
0.55MAX
1PIN MARK
S
0. 06
S
Direction
of feed
E2
A
C
B
B
A
1
0.25±0.05
2
3
1234
P=0.5×2
12-φ0.25±0.05
0.05 A B
(φ0.15)INDEX POST
The direction is the 1 pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
0.25±0.05
2.0± 0.05
1234
1pin
4
P=0.5×3
1234
Reel
(Unit : mm)
1234
1234
1234
Direction of feed
Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram (TOP VIEW)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/15
TSZ02201-0Y2Y0F300050-1-2
7.AUG.2012 Rev.002
Datasheet
BU21025GUL
●Revision History
DATE
2012/06/28
www.rohm.com
REVISION
002
CHANGES
new release
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/15
TSZ02201-0Y2Y0F300050-1-2
7.AUG.2012 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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