Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 128‐Lead, 14 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) R‐LQ128 GPC AWK Matte Tin (Sn) RoHS Compliant Yes Yes e3 Green Compliant ASE Kaohsiung / ASE Shanghai REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) 2‐Propenoic Acid, Dodecyl Ester Dicyclopentyldimethylene Diacrylate Diglycidylphenyl Glycidyl Ether Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide Isobornyl Methacrylate 7440‐22‐4 2156‐97‐0 42594‐17‐2 13561‐08‐5 80‐43‐3 7534‐94‐3 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica Epoxy Resin Phenol Resin Others Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 253.086 7.892 1.578 0.526 263.083 12.853 12.853 0.783 0.039 0.035 0.035 0.007 0.007 0.908 1.437 1.437 1.535 1.535 647.000 38.443 31.189 7.253 1.451 725.337 12.496 12.496 1017.649 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 86.3 863000 4.3 43000 3.9 39000 3.9 39000 0.8 8000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 89.2 892000 5.3 53000 4.3 43000 1.0 10000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 24.87 248697 0.78 7756 0.16 1551 0.05 517 25.85 258520 1.26 12631 1.26 12631 0.08 770 0.00 38 0.00 35 0.00 35 0.00 7 0.00 7 0.09 892 0.14 1413 0.14 1413 0.15 1508 0.15 1508 63.58 635779 3.78 37776 3.06 30649 0.71 7128 0.14 1426 71.28 712757 1.23 12279 1.23 12279 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 128‐Lead, 14 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) R‐LQ128 GPC AWK Matte Tin (Sn) RoHS Compliant Yes Yes e3 Green Compliant ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin B Diluent B Hardener Epoxy Resin A Diluent A Organic Peroxide Dicyandiamide 7440‐22‐4 Proprietary Proprietary Proprietary 9003‐36‐5 Proprietary Proprietary 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Fused Silica Fused Phenol Resin Epoxy Resin A Epoxy Resin B Silica, Crystalline Carbon Black 60676‐86‐0 76361‐86‐9 Proprietary Proprietary Proprietary 14808‐60‐7 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 253.086 7.892 1.578 0.526 263.083 12.853 12.853 0.656 0.052 0.052 0.043 0.034 0.034 0.004 0.003 0.878 1.437 1.437 0.698 0.017 0.715 554.883 78.336 39.894 23.936 23.936 2.176 2.176 725.337 12.496 12.496 1016.800 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 74.7 747000 5.9 59000 5.9 59000 4.9 49000 3.9 39000 3.9 39000 0.5 5000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 76.5 765000 10.8 108000 5.5 55000 3.3 33000 3.3 33000 0.3 3000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 24.89 248904 0.78 7762 0.16 1552 0.05 517 25.87 258736 1.26 12641 1.26 12641 0.06 645 0.01 51 0.01 51 0.00 42 0.00 34 0.00 34 0.00 4 0.00 3 0.09 863 0.14 1414 0.14 1414 0.07 687 0.00 17 0.07 704 54.57 545715 7.70 77042 3.92 39234 2.35 23541 2.35 23541 0.21 2140 0.21 2140 71.34 713353 1.23 12289 1.23 12289 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 128‐Lead, 14 x 20 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP) R‐LQ128 GPC AWK Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Shanghai REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) 2‐Propenoic Acid, Dodecyl Ester Dicyclopentyldimethylene Diacrylate Diglycidylphenyl Glycidyl Ether Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide Isobornyl Methacrylate 7440‐22‐4 2156‐97‐0 42594‐17‐2 13561‐08‐5 80‐43‐3 7534‐94‐3 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Epoxy Resin Phenol Resin Others Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 253.086 7.892 1.578 0.526 263.083 12.853 12.853 0.783 0.039 0.035 0.035 0.007 0.007 0.908 1.437 1.437 0.698 0.017 0.715 647.000 38.443 31.189 7.253 1.451 725.337 12.496 12.496 1016.830 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 86.3 863000 4.3 43000 3.9 39000 3.9 39000 0.8 8000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 89.2 892000 5.3 53000 4.3 43000 1.0 10000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 24.89 248897 0.78 7762 0.16 1552 0.05 517 25.87 258729 1.26 12641 1.26 12641 0.08 770 0.00 38 0.00 35 0.00 35 0.00 7 0.00 7 0.09 893 0.14 1414 0.14 1414 0.07 687 0.00 17 0.07 704 63.63 636292 3.78 37807 3.07 30673 0.71 7133 0.14 1427 71.33 713332 1.23 12289 1.23 12289 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.