View detail for

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
48‐Lead, 7 x 7 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
48AA / R‐LQ048
GPC
AAF
RoHS Compliant
Matte Tin (Sn)
Yes
e3
Green Compliant
Yes
ASE Kaohsiung / ASE Shanghai
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
2‐Propenoic Acid, Dodecyl Ester
Dicyclopentyldimethylene Diacrylate
Diglycidylphenyl Glycidyl Ether
Bis(.alpha.,.alpha.‐Dimethylbenzyl) Peroxide
Isobornyl Methacrylate
7440‐22‐4
2156‐97‐0
42594‐17‐2
13561‐08‐5
80‐43‐3
7534‐94‐3
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica
Epoxy Resin
Phenol Resin
Others
Carbon Black
60676‐86‐0
Proprietary
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
51.774
1.615
0.323
0.108
53.820
7.547
7.547
0.460
0.023
0.021
0.021
0.004
0.004
0.533
0.640
0.640
0.355
0.355
109.167
6.486
5.263
1.224
0.245
122.385
4.686
4.686
189.966
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
86.3
863000
4.3
43000
3.9
39000
3.9
39000
0.8
8000
0.8
8000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
89.2
892000
5.3
53000
4.3
43000
1.0
10000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
27.25
272547
0.85
8499
0.17
1700
0.06
567
28.33
283313
3.97
39729
3.97
39729
0.24
2421
0.01
121
0.01
109
0.01
109
0.00
22
0.00
22
0.28
2806
0.34
3369
0.34
3369
0.19
1870
0.19
1870
57.47
574668
3.41
34145
2.77
27703
0.64
6442
0.13
1288
64.42
644246
2.47
24667
2.47
24667
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or
destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other
limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel
Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement
signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent
Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP),
Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
48‐Lead, 7 x 7 x 1.4 mm Body, 0.50 mm Lead Pitch, 2.0 mm Footprint, Low‐Profile Plastic Quad Flat Package (LQFP)
R‐LQ048
GPC
AAF
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Kaohsiung
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
CAS #
7440‐50‐8
7440‐02‐0
7440‐21‐3
7439‐95‐4
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin B
Diluent B
Hardener
Epoxy Resin A
Diluent A
Organic Peroxide
Dicyandiamide
7440‐22‐4
Proprietary
Proprietary
Proprietary
9003‐36‐5
Proprietary
Proprietary
461‐58‐5
Silver (Ag)
7440‐22‐4
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica Fused
Silica Fused
Phenol Resin
Epoxy Resin A
Epoxy Resin B
Silica, Crystalline
Carbon Black
60676‐86‐0
76361‐86‐9
Proprietary
Proprietary
Proprietary
14808‐60‐7
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
51.774
1.615
0.323
0.108
53.820
7.547
7.547
0.385
0.030
0.030
0.025
0.020
0.020
0.003
0.002
0.515
0.640
0.640
0.162
0.004
0.166
93.624
13.218
6.731
4.039
4.039
0.367
0.367
122.385
4.686
4.686
189.758
Homogeneous Material
Percentage
ppm
96.2
962000
3.0
30000
0.6
6000
0.2
2000
100.0
1000000
100.0
1000000
100.0
1000000
74.7
747000
5.9
59000
5.9
59000
4.9
49000
3.9
39000
3.9
39000
0.5
5000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
76.5
765000
10.8
108000
5.5
55000
3.3
33000
3.3
33000
0.3
3000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
27.28
272845
0.85
8509
0.17
1702
0.06
567
28.36
283622
3.98
39772
3.98
39772
0.20
2029
0.02
160
0.02
160
0.01
133
0.01
106
0.01
106
0.00
14
0.00
8
0.27
2716
0.34
3373
0.34
3373
0.09
851
0.00
21
0.09
872
49.34
493387
6.97
69655
3.55
35472
2.13
21283
2.13
21283
0.19
1935
0.19
1935
64.50
644950
2.47
24694
2.47
24694
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
January 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.