Package Code Package Description Lead Finish RoHS Compliant MSL Rating Assembly Location Atmel Corporation - Package Material Declaration Datasheet 16S GPC 16-Lead, 0.300" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) Nickel-Palladium-Gold (NiPdAu) J-STD-609 Category Yes Green Compliant 1 Max Reflow Temperature External Manufacturing SRW e4 Yes 260 Celsius Package Material Declaration Material Leadframe Sub-Total Integrated Circuit Sub-Total Die Attach Sub-Total Die Pad Plating Sub-Total Bond Wire Sub-Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440-50-8 7439-89-6 7723-14-0 7440-66-6 Silicon (Si) 7440-21-3 Silver (Ag) 2-(Chloromethyl)oxirane, Formaldehyde, Phenol 2,6-Diglycidyl Phenyl Allyl Ether Oligomer Epoxy Resin gamma-Butyrolactone Copper(II) Oxide Organosilane Poly(oxypropylene)diamine 7440-22-4 9003-36-5 Proprietary 68475-94-5 96-48-0 1317-38-0 Proprietary 9046-10-0 Silver (Ag) 7440-22-4 Gold (Au) 7440-57-5 Silica Fused Epoxy Resin Phenol Resin Epoxy, Cresol Novolac Carbon Black 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440-02-0 7440-05-3 7440-57-5 Sub-Total Terminal Plating Sub-Total Total Weight (mg) 127.025 3.130 0.130 0.130 130.416 12.452 12.452 0.716 0.030 0.030 0.030 0.030 0.030 0.030 0.030 0.923 0.900 0.900 0.098 0.098 279.397 17.765 17.765 7.106 0.969 323.003 0.747 0.052 0.006 0.805 468.598 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 77.6 776000 3.2 32000 3.2 32000 3.2 32000 3.2 32000 3.2 32000 3.2 32000 3.2 32000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 86.5 865000 5.5 55000 5.5 55000 2.2 22000 0.3 3000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 27.11 271075 0.67 6679 0.03 278 0.03 278 27.83 278311 2.66 26573 2.66 26573 0.15 1529 0.01 63 0.01 63 0.01 63 0.01 63 0.01 63 0.01 63 0.01 63 0.20 1970 0.19 1921 0.19 1921 0.02 210 0.02 210 59.62 596241 3.79 37911 3.79 37911 1.52 15165 0.21 2068 68.93 689296 0.16 1593 0.01 112 0.00 14 0.17 1719 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 14, 2013 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.