INTEGRATED CIRCUITS DATA SHEET TJA1041A High speed CAN transceiver Product specification Supersedes data of 2003 Sep 29 2004 Feb 20 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A FEATURES • Over-temperature protection with diagnosis Optimized for in-vehicle high speed communication • Undervoltage detection on pins VCC, VI/O and VBAT • Fully compatible with the ISO 11898 standard • Automotive environment transient protected bus pins and pin VBAT • Communication speed up to 1 Mbit/s • Very low ElectroMagnetic Emission (EME) • Short-circuit proof bus pins and pin SPLIT (to battery and to ground) • Differential receiver with wide common-mode range, offering high ElectroMagnetic Immunity (EMI) • Bus line short-circuit diagnosis • Bus dominant clamping diagnosis • Passive behaviour when supply voltage is off • Cold start diagnosis (first battery connection). • Automatic I/O-level adaptation to the host controller supply voltage GENERAL DESCRIPTION • Recessive bus DC voltage stabilization for further improvement of EME behaviour The TJA1041A provides an advanced interface between the protocol controller and the physical bus in a Controller Area Network (CAN) node. The TJA1041A is primarily intended for automotive high-speed CAN applications (up to 1 Mbit/s). The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. The TJA1041A is fully compatible to the ISO 11898 standard, and offers excellent EMC performance, very low power consumption, and passive behaviour when supply voltage is off. The advanced features include: • Listen-only mode for node diagnosis and failure containment • Allows implementation of large networks (more than 110 nodes). Low-power management • Very low-current in standby and sleep mode, with local and remote wake-up • Capability to power down the entire node, still allowing local and remote wake-up • Low-power management, supporting local and remote wake-up with wake-up source recognition and the capability to control the power supply in the rest of the node • Wake-up source recognition. Protection and diagnosis (detection and signalling) • Several protection and diagnosis functions including short circuits of the bus lines and first battery connection • TXD dominant clamping handler with diagnosis • RXD recessive clamping handler with diagnosis • Automatic adaptation of the I/O-levels, in line with the supply voltage of the controller. • TXD-to-RXD short-circuit handler with diagnosis ORDERING INFORMATION TYPE NUMBER PACKAGE NAME TJA1041AT SO14 TJA1041AU − 2004 Feb 20 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm bare die; 1920 × 3190 × 380 µm 2 VERSION SOT108-1 − Philips Semiconductors Product specification High speed CAN transceiver TJA1041A QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC DC voltage on pin VCC operating range 4.75 5.25 V VI/O DC voltage on pin VI/O operating range 2.8 5.25 V VBAT DC voltage on pin VBAT operating range 5 27 V IBAT VBAT input current VBAT = 12 V 10 30 µA VCANH DC voltage on pin CANH 0 < VCC < 5.25 V; no time limit −27 +40 V VCANL DC voltage on pin CANL 0 < VCC < 5.25 V; no time limit −27 +40 V VSPLIT DC voltage on pin SPLIT 0 < VCC < 5.25 V; no time limit −27 +40 V Vesd electrostatic discharge voltage Human Body Model (HBM) −6 +6 kV pins CANH, CANL and SPLIT all other pins tPD(TXD-RXD) propagation delay TXD to RXD Tvj virtual junction temperature 2004 Feb 20 VSTB = 0 V 3 −4 +4 kV 40 255 ns −40 +150 °C Philips Semiconductors Product specification High speed CAN transceiver TJA1041A BLOCK DIAGRAM VI/O handbook, full pagewidth VCC 5 3 VBAT 10 TJA1041A TXD 7 1 TIME-OUT EN TEMPERATURE PROTECTION LEVEL ADAPTOR 6 13 STB INH DRIVER 14 12 CANH CANL VBAT WAKE 9 VCC WAKE COMPARATOR MODE CONTROL + FAILURE DETECTOR + WAKE-UP DETECTOR VI/O ERR 8 RXD RECESSIVE DETECTION VI/O SPLIT 11 VBAT LOW POWER RECEIVER VCC RXD 4 NORMAL RECEIVER 2 MNB115 GND Fig.1 Block diagram. 2004 Feb 20 4 SPLIT Philips Semiconductors Product specification High speed CAN transceiver TJA1041A PINNING SYMBOL PIN DESCRIPTION TXD 1 transmit data input GND 2 ground VCC 3 transceiver supply voltage input RXD 4 receive data output; reads out data from the bus lines VI/O 5 I/O-level adapter voltage input EN 6 enable control input INH 7 inhibit output for switching external voltage regulators handbook, halfpage ERR 8 error and power-on indication output (active LOW) WAKE 9 local wake-up input VBAT 10 battery voltage input SPLIT 11 common-mode stabilization output CANL 12 LOW-level CAN bus line CANH 13 HIGH-level CAN bus line STB 14 standby control input (active LOW) TXD 1 14 STB GND 2 13 CANH VCC 3 12 CANL RXD 4 TJA1041AT 11 SPLIT VI/O 5 10 VBAT EN 6 9 WAKE INH 7 8 ERR MDB635 Fig.2 Pinning configuration. FUNCTIONAL DESCRIPTION Operating modes The primary function of a CAN transceiver is to provide the CAN physical layer as described in the ISO 11898 standard. In the TJA1041A this primary function is complemented with a number of operating modes, fail-safe features and diagnosis features, which offer enhanced system reliability and advanced power management functionality. The TJA1041A can be operated in five modes, each with specific features. Control pins STB and EN select the operating mode. Changing between modes also gives access to a number of diagnostics flags, available via pin ERR. The following sections describe the five operating modes. Table 1 shows the conditions for selecting these modes. Figure 3 illustrates the mode transitions when VCC, VI/O and VBAT are present. 2004 Feb 20 5 Philips Semiconductors Product specification High speed CAN transceiver Table 1 TJA1041A Operating mode selection CONTROL PINS INTERNAL FLAGS OPERATING MODE STB EN UVNOM UVBAT pwon, wake-up X X set X X(1) cleared set one or both set sleep mode; note 2 both cleared standby mode no change from sleep mode standby mode from any other mode L L cleared cleared one or both set both cleared standby mode no change from sleep mode standby mode from any other mode L H cleared cleared one or both set both cleared standby mode no change from sleep mode go-to-sleep command mode from any other mode; note 3 PIN INH floating H floating H H floating H H floating H(3) H L cleared cleared X pwon/listen-only mode H H H cleared cleared X normal mode; note 4 H Notes 1. Setting the pwon flag or the wake-up flag will clear the UVNOM flag. 2. The transceiver directly enters sleep mode and pin INH is set floating when the UVNOM flag is set (so after the undervoltage detection time on either VCC or VI/O has elapsed before that voltage level has recovered). 3. When go-to-sleep command mode is selected for longer than the minimum hold time of the go-to-sleep command, the transceiver will enter sleep mode and pin INH is set floating. 4. On entering normal mode the pwon flag and the wake-up flag will be cleared. 2004 Feb 20 6 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A handbook, full pagewidth STB = H and EN = H STB = H and EN = L PWON/LISTENONLY MODE STB = H and EN = H STB = H and EN = L STB = H and EN = L NORMAL MODE STB = H and EN = H STB = L and (EN = L or flag set) STB = L and EN = H STB = L and EN = H and flags cleared STB = L and EN = L GO-TO-SLEEP COMMAND MODE STB = L and EN = H and flags cleared STANDBY MODE STB = L and (EN = L or flag set) STB = H and EN = L and UVNOM cleared flags cleared and t > t h(min) STB = L and flag set STB = H and EN = H and UVNOM cleared SLEEP MODE LEGEND: = H, = L logical state of pin flag set setting pwon and/or wake-up flag flags cleared pwon and wake-up flag both cleared MGU983 Fig.3 Mode transitions when VCC, VI/O and VBAT are present. NORMAL MODE behaviour. The receiver will still convert the analog bus signal on pins CANH and CANL into digital data, available for output to pin RXD. As in normal mode the bus pins are biased at 0.5VCC, and pin INH remains active. Normal mode is the mode for normal bi-directional CAN communication. The receiver will convert the differential analog bus signal on pins CANH and CANL into digital data, available for output to pin RXD. The transmitter will convert digital data on pin TXD into a differential analog signal, available for output to the bus pins. The bus pins are biased at 0.5VCC (via Ri(cm)). Pin INH is active, so voltage regulators controlled by pin INH (see Fig.4) will be active too. STANDBY MODE The standby mode is the first-level power saving mode of the transceiver, offering reduced current consumption. In standby mode the transceiver is not able to transmit or receive data and the low-power receiver is activated to monitor bus activity. The bus pins are biased at ground level (via Ri(cm)). Pin INH is still active, so voltage regulators controlled by this pin INH will be active too. PWON/LISTEN-ONLY MODE In pwon/listen-only mode the transmitter of the transceiver is disabled, effectively providing a transceiver listen-only 2004 Feb 20 7 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A command mode, and also when the undervoltage detection time on either VCC or VI/O elapses before that voltage level has recovered. In sleep mode the transceiver still behaves as described for standby mode, but now pin INH is set floating. Voltage regulators controlled by pin INH will be switched off, and the current into pin VBAT is reduced to a minimum. Waking up a node from sleep mode is possible via the wake-up flag and (as long as the UVNOM flag is not set) via pin STB. Pins RXD and ERR will reflect any wake-up requests (provided that VI/O and VCC are present). GO-TO-SLEEP COMMAND MODE The go-to-sleep command mode is the controlled route for entering sleep mode. In go-to-sleep command mode the transceiver behaves as if in standby mode, plus a go-to-sleep command is issued to the transceiver. After remaining in go-to-sleep command mode for the minimum hold time (th(min)), the transceiver will enter sleep mode. The transceiver will not enter the sleep mode if the state of pins STB or EN is changed or the UVBAT, pwon or wake-up flag is set before th(min) has expired. Internal flags The TJA1041A makes use of seven internal flags for its fail-safe fallback mode control and system diagnosis support. Table 1 shows the relation between flags and operating modes of the transceiver. Five of the internal flags can be made available to the controller via pin ERR. Table 2 shows the details on how to access these flags. The following sections describe the seven internal flags. SLEEP MODE The sleep mode is the second-level power saving mode of the transceiver. Sleep mode is entered via the go-to-sleep Table 2 Accessing internal flags via pin ERR Flag is available on pin ERR(1) Internal flag Flag is cleared UVNOM no by setting the pwon or wake-up flag UVBAT no when VBAT has recovered pwon in pwon/listen-only mode (coming from standby mode, go-to-sleep command mode, or sleep mode) on entering normal mode wake-up in standby mode, go-to-sleep command mode, and on entering normal mode, or by setting the sleep mode (provided that VI/O and VCC are present) pwon or UVNOM flag wake-up source in normal mode (before the fourth dominant to recessive edge on pin TXD; note 2) on leaving normal mode, or by setting the pwon flag bus failure in normal mode (after the fourth dominant to recessive edge on pin TXD; note 2) on re-entering normal mode local failure in pwon/listen-only mode (coming from normal mode) on entering normal mode or when RXD is dominant while TXD is recessive (provided that all local failures are resolved) Notes 1. Pin ERR is an active-LOW output, so a LOW level indicates a set flag and a HIGH level indicates a cleared flag. Allow pin ERR to stabilize for at least 8 µs after changing operating modes. 2. Allow for a TXD dominant time of at least 4 µs per dominant-recessive cycle. 2004 Feb 20 8 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A UVNOM FLAG that VI/O and VCC are present). The flag is cleared at power-on, or when the UVNOM flag is set or the transceiver enters normal mode. UVNOM is the VCC and VI/O undervoltage detection flag. The flag is set when the voltage on pin VCC drops below VCC(sleep) for longer than tUV(VCC) or when the voltage on pin VI/O drops below VI/O(sleep) for longer than tUV(VI/O). When the UVNOM flag is set, the transceiver will enter sleep mode to save power and not disturb the bus. In sleep mode the voltage regulators connected to pin INH are disabled, avoiding the extra power consumption in case of a short-circuit condition. After a waiting time (fixed by the same timers used for setting UVNOM) any wake-up request or setting of the pwon flag will clear UVNOM and the timers, allowing the voltage regulators to be reactivated at least until UVNOM is set again. WAKE-UP SOURCE FLAG Wake-up source recognition is provided via the wake-up source flag, which is set when the wake-up flag is set by a local wake-up request via pin WAKE. The wake-up source flag can only be set after the pwon flag is cleared. In normal mode the wake-up source flag can be made available on pin ERR. The flag is cleared at power-on or when the transceiver leaves normal mode. BUS FAILURE FLAG The bus failure flag is set if the transceiver detects a bus line short-circuit condition to VBAT, VCC or GND during four consecutive dominant-recessive cycles on pin TXD, when trying to drive the bus lines dominant. In normal mode the bus failure flag can be made available on pin ERR. The flag is cleared when the transceiver re-enters normal mode. UVBAT FLAG UVBAT is the VBAT undervoltage detection flag. The flag is set when the voltage on pin VBAT drops below VBAT(stb). When UVBAT is set, the transceiver will try to enter standby mode to save power and not disturb the bus. UVBAT is cleared when the voltage on pin VBAT has recovered. The transceiver will then return to the operating mode determined by the logic state of pins STB and EN. LOCAL FAILURE FLAG In normal mode or pwon/listen-only mode the transceiver can recognize five different local failures, and will combine them into one local failure flag. The five local failures are: TXD dominant clamping, RXD recessive clamping, a TXD-to-RXD short circuit, bus dominant clamping, and over-temperature. Nature and detection of these local failures is described in Section “Local failures”. In pwon/listen-only mode the local failure flag can be made available on pin ERR. The flag is cleared when entering normal mode or when RXD is dominant while TXD is recessive, provided that all local failures are resolved. PWON FLAG Pwon is the VBAT power-on flag. This flag is set when the voltage on pin VBAT has recovered after it dropped below VBAT(pwon), particularly after the transceiver was disconnected from the battery. By setting the pwon flag, the UVNOM flag and timers are cleared and the transceiver cannot enter sleep mode. This ensures that any voltage regulator connected to pin INH is activated when the node is reconnected to the battery. In pwon/listen-only mode the pwon flag can be made available on pin ERR. The flag is cleared when the transceiver enters normal mode. Local failures WAKE-UP FLAG The TJA1041A can detect five different local failure conditions. Any of these failures will set the local failure flag, and in most cases the transmitter of the transceiver will be disabled. The following sections give the details. The wake-up flag is set when the transceiver detects a local or a remote wake-up request. A local wake-up request is detected when a logic state change on pin WAKE remains stable for at least twake. A remote wake-up request is detected after two bus dominant states of at least tBUSdom (with each dominant state followed by a recessive state of at least tBUSrec). The wake-up flag can only be set in standby mode, go-to-sleep command mode or sleep mode. Setting of the flag is blocked during the UVNOM flag waiting time. By setting the wake-up flag, the UVNOM flag and timers are cleared. The wake-up flag is immediately available on pins ERR and RXD (provided 2004 Feb 20 TXD DOMINANT CLAMPING DETECTION A permanent LOW level on pin TXD (due to a hardware or software application failure) would drive the CAN bus into a permanent dominant state, blocking all network communication. The TXD dominant time-out function prevents such a network lock-up by disabling the transmitter of the transceiver if pin TXD remains at a LOW level for longer than the TXD dominant time-out tdom(TXD). 9 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A The tdom(TXD) timer defines the minimum possible bit rate of 40 kbit/s. The transmitter remains disabled until the local failure flag is cleared. junction temperature exceeds the shutdown junction temperature Tj(sd). The transmitter remains disabled until the local failure flag is cleared. RXD RECESSIVE CLAMPING DETECTION Recessive bus voltage stabilization An RXD pin clamped to HIGH level will prevent the controller connected to this pin from recognizing a bus dominant state. So the controller can start messages at any time, which is likely to disturb all bus communication. RXD recessive clamping detection prevents this effect by disabling the transmitter when the bus is in dominant state without RXD reflecting this. The transmitter remains disabled until the local failure flag is cleared. In recessive state the output impedance of transceivers is relatively high. In a partially powered network (supply voltage is off in some of the nodes) any deactivated transceiver with a significant leakage current is likely to load the recessive bus to ground. This will cause a common-mode voltage step each time transmission starts, resulting in increased ElectroMagnetic Emission (EME). Using pin SPLIT of the TJA1041A in combination with split termination (see Fig.5) will reduce this step effect. In normal mode and pwon/listen-only mode pin SPLIT provides a stabilized 0.5VCC DC voltage. In standby mode, go-to-sleep command mode and sleep mode pin SPLIT is set floating. TXD-TO-RXD SHORT-CIRCUIT DETECTION A short-circuit between pins RXD and TXD would keep the bus in a permanent dominant state once the bus is driven dominant, because the low-side driver of RXD is typically stronger than the high-side driver of the controller connected to TXD. The TXD-to-RXD short-circuit detection prevents such a network lock-up by disabling the transmitter. The transmitter remains disabled until the local failure flag is cleared. I/O level adapter The TJA1041A is equipped with a built-in I/O-level adapter. By using the supply voltage of the controller (to be supplied at pin VI/O) the level adapter ratio-metrically scales the I/O-levels of the transceiver. For pins TXD, STB and EN the digital input threshold level is adjusted, and for pins RXD and ERR the HIGH-level output voltage is adjusted. This allows the transceiver to be directly interfaced with controllers on supply voltages between 2.8 V and 5.25 V, without the need for glue logic. BUS DOMINANT CLAMPING DETECTION A CAN bus short circuit (to VBAT, VCC or GND) or a failure in one of the other network nodes could result in a differential voltage on the bus high enough to represent a bus dominant state. Because a node will not start transmission if the bus is dominant, the normal bus failure detection will not detect this failure, but the bus dominant clamping detection will. The local failure flag is set if the dominant state on the bus persists for longer than tdom(bus). By checking this flag, the controller can determine if a clamped bus is blocking network communication. There is no need to disable the transmitter. Note that the local failure flag does not retain a bus dominant clamping failure, and is released as soon as the bus returns to recessive state. Pin WAKE Pin WAKE of the TJA1041A allows local wake-up triggering by a LOW to HIGH state change as well as a HIGH to LOW state change. This gives maximum flexibility when designing a local wake-up circuit. To keep current consumption at a minimum, after a twake delay the internal bias voltage of pin WAKE will follow the logic state of this pin. A HIGH level on pin WAKE is followed by an internal pull-up to VBAT. A LOW level on pin WAKE is followed by an internal pull-down towards GND. To ensure EMI performance in applications not using local wake-up it is recommended to connect pin WAKE to pin VBAT or to pin GND. OVER-TEMPERATURE DETECTION To protect the output drivers of the transceiver against overheating, the transmitter will be disabled if the virtual 2004 Feb 20 10 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC VI/O VBAT PARAMETER DC voltage on pin VCC DC voltage on pin VI/O DC voltage on pin VBAT CONDITIONS MIN. MAX. UNIT no time limit −0.3 +6 V operating range 4.75 5.25 V no time limit −0.3 +6 V operating range 2.8 5.25 V no time limit −0.3 +40 V operating range 5 27 V load dump − 40 V VTXD DC voltage on pin TXD −0.3 VI/O + 0.3 V VRXD DC voltage on pin RXD −0.3 VI/O + 0.3 V VSTB DC voltage on pin STB −0.3 VI/O + 0.3 V VEN DC voltage on pin EN −0.3 VI/O + 0.3 V VERR DC voltage on pin ERR −0.3 VI/O + 0.3 V VINH DC voltage on pin INH −0.3 VBAT + 0.3 V VWAKE DC voltage on pin WAKE −0.3 VBAT + 0.3 V IWAKE DC current on pin WAKE − −15 mA VCANH DC voltage on pin CANH 0 < VCC < 5.25 V; no time limit −27 +40 V VCANL DC voltage on pin CANL 0 < VCC < 5.25 V; no time limit −27 +40 V VSPLIT DC voltage on pin SPLIT 0 < VCC < 5.25 V; no time limit −27 +40 V Vtrt transient voltages on pins CANH, according to ISO 7637; see Fig.6 −200 CANL, SPLIT and VBAT +200 V Vesd electrostatic discharge voltage Tvj virtual junction temperature Tstg storage temperature Human Body Model (HBM); note 1 pins CANH, CANL and SPLIT −6 +6 kV all other pins −4 +4 kV Machine Model (MM); note 2 −200 +200 V note 3 −40 +150 °C −55 +150 °C Notes 1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor (6 kV level with pin GND connected to ground). 2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor. 3. Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tvj = Tamb + P × Rth(vj-amb), where Rth(vj-amb) is a fixed value. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in SO14 package in free air 120 K/W Rth(j-s) thermal resistance from junction to substrate of bare die 40 K/W 2004 Feb 20 11 in free air Philips Semiconductors Product specification High speed CAN transceiver TJA1041A QUALITY SPECIFICATION Quality specification in accordance with “AEC-Q100”. CHARACTERISTICS VCC = 4.75 V to 5.25 V; VI/O = 2.8 V to VCC; VBAT = 5 V to 27 V; RL = 60 Ω; Tvj = −40 °C to +150 °C; unless specified otherwise; all voltages are defined with respect to ground; positive currents flow into the device; note 1. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies (pins VBAT, VCC and VI/O) VCC(sleep) VCC undervoltage detection level for forced sleep mode VI/O(sleep) 2.75 3.3 4.5 V VI/O undervoltage detection level for forced sleep mode 0.5 1.5 2 V VBAT(stb) VBAT voltage level for fail-safe VCC = 5 V (fail-safe) fallback mode 2.75 3.3 4.5 V VBAT(pwon) VBAT voltage level for setting pwon flag VCC = 0 V 2.5 3.3 4.1 V ICC VCC input current normal mode; VTXD = 0 V (dominant) 25 55 80 mA normal or pwon/listen-only mode; VTXD = VI/O (recessive) 2 6 10 mA standby or sleep mode − 1 10 µA normal mode; VTXD = 0 V (dominant) 100 350 1000 µA normal or pwon/listen-only mode; VTXD = VI/O (recessive) 15 80 200 µA standby or sleep mode − 0 5 µA normal or pwon/listen-only mode 15 30 40 µA standby mode; 10 VCC > 4.75 V; VI/O = 2.8 V; VINH = VWAKE = VBAT = 12 V 20 30 µA sleep mode; VINH = VCC = VI/O = 0 V; VWAKE = VBAT = 12 V 20 30 µA II/O IBAT VI/O input current VBAT input current VBAT = 12 V (fail-safe) 10 Transmitter data input (pin TXD) VIH HIGH-level input voltage 0.7VI/O − VCC + 0.3 V VIL LOW-level input voltage −0.3 − 0.3VI/O V IIH HIGH-level input current normal or pwon/listen-only mode; VTXD = VI/O −5 0 +5 µA IIL LOW-level input current normal or pwon/listen-only mode; VTXD = 0.3VI/O −70 −250 −500 µA Ci input capacitance not tested − 5 10 pF 2004 Feb 20 12 Philips Semiconductors Product specification High speed CAN transceiver SYMBOL TJA1041A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Receiver data output (pin RXD) IOH HIGH-level output current VRXD = VI/O − 0.4 V; VI/O = VCC −1 −3 −6 mA IOL LOW-level output current VRXD = 0.4 V; VTXD = VI/O; bus dominant 2 5 12 mA Standby and enable control inputs (pins STB and EN) VIH HIGH-level input voltage 0.7VI/O − VCC + 0.3 V VIL LOW-level input voltage −0.3 − 0.3VI/O V IIH HIGH-level input current VSTB = VEN = 0.7VI/O 1 4 10 µA IIL LOW-level input current VSTB = VEN = 0 V − 0 −1 µA Error and power-on indication output (pin ERR) IOH HIGH-level output current VERR = VI/O − 0.4 V; VI/O = VCC −4 −20 −50 µA IOL LOW-level output current VERR = 0.4 V 0.1 0.2 0.35 mA Local wake-up input (pin WAKE) IIH HIGH-level input current VWAKE = VBAT − 1.9 V −1 −5 −10 µA IIL LOW-level input current VWAKE = VBAT − 3.1 V 1 5 10 µA Vth threshold voltage VSTB = 0 V VBAT − 3 VBAT − 2.5 VBAT − 2 V Inhibit output (pin INH) ∆VH HIGH-level voltage drop IINH = −0.18 mA 0.05 0.2 0.8 V IL leakage current sleep mode − 0 5 µA pin CANH 3 3.6 4.25 V pin CANL 0.5 1.4 1.75 V Bus lines (pins CANH and CANL) VO(dom) dominant output voltage VTXD = 0 V VO(dom)(m) matching of dominant output voltage (VCC − VCANH − VCANL) −0.1 − +0.15 V VO(dif)(bus) differential bus output voltage VTXD = 0 V (dominant); (VCANH − VCANL) 45 Ω < RL < 65 Ω 1.5 − 3.0 V VTXD = VI/O (recessive); no load −50 − +50 mV normal or pwon/listen-only mode; VTXD = VI/O; no load 2 0.5VCC 3 V standby or sleep mode; no load −0.1 0 +0.1 V pin CANH; VCANH = 0 −40 −70 −95 mA pin CANL; VCANL = 40 V 40 70 95 mA −2.5 − +2.5 mA VO(reces) IO(sc) IO(reces) 2004 Feb 20 recessive output voltage short-circuit output current recessive output current VTXD = 0 V (dominant) −27 V < VCAN < 32 V 13 Philips Semiconductors Product specification High speed CAN transceiver SYMBOL Vdif(th) TJA1041A PARAMETER differential receiver threshold voltage CONDITIONS MIN. TYP. MAX. UNIT normal or pwon/listen-only mode (see Fig.7); −12 V < VCANH < 12 V; −12 V < VCANL < 12 V 0.5 0.7 0.9 V standby or sleep mode; −12 V < VCANH < 12 V; −12 V < VCANL < 12 V 0.4 0.7 1.15 V Vhys(dif) differential receiver hysteresis voltage normal or pwon/listen-only mode (see Fig.7); −12 V < VCANH < 12 V; −12 V < VCANL < 12 V 50 70 100 mV ILI input leakage current VCC = 0 V VCANH = VCANL = 5 V 100 170 250 µA Ri(cm) common-mode input resistance 15 25 35 kΩ Ri(cm)(m) common-mode input resistance matching VCANH = VCANL −3 0 +3 % Ri(dif) differential input resistance 25 50 75 kΩ Ci(cm) common-mode input capacitance VTXD = VCC; not tested − − 20 pF Ci(dif) differential input capacitance VTXD = VCC; not tested − − 10 pF Rsc(bus) detectable short-circuit resistance between bus lines and VBAT, VCC and GND normal mode 0 − 50 Ω Common-mode stabilization output (pin SPLIT) Vo output voltage normal or pwon/listen-only mode; −500 µA < ISPLIT < 500 µA 0.3VCC 0.5VCC 0.7VCC V IL leakage current standby or sleep mode; −22 V < VSPLIT < 35 V − 0 5 µA Timing characteristics; see Figs 8 and 9 td(TXD-BUSon) delay TXD to bus active normal mode 25 70 110 ns td(TXD-BUSoff) delay TXD to bus inactive normal mode 10 50 95 ns td(BUSon-RXD) delay bus active to RXD normal or pwon/listen-only mode 15 65 115 ns td(BUSoff-RXD) delay bus inactive to RXD normal or pwon/listen-only mode 35 100 160 ns tPD(TXD-RXD) propagation delay TXD to RXD VSTB = 0 V 40 − 255 ns tUV(VCC), tUV(VI/O) undervoltage detection time on VCC and VI/O 5 10 12.5 ms tdom(TXD) TXD dominant time-out VTXD = 0 V 300 600 1000 µs tdom(bus) bus dominant time-out Vdif > 0.9 V 300 600 1000 µs 2004 Feb 20 14 Philips Semiconductors Product specification High speed CAN transceiver SYMBOL TJA1041A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 20 35 50 µs standby or sleep mode; VBAT = 12 V 0.75 1.75 5 µs recessive time for wake-up via bus standby or sleep mode; VBAT = 12 V 0.75 1.75 5 µs minimum wake-up time after receiving a falling or rising edge standby or sleep mode; VBAT = 12 V 5 25 50 µs 155 165 180 °C th(min) minimum hold time of go-to-sleep command tBUSdom dominant time for wake-up via bus tBUSrec twake Thermal shutdown Tj(sd) shutdown junction temperature Note 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at Tamb = 125 °C for dies on wafer level and in addition to this, 100 % tested at Tamb = 125 °C for cased products, unless specified otherwise. For bare dies, all parameters are only guaranteed with the reverse side of the die connected to ground. TEST AND APPLICATION INFORMATION handbook, full pagewidth 3V 5V BAT VBAT VCC INH VI/O VCC STB WAKE EN Port x, y, z ERR TJA1041A RXD GND TXD CANH SPLIT MICROCONTROLLER RXD TXD CANL MNB116 CAN bus wires Fig.4 Typical application with 3 V microcontroller. 2004 Feb 20 15 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A VCC handbook, full pagewidth TJA1041A CANH 60 Ω R VSPLIT = 0.5VCC in normal mode and pwon/listen-only mode; otherwise floating VSPLIT SPLIT 60 Ω R CANL MNB117 GND Fig.5 Stabilization circuitry and application. + 12 V handbook, full pagewidth +5 V 47 µF 100 nF 5 TXD EN STB WAKE VCC VI/O 3 10 µF VBAT 10 1 13 CANH 6 12 14 9 TJA1041A 11 8 500 kHz 7 4 CANL 1 nF 1 nF TRANSIENT GENERATOR SPLIT ERR INH RXD 2 GND MNB118 The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7. Fig.6 Test circuit for automotive transients. 2004 Feb 20 16 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A handbook, full pagewidth MGS378 VRXD HIGH LOW hysteresis 0.5 0.9 Vi(dif)(bus) (V) Fig.7 Hysteresis of the receiver. + 12 V handbook, full pagewidth +5 V 47 µF 100 nF 5 TXD EN STB WAKE VCC VI/O 3 10 µF VBAT 10 13 1 CANH 6 14 9 12 TJA1041A 11 8 7 4 CANL RL 60 Ω SPLIT ERR INH RXD 2 15 pF GND MNB119 Fig.8 Test circuit for timing characteristics. 2004 Feb 20 17 CL 100 pF Philips Semiconductors Product specification High speed CAN transceiver TJA1041A HIGH handbook, full pagewidth TXD LOW CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)(1) 0.5 V recessive (BUS off) HIGH RXD 0.7VCC 0.3VCC LOW t d(TXD-BUSon) t d(TXD-BUSoff) t d(BUSon-RXD) t d(BUSoff-RXD) t PD(TXD-RXD) t PD(TXD-RXD) MGS377 (1) Vi(dif)(bus) = VCANH − VCANL. Fig.9 Timing diagram. BONDING PAD LOCATIONS COORDINATES(1) SYMBOL PAD x y 1 handbook, halfpage TXD 1 664.25 3004.5 GND 2 75.75 3044.25 VCC 3 115.5 2573 RXD 4 115.5 1862.75 VI/O 5 115.5 115.5 EN 6 264.5 114 INH 7 667.75 85 ERR 8 1076.75 115.5 WAKE 9 1765 85 VBAT 10 1765 792.5 SPLIT 11 1765 1442.25 CANL 12 1765 2115 CANH 13 1751 3002.5 STB 14 940.75 3004.5 14 2 13 3 12 4 TJA1041AU 11 10 5 x 9 0 6 0 y 7 8 MDB634 Note The reverse side of the bare die must be connected to ground. 1. All x/y coordinates represent the position of the centre of each pad (in µm) with respect to the left hand bottom corner of the top aluminium layer. 2004 Feb 20 Fig.10 Bonding pad locations. 18 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2004 Feb 20 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 19 o 8 o 0 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. • below 225 °C (SnPb process) or below 245 °C (Pb-free process) Manual soldering – for all BGA, HTSSON-T and SSOP-T packages Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2004 Feb 20 20 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable PLCC(5), SO, SOJ suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages. 2004 Feb 20 21 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2004 Feb 20 22 Philips Semiconductors Product specification High speed CAN transceiver TJA1041A Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2004 Feb 20 23 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA76 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R16/02/pp24 Date of release: 2004 Feb 20 Document order number: 9397 750 12824