PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1 42 terminal 1 index area 56 43 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 8.1 7.9 5.35 5.05 8.1 7.9 5.35 5.05 0.5 6.5 6.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT684-2 --- MO-220 --- EUROPEAN PROJECTION ISSUE DATE 02-04-24 02-10-22