PHILIPS SOT685-1

PDF: 2002 Nov 27
Philips Semiconductors
Package outline
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 6 x 5 x 0.85 mm
SOT685-1
0
2.5
X
5 mm
scale
A
B
D
A
A1
c
E
detail X
terminal 1
index area
C
e1
terminal 1
index area
b
e
1
y
y1 C
v M C A B
w M C
4
L
Eh
exposed tie bar (4×)
eh
8
5
Dh
DIMENSIONS (mm are the original dimensions)
(1)
UNIT
A
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
eh
L
v
w
y
y1
mm
1
0.05
0.00
0.5
0.3
0.2
5.15
4.85
3.95
3.65
6.15
5.85
3.65
3.35
1.27
3.81
0.35
0.75
0.50
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
SOT685-1
REFERENCES
IEC
JEDEC
---
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-08-12
02-11-27