INTEGRATED CIRCUITS 74ABT863 9-bit bus transceiver (3-State) Product specification Supersedes data of 1993 Jun 21 IC23 Data Handbook 1998 Jan 16 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 • Power-up 3-State • Live insertion/extraction permitted • Inputs are disabled during 3-State mode FEATURES • Provides high performance bus interface buffering for wide data/address paths or buses carrying parity • Buffered control inputs for light loading, or increased fan-in as required with MOS microprocessors DESCRIPTION • Output capability: +64mA/–32mA • Latch-up protection exceeds 500mA per Jedec Std 17 • ESD protection exceeds 2000V per MIL STD 883 Method 3015 The 74ABT863 bus transceiver provides high performance bus interface buffering for wide data/address paths of buses carrying parity. The 74ABT863 9-bit bus transceiver has NOR-ed transmit and receive output enables for maximum control flexibility. and 200 V per Machine Model QUICK REFERENCE DATA SYMBOL CONDITIONS Tamb = 25°C; GND = 0V PARAMETER TYPICAL UNIT 3.3 ns tPLH tPHL Propagation delay An to Bn or Bn to An CL = 50pF; VCC = 5V CIN Input capacitance VI = 0V or VCC 4 pF CI/O I/O capacitance Outputs disabled; VO = 0V or VCC 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 110 µA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 24-Pin Plastic DIP –40°C to +85°C 74ABT863 N 74ABT863 N SOT222-1 24-Pin plastic SO –40°C to +85°C 74ABT863 D 74ABT863 D SOT137-1 24-Pin Plastic SSOP Type II –40°C to +85°C 74ABT863 DB 74ABT863 DB SOT340-1 24-Pin Plastic TSSOP Type I –40°C to +85°C 74ABT863 PW 74ABT863PW DH SOT355-1 PIN CONFIGURATION PIN DESCRIPTION OEBA0 1 24 VCC A0 2 23 B0 A1 3 22 B1 A2 4 21 B2 A3 5 20 B3 A4 6 19 B4 TOP VIEW A5 7 18 B5 A6 8 17 B6 A7 9 16 B7 B8 A8 10 15 OEBA1 11 14 OEAB0 GND 12 13 OEAB1 PIN NUMBER SYMBOL FUNCTION 14, 13 OEAB0, OEAB1 2, 3, 4, 5, 6, 7, 8, 9, 10 A0-A8 Data inputs/outputs (A side) 23, 22, 21, 20, 19, 18, 17, 16, 15 B0-B8 Data inputs/outputs (B side) 1, 11 OEBA0, OEBA1 12 GND Ground (0V) 24 VCC Positive supply voltage Output enable inputs (active-Low) Output enable inputs (active-Low) SA00283 1998 Jan 16 2 853–1622 18869 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 LOGIC SYMBOL LOGIC SYMBOL (IEEE/IEC) 1 & 11 2 3 4 5 6 7 8 9 10 EN1(BA) 14 13 & EN2(AB) A0 A1 A2 A3 A4 A5 A6 A7 A8 1 OEBA0 11 OEBA1 2 23 1 2 14 OEAB0 3 22 13 OEAB1 4 21 5 20 6 19 7 18 8 17 B0 B1 B2 B3 B4 B5 B6 B7 B8 23 22 21 20 19 18 17 16 15 9 16 10 15 SA00285 SA00284 FUNCTION TABLE LOGIC DIAGRAM INPUTS OEAB0 OEAB1 OEBA0 OEBA1 L L L L H X X H A data to B bus A data to B bus H X X H L L L L B data to A bus B data to A bus H Z H H L X Z OPERATING = = = = H H High voltage level Low voltage level Don’t care High impedance “off” state OEAB0 MODE OEAB1 9 9 An Bn OEBA0 OEBA1 SA00286 ABSOLUTE MAXIMUM RATINGS1, 2 PARAMETER SYMBOL VCC IIK CONDITIONS RATING UNIT –0.5 to +7.0 V –18 mA –1.2 to +7.0 V VO < 0 –50 mA output in Off or High state –0.5 to +5.5 V output in Low state 128 mA –65 to 150 °C DC supply voltage DC input diode current VI < 0 voltage3 VI DC input IOK DC output diode current voltage3 VOUT DC output IOUT DC output current Tstg Storage temperature range NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jan 16 3 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 RECOMMENDED OPERATING CONDITIONS SYMBOL VCC PARAMETER LIMITS DC supply voltage UNIT Min Max 4.5 5.5 V 0 VCC V VI Input voltage VIH High-level input voltage VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA 0 5 ns/V –40 +85 °C 2.0 ∆t/∆v Input transition rise or fall rate Tamb Operating free-air temperature range V DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Min VCC = 4.5V; IIK = –18mA Typ Max –0.9 –1.2 VIK Input clamp voltage VOH High-level output voltage VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 Input leakage Control pins VCC = 5.5V; VI = GND or 5.5V ±0.01 current Data pins VCC = 5.5V; VI = GND or 5.5V ±5 II Tamb = –40°C to +85°C Tamb = +25°C Min UNIT Max –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 3.2 2.5 V VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.7 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.3 2.0 0.55 V 0.55 V ±1.0 ±1.0 µA ±100 ±100 µA Power-off leakage current VCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA Power-up/down 3-State output current3 VCC = 2.0V; VO = 0.5V; VI = GND or VCC; = V OE= Don’t care ±5.0 ±50 ±50 µA IIH + IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IIL + IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output high leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC Output current1 VCC = 5.5V; VO = 2.5V IOFF IPU/PD IO ICCH ICCL Quiescent supply current ICCZ ∆ICC Additional supply current per input pin2 50 µA –180 mA 250 250 µA 25 38 38 mA 110 250 250 µA Outputs enabled, one input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA Outputs 3-State, one data input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 110 250 250 µA Outputs 3-State, one enable input at 3.4V, other inputs at VCC or GND; VCC = 5.5V 0.5 1.5 1.5 mA 5.0 50 –63 –180 VCC = 5.5V; Outputs High, VI = GND or VCC 110 VCC = 5.5V; Outputs Low, VI = GND or VCC VCC = 5.5V; Outputs 3–State; VI = GND or VCC –50 –50 NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V, with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10%, a transition time of up to 100µsec is permitted. 1998 Jan 16 4 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 AC CHARACTERISTICS GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω LIMITS SYMBOL tPLH tPHL PARAMETER Propagation delay A0–7 to B0–7 or Bn to An A8 to B8 An to Bn or Bn to An Min Typ Max Min Max 1.3 1.3 1.2 3.3 4.5 2.8 4.8 5.9 4.6 1.3 2.5 1.2 5.3 6.3 5.2 3 1.3 1.3 2.2 4.3 4.9 5.2 5.5 6.4 6.3 1.3 2.4 2.2 6.5 7.5 7.3 2 3 3.0 2.5 5.0 4.8 6.3 6.3 3.0 2.5 7.1 6.8 1 tPZL Output enable time OEBAn to An or OEABn to B0–7 OEABn to B8 OEBAn to An or OEABn to Bn tPHZ tPLZ Output disable time from High and Low level tPZH Tamb = -40 to +85oC VCC = +5.0V ±0.5V Tamb = +25oC VCC = +5.0V WAVEFORM 2 UNIT ns ns ns AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V OEBAn OEABn An or Bn VM VM VM VM tPZH tPLH An, Bn Bn or An tPHZ tPHL VM VM VOH –0.3V VM 0V SA00287 Waveform 2. 3-State Output Enable Time to High Level and Output Disable Time from High Level SA00099 Waveform 1. Propagation Delay for Data to Outputs OEBAn OEABn VM VM tPZL An, Bn tPLZ VM VOL +0.3V 0V SA00288 Waveform 3. 3-State Output Enable Time to Low Level and Output Disable Time from Low Level 1998 Jan 16 5 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 TEST CIRCUIT AND WAVEFORM 7V 500 Ω From Output Under Test S1 Open GND 500 Ω CL = 50 pF Load Circuit TEST S1 tpd open tPLZ/tPZL 7V tPHZ/tPZH open DEFINITIONS Load capacitance includes jig and probe capacitance; CL = see AC CHARACTERISTICS for value. SA00012 1998 Jan 16 6 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 DIP24: plastic dual in-line package; 24 leads (300 mil) 1998 Jan 16 7 SOT222-1 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 SO24: plastic small outline package; 24 leads; body width 7.5 mm 1998 Jan 16 8 SOT137-1 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm 1998 Jan 16 9 SOT340-1 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm 1998 Jan 16 10 SOT355-1 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 NOTES 1998 Jan 16 11 Philips Semiconductors Product specification 9-bit bus transceiver (3-State) 74ABT863 Data sheet status Data sheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 print code Document order number: yyyy mmm dd 12 Date of release: 05-96 9397-750-03477