74AUP2G07 Low-power dual buffer with open-drain output Rev. 02 — 12 June 2007 Product data sheet 1. General description The 74AUP2G07 provides two non-inverting buffers with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions. Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features ■ Wide supply voltage range from 0.8 V to 3.6 V ■ High noise immunity ■ Complies with JEDEC standards: ◆ JESD8-12 (0.8 V to 1.3 V) ◆ JESD8-11 (0.9 V to 1.65 V) ◆ JESD8-7 (1.2 V to 1.95 V) ◆ JESD8-5 (1.8 V to 2.7 V) ◆ JESD8-B (2.7 V to 3.6 V) ■ ESD protection: ◆ HBM JESD22-A114E Class 3A exceeds 5000 V ◆ MM JESD22-A115-A exceeds 200 V ◆ CDM JESD22-C101C exceeds 1000 V ■ Low static-power consumption; ICC = 0.9 µA (maximum) ■ Latch-up performance exceeds 100 mA per JESD 78 Class II ■ Inputs accept voltages up to 3.6 V ■ Low noise overshoot and undershoot < 10 % of VCC ■ IOFF circuitry provides partial Power-down mode operation ■ Multiple package options ■ Specified from −40 °C to +85 °C and −40 °C to +125 °C 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74AUP2G07GW −40 °C to +125 °C SC-88 plastic surface-mounted package; 6 leads SOT363 74AUP2G07GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 × 1.45 × 0.5 mm 74AUP2G07GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 × 1 × 0.5 mm 4. Marking Table 2. Marking Type number Marking code 74AUP2G07GW p7 74AUP2G07GM p7 74AUP2G07GF p7 5. Functional diagram 1 1A 1Y 6 3 2A 2Y 4 1A 1 6 1Y Y 2A 3 4 2Y A GND mnb092 Fig 1. Logic symbol mnb093 Fig 2. IEC logic symbol 74AUP2G07_2 Product data sheet mna625 Fig 3. Logic diagram (one gate) © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 2 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 6. Pinning information 6.1 Pinning 74AUP2G07 74AUP2G07 1A 1 6 1A 1 6 1Y GND 2 5 VCC 1Y GND 2 5 VCC 2A 3 4 2Y 2A 3 4 2Y 001aad707 Transparent top view 001aad706 Fig 4. Pin configuration SOT363-1 (SC-88) Fig 5. Pin configuration SOT886 (XSON6) 74AUP2G07 1A 1 6 1Y GND 2 5 VCC 2A 3 4 2Y 001aad665 Transparent top view Fig 6. Pin configuration SOT891 (XSON6) 6.2 Pin description Table 3. Pin description Symbol Pin Description 1A 1 data input GND 2 ground (0 V) 2A 3 data input 2Y 4 data output VCC 5 supply voltage 1Y 6 data output 7. Functional description Table 4. Function table[1] Input Output nA nY L L H Z [1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF state. 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 3 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current Conditions VI < 0 V [1] VO < 0 V VO output voltage Active mode and Power-down mode VO = 0 V to VCC [1] Min Max Unit −0.5 +4.6 V −50 - mA −0.5 +4.6 V - −50 mA −0.5 +4.6 V IO output current - 20 mA ICC supply current - 50 mA IGND ground current −50 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For SC-88 package: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature ∆t/∆V input transition rise and fall rate Conditions Active mode and Power-down mode VCC = 0.8 V to 3.6 V 74AUP2G07_2 Product data sheet Min Max Unit 0.8 3.6 V 0 3.6 V 0 3.6 V −40 +125 °C 0 200 ns/V © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 4 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min VCC = 0.8 V VCC = 0.9 V to 1.95 V Typ Max Unit 0.70 × VCC - - V 0.65 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.31 V IO = 1.9 mA; VCC = 1.65 V - - 0.31 V IO = 2.3 mA; VCC = 2.3 V - - 0.31 V IO = 3.1 mA; VCC = 2.3 V - - 0.44 V IO = 2.7 mA; VCC = 3.0 V - - 0.31 V IO = 4.0 mA; VCC = 3.0 V Tamb = 25 °C VIH VIL VOL HIGH-level input voltage LOW-level input voltage LOW-level output voltage VI = VIH or VIL - - 0.44 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.1 µA IOZ OFF-state output current VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V - - ±0.1 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.2 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.2 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.5 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 40 µA CI input capacitance VCC = 0 V to 3.6 V; VI = GND or VCC - 1.0 - pF CO output capacitance output enabled; VO = GND; VCC = 0 V - 1.2 - pF output disabled; VO = GND; VCC = 0 V - 1.1 - pF VCC = 0.8 V 0.70 × VCC - - V VCC = 0.9 V to 1.95 V 0.65 × VCC - - V Tamb = −40 °C to +85 °C VIH VIL HIGH-level input voltage LOW-level input voltage VCC = 2.3 V to 2.7 V 1.6 - - V VCC = 3.0 V to 3.6 V 2.0 - - V VCC = 0.8 V - - 0.30 × VCC V VCC = 0.9 V to 1.95 V - - 0.35 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 5 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions VOL VI = VIH or VIL LOW-level output voltage Min Typ Max Unit IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.1 V IO = 1.1 mA; VCC = 1.1 V - - 0.3 × VCC V IO = 1.7 mA; VCC = 1.4 V - - 0.37 V IO = 1.9 mA; VCC = 1.65 V - - 0.35 V IO = 2.3 mA; VCC = 2.3 V - - 0.33 V IO = 3.1 mA; VCC = 2.3 V - - 0.45 V IO = 2.7 mA; VCC = 3.0 V - - 0.33 V IO = 4.0 mA; VCC = 3.0 V - - 0.45 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.5 µA IOZ OFF-state output current VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V - - ±0.5 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.5 µA ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.6 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 0.9 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 50 µA VCC = 0.8 V 0.75 × VCC - - V VCC = 0.9 V to 1.95 V 0.70 × VCC - - V VCC = 2.3 V to 2.7 V 1.6 - V V Tamb = −40 °C to +125 °C VIH VIL VOL HIGH-level input voltage LOW-level input voltage LOW-level output voltage - VCC = 3.0 V to 3.6 V 2.0 - - VCC = 0.8 V - - 0.25 × VCC V VCC = 0.9 V to 1.95 V - - 0.30 × VCC V VCC = 2.3 V to 2.7 V - - 0.7 V VCC = 3.0 V to 3.6 V - - 0.9 V IO = 20 µA; VCC = 0.8 V to 3.6 V - - 0.11 V IO = 1.1 mA; VCC = 1.1 V - - 0.33 × VCC V VI = VIH or VIL IO = 1.7 mA; VCC = 1.4 V - - 0.41 V IO = 1.9 mA; VCC = 1.65 V - - 0.39 V IO = 2.3 mA; VCC = 2.3 V - - 0.36 V IO = 3.1 mA; VCC = 2.3 V - - 0.50 V IO = 2.7 mA; VCC = 3.0 V - - 0.36 V IO = 4.0 mA; VCC = 3.0 V - - 0.50 V II input leakage current VI = GND to 3.6 V; VCC = 0 V to 3.6 V - - ±0.75 µA IOZ OFF-state output current VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V to 3.6 V - - ±0.75 µA IOFF power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V - - ±0.75 µA 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 6 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output Table 7. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit ∆IOFF additional power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V to 0.2 V - - ±0.75 µA ICC supply current VI = GND or VCC; IO = 0 A; VCC = 0.8 V to 3.6 V - - 1.4 µA ∆ICC additional supply current VI = VCC − 0.6 V; IO = 0 A; VCC = 3.3 V - - 75 µA 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter 25 °C Conditions Min Typ[1] −40 °C to +125 °C Max Min Max (85 °C) Unit Max (125 °C) CL = 5 pF tpd propagation delay nA to nY; see Figure 7 [2] VCC = 0.8 V - 11.6 - - - - ns VCC = 1.1 V to 1.3 V 2.1 4.1 7.5 1.7 9.1 10.0 ns VCC = 1.4 V to 1.6 V 1.6 3.0 5.1 1.3 6.1 6.7 ns VCC = 1.65 V to 1.95 V 1.6 2.7 4.0 1.2 5.0 5.5 ns VCC = 2.3 V to 2.7 V 1.1 2.1 3.2 0.9 4.0 4.4 ns VCC = 3.0 V to 3.6 V 1.4 2.2 2.8 1.1 3.3 3.6 ns CL = 10 pF tpd propagation delay nA to nY; see Figure 7 [2] VCC = 0.8 V - 14.7 - - - - ns VCC = 1.1 V to 1.3 V 3.0 5.1 9.0 2.4 11.2 12.3 ns VCC = 1.4 V to 1.6 V 2.3 3.8 6.1 2.0 7.4 8.1 ns VCC = 1.65 V to 1.95 V 2.4 3.6 4.8 1.8 6.1 6.7 ns VCC = 2.3 V to 2.7 V 1.7 2.8 3.8 1.3 4.8 5.3 ns VCC = 3.0 V to 3.6 V 2.2 3.1 4.2 1.6 4.5 5.0 ns CL = 15 pF tpd propagation delay nA to nY; see Figure 7 VCC = 0.8 V [2] - 17.7 - - - - ns VCC = 1.1 V to 1.3 V 3.5 6.1 10.4 3.2 13.1 14.5 ns VCC = 1.4 V to 1.6 V 3.0 4.5 6.8 2.6 8.6 9.4 ns VCC = 1.65 V to 1.95 V 2.8 4.4 6.7 2.2 7.8 8.6 ns VCC = 2.3 V to 2.7 V 2.4 3.4 4.5 1.9 5.3 5.8 ns VCC = 3.0 V to 3.6 V 2.2 4.0 5.7 1.9 6.1 6.7 ns CL = 30 pF 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 7 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter tpd 25 °C Conditions Unit Min Max Min Max (85 °C) Max (125 °C) - 26.7 - - - - ns VCC = 1.1 V to 1.3 V 4.8 9.0 15.6 4.3 18.8 20.7 ns VCC = 1.4 V to 1.6 V 4.1 6.7 9.4 3.7 11.8 13.0 ns VCC = 1.65 V to 1.95 V 3.8 6.8 9.7 3.2 11.0 12.1 ns VCC = 2.3 V to 2.7 V 3.7 5.2 6.7 3.0 7.1 7.8 ns VCC = 3.0 V to 3.6 V 3.6 6.4 9.7 2.8 10.4 11.4 ns propagation delay nA to nY; see Figure 7 VCC = 0.8 V [2] 74AUP2G07_2 Product data sheet −40 °C to +125 °C Typ[1] © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 8 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8. Symbol Parameter 25 °C Conditions −40 °C to +125 °C Unit Min Typ[1] Max Min Max (85 °C) Max (125 °C) VCC = 0.8 V - 0.7 - - - - pF VCC = 1.1 V to 1.3 V - 0.7 - - - - pF CL = 5 pF, 10 pF, 15 pF and 30 pF power dissipation capacitance CPD fi = 1 MHz; VI = GND to VCC [3][4] VCC = 1.4 V to 1.6 V - 0.7 - - - - pF VCC = 1.65 V to 1.95 V - 0.7 - - - - pF VCC = 2.3 V to 2.7 V - 0.9 - - - - pF VCC = 3.0 V to 3.6 V - 1.2 - - - - pF [1] All typical values are measured at nominal VCC. [2] tpd is the same as tPZL and tPLZ. [3] All specified values are the average typical values over all stated loads. [4] CPD is used to determine the dynamic power dissipation (PD in µW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. 12. Waveforms VI VM nA input VM GND t PLZ t PZL VCC nY output VM VOL VX mna528 Measurement points are given in Table 9. Logic level: VOL is the typical output voltage drops that occur with the output load. Fig 7. The data input (nA) to output (nY) propagation delays 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 9 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output Table 9. Measurement points Supply voltage Input Output VCC VM VM VX 0.8 V to 1.6 V 0.5 × VCC 0.5 × VCC VOL + 0.1 V 1.65 V to 2.7 V 0.5 × VCC 0.5 × VCC VOL + 0.15 V 3.0 V to 3.6 V 0.5 × VCC 0.5 × VCC VOL + 0.3 V VCC VEXT 5 kΩ VI PULSE GENERATOR VO DUT RT CL RL 001aac521 Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 8. Load circuitry for switching times Table 10. Test data Supply voltage Input Load VEXT VCC VI tr, tf CL 0.8 V to 3.6 V VCC ≤ 3 ns 5 pF, 10 pF, 5 kΩ or 1 MΩ 15 pF and 30 pF [1] RL [1] tPLH, tPHL tPZH, tPHZ tPZL, tPLZ open GND 2 × VCC For measuring enable and disable times RL = 5 kΩ, for measuring propagation delays, set-up and hold times and pulse width RL = 1 MΩ. 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 10 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 13. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT363 JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Fig 9. Package outline SOT363 (SC-88) 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 11 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm SOT886 b 1 2 3 4× (2) L L1 e 6 5 e1 4 e1 6× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A (1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 1.5 1.4 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22 MO-252 Fig 10. Package outline SOT886 (XSON6) 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 12 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm 1 SOT891 b 3 2 4× (1) L L1 e 6 5 e1 4 e1 6× A (1) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 max b D E e e1 L L1 mm 0.5 0.04 0.20 0.12 1.05 0.95 1.05 0.95 0.55 0.35 0.35 0.27 0.40 0.32 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15 SOT891 Fig 11. Package outline SOT891 (XSON6) 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 13 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 14. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes 74AUP2G07_2 20070612 Product data sheet - 74AUP2G07_1 - - Modifications: 74AUP2G07_1 • Added IOZ in Section 10, Table 7 20061121 Product data sheet 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 14 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] 74AUP2G07_2 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 02 — 12 June 2007 15 of 16 74AUP2G07 NXP Semiconductors Low-power dual buffer with open-drain output 18. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 June 2007 Document identifier: 74AUP2G07_2