PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 E SOT263 A A1 P q D1 mounting base D L1 L3 Q L2 m L 1 5 e b c w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D D1 E e L mm 4.5 4.1 1.39 1.27 0.9 0.7 0.7 0.4 15.8 15.2 6.4 5.9 10.3 9.7 1.7 15.0 13.5 L1 (1) 2.4 1.6 L2 (2) 0.5 (3) L3 max. m P q Q w 3.5 0.8 0.6 3.8 3.6 3.0 2.7 2.6 2.2 0.4 Notes 1. Terminal dimensions are uncontrolled in this zone. 2. Positional accuracy of the terminals is controlled in this zone. 3. Terminals in this zone are not tinned. OUTLINE VERSION SOT263 REFERENCES IEC JEDEC 5-lead TO-220 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-11