Package outline Philips Semiconductors Plastic single-ended package (IPAK); 3 leads (in-line) SOT533 E A E1 A1 D1 mounting base D2 L1 Q L 1 2 3 e1 w b c M e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b c D1 D2 E mm 2.38 2.22 0.89 0.71 0.89 0.71 0.56 0.46 1.10 0.96 6.23 5.97 6.73 6.47 E1 e e1 2.285 5.21 4.57 5.00 BSC (1) BSC (1) L L1 (2) max Q w 9.6 9.2 2.7 1.1 1.0 0.3 Notes 1. Basic spacing between centers. 2. Terminal dimensions are uncontrolled within zone L1. OUTLINE VERSION SOT533 REFERENCES IEC JEDEC JEITA ISSUE DATE 04-09-22 05-02-11 TO-251 SOT533 PDF EUROPEAN PROJECTION © Koninklijke Philips Electronics N.V. 2005. All rights reserved. 15 February 2005 1 of 1