PHILIPS BTA208S-800B

DP
AK
BTA208S-800B
3Q Hi-com Triac
Rev. 03 — 14 April 2011
Product data sheet
1. Product profile
1.1 General description
Planar passivated high commutation three quadrant triac in a SOT428 surface-mountable
plastic package intended for use in circuits where high static and dynamic dV/dt and high
dI/dt can occur. This "series B" triac will commutate the full rated RMS current at the
maximum rated junction temperature without the aid of a snubber.
1.2 Features and benefits
„ 3Q technology for improved noise
immunity
„ High commutation capability with
maximum false trigger immunity
„ High immunity to false turn-on by dV/dt
„ High voltage capability
„ Planar passivated for voltage
ruggedness and reliability
„ Surface-mountable package
„ Triggering in three quadrants only
1.3 Applications
„ Electronic thermostats
„ General purpose motor controls
„ Rectifier-fed DC inductive loads e.g.
DC motors and solenoids
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
VDRM
repetitive peak
off-state voltage
ITSM
non-repetitive peak
on-state current
IT(RMS)
RMS on-state current
Conditions
Min
Typ
Max Unit
-
-
800
V
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; see Figure 4;
see Figure 5
-
-
65
A
full sine wave; Tmb ≤ 102 °C;
see Figure 1; see Figure 2;
see Figure 3
-
-
8
A
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 7
2
18
50
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 7
2
21
50
mA
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 7
2
34
50
mA
Static characteristics
IGT
gate trigger current
BTA208S-800B
NXP Semiconductors
3Q Hi-com Triac
2. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
Simplified outline
1
T1
main terminal 1
2
T2
main terminal 2
3
G
gate
mb
T2
mounting base; main terminal 2
Graphic symbol
mb
T2
T1
G
sym051
2
1
3
SOT428 (DPAK)
3. Ordering information
Table 3.
Ordering information
Type number
Package
BTA208S-800B
Name
Description
Version
DPAK
plastic single-ended surface-mounted package (DPAK); 3 leads
(one lead cropped)
SOT428
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDRM
repetitive peak off-state voltage
-
800
V
IT(RMS)
RMS on-state current
full sine wave; Tmb ≤ 102 °C; see Figure 1;
see Figure 2; see Figure 3
-
8
A
ITSM
non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
see Figure 4; see Figure 5
-
65
A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms
-
72
A
I2t
I2t
tp = 10 ms; sine-wave pulse
-
21
A2s
dIT/dt
rate of rise of on-state current
IT = 12 A; IG = 0.2 A; dIG/dt = 0.2 A/µs
-
100
A/µs
IGM
peak gate current
-
2
A
VGM
peak gate voltage
-
5
V
PGM
peak gate power
-
5
W
PG(AV)
average gate power
-
0.5
W
Tstg
storage temperature
-40
150
°C
Tj
junction temperature
-
125
°C
BTA208S-800B
Product data sheet
for fusing
over any 20 ms period
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Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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BTA208S-800B
NXP Semiconductors
3Q Hi-com Triac
003aaf581
10
IT(RMS)
IT(RMS)
(A)
102 °C
(A)
8
20
6
15
4
10
2
5
0
0
−50
Fig 1.
003aaf617
25
0
50
100
150
Tmb (°C)
RMS on-state current as a function of heatsink
temperature; maximum values
Fig 2.
10−2
10−1
1
10
surge duration (s)
RMS on-state current as a function of surge
duration; maximum value
003aaf618
12
Ptot
(W)
10
8
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
α = 180°
120°
101
Tmb(max)
(°C)
105
90°
α
109
60°
6
113
30°
4
117
2
121
0
0
2
4
6
125
10
8
IT(RMS) (A)
Fig 3.
Total power dissipation as a function of RMS on-state current; maximum values
BTA208S-800B
Product data sheet
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Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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BTA208S-800B
NXP Semiconductors
3Q Hi-com Triac
003aaa968
80
ITSM
(A)
60
40
ITSM
IT
20
t
T
Tj(init) = 25 °C max
0
102
10
1
103
number of cycles
Fig 4.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
003aab121
103
ITSM
IT
t
ITSM
(A)
tp
Tj(init) = 25 °C max
(1)
102
10
10−2
10−1
1
102
10
tp (ms)
Fig 5.
Non-repetitive peak on-state current as a function of pulse width; maximum values
BTA208S-800B
Product data sheet
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© NXP B.V. 2011. All rights reserved.
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3Q Hi-com Triac
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance from junction to
mounting base
full cycle; see Figure 6
-
-
2
K/W
half cycle; see Figure 6
-
-
2.4
K/W
thermal resistance from junction to
ambient
in free air; printed circuit board
(FR4) mounted
-
75
-
K/W
Rth(j-a)
003aaf584
10
Zth(j-mb)
(K/W)
unidirectional
1
bidirectional
10−1
P
tp
10−2
10−5
10−4
10−3
10−2
10−1
1
t
10
tp (s)
Fig 6.
Transient thermal impedance from junction to mounting base as a function of pulse width
BTA208S-800B
Product data sheet
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Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
3Q Hi-com Triac
6. Characteristics
Table 6.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C;
see Figure 7
2
18
50
mA
VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C;
see Figure 7
2
21
50
mA
VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C;
see Figure 7
2
34
50
mA
VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C;
see Figure 8
-
31
60
mA
VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C;
see Figure 8
-
34
90
mA
VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C;
see Figure 8
-
30
60
mA
Static characteristics
IGT
IL
gate trigger current
latching current
IH
holding current
VD = 12 V; Tj = 25 °C; see Figure 9
-
31
60
mA
VT
on-state voltage
IT = 10 A; Tj = 25 °C; see Figure 10
-
1.3
1.65
V
VGT
gate trigger voltage
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
see Figure 11
-
0.7
1.5
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
see Figure 11
0.25
0.4
-
V
VD = 800 V; Tj = 125 °C
-
0.1
0.5
mA
ID
off-state current
Dynamic characteristics
dVD/dt
rate of rise of off-state
voltage
VDM = 535 V; Tj = 125 °C; exponential
waveform; gate open circuit
1000
4000
-
V/µs
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 8 A;
dVcom/dt = 20 V/µs; gate open circuit;
snubberless condition; see Figure 12
-
14
-
A/ms
tgt
gate-controlled turn-on
time
ITM = 12 A; VD = 800 V; IG = 0.1 A;
dIG/dt = 5 A/µs
-
2
-
µs
BTA208S-800B
Product data sheet
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Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
3Q Hi-com Triac
003aac888
3
001aab100
3
(1)
IGT
IL
IGT(25°C)
IL(25°C)
2
2
(2)
(3)
1
1
0
−50
0
50
100
0
−50
150
Tj (°C)
0
50
100
150
Tj (°C)
(1) T2- G(2) T2+ G(3) T2+ G+
Fig 7.
Normalized gate trigger current as a function of
junction temperature
001aab099
3
Fig 8.
Normalized latching current as a function of
junction temperature
003aaa971
25
IT
(A)
IH
IH(25°C)
20
2
15
10
1
5
(1)
0
−50
(2)
(3)
0
0
50
100
150
0
1
2
VT (V)
Tj (°C)
3
Vo = 1.264 V; Rs = 0.0378 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9.
Normalized holding current as a function of
junction temperature
BTA208S-800B
Product data sheet
Fig 10. On-state current as a function of on-state
voltage
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© NXP B.V. 2011. All rights reserved.
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BTA208S-800B
NXP Semiconductors
3Q Hi-com Triac
001aab101
1.6
VGT
001aac675
103
VGT(25°C)
dlcom/dt
(A/ms)
1.2
102
0.8
10
0.4
−50
1
0
50
100
150
Product data sheet
60
100
140
Tj (°C)
Fig 11. Normalized gate trigger voltage as a function of
junction temperature
BTA208S-800B
20
Tj (°C)
Fig 12. Rate of rise of commutating current as a
function of junction temperature; typical values
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© NXP B.V. 2011. All rights reserved.
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3Q Hi-com Triac
7. Package outline
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
SOT428
y
E
A
A
A1
b2
E1
mounting
base
D2
D1
HD
2
L
L2
1
L1
3
b1
b
w
M
c
A
e
e1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
b1
b2
c
D1
D2
min
E
E1
min
e
e1
HD
L
L1
min
L2
w
y
max
mm
2.38
2.22
0.93
0.46
0.89
0.71
1.1
0.9
5.46
5.00
0.56
0.20
6.22
5.98
4.0
6.73
6.47
4.45
2.285
4.57
10.4
9.6
2.95
2.55
0.5
0.9
0.5
0.2
0.2
OUTLINE
VERSION
SOT428
REFERENCES
IEC
JEDEC
JEITA
TO-252
SC-63
EUROPEAN
PROJECTION
ISSUE DATE
06-02-14
06-03-16
Fig 13. Package outline SOT428 (DPAK)
BTA208S-800B
Product data sheet
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Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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3Q Hi-com Triac
8. Soldering
7.00
6.15
5.90
5.80
1.80
1.00
4.725
4.60
5.75 5.65
6.50
1.15
3.60
6.00
2.45
6.00
6.125
0.30
2.40 2.30
solder lands
1.30
1.40
1.65
1.50
solder resist
4.57
SOT428
occupied area
solder paste
Fig 14. Reflow soldering footprint for SOT428 (DPAK)
BTA208S-800B
Product data sheet
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Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
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9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BTA208S-800B v.3
20110414
Product data sheet
-
BTA208S_SER_B v.2
Modifications:
BTA208S_SER_B v.2
BTA208S-800B
Product data sheet
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Type number BTA208S-800B separated from data sheet BTA208S_SER_B v.2.
20050531
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 14 April 2011
BTA208S_SERIES_B v.1
© NXP B.V. 2011. All rights reserved.
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10. Legal information
10.1 Data sheet status
Document status [1] [2]
Product status [3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
BTA208S-800B
Product data sheet
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© NXP B.V. 2011. All rights reserved.
12 of 14
BTA208S-800B
NXP Semiconductors
3Q Hi-com Triac
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BTA208S-800B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 14 April 2011
© NXP B.V. 2011. All rights reserved.
13 of 14
BTA208S-800B
NXP Semiconductors
3Q Hi-com Triac
12. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 April 2011
Document identifier: BTA208S-800B