212552

AEC-Q100G Qualification Summary
176ld LQFP
Objective: Spectrum 1.0M POR Fix Qualification
Freescale PN:
Part Name:
Technology:
Package:
Fab / Assembly /
Final Test Sites:
Maskset#:
Rev#:
Die Size (in mm)
WxLxT
Part Operating
Temp. Grade:
Customer Name(s):
PN(s):
Design Engr:
Phone #:
Product Engr:
Phone #:
Prod. Package
Phone #:
NPI PRQE:
Phone #:
PC5606S
Spectrum 1.0M
0.09um CMOS90 Z3 core
LQFP 176ld 24x24 x 1.4 Pitch 0.5
FSL-ATMC / ASE-CL
FSL-KLM-FM
M25V
2
5.465 x 5.430 x 0.3302
125°C
Grade 1
Trace/DateCode
Summary Revision # 1.2
Date: 15th March 2013
Amardeep Punhani
QUARTZ Tracking #:
212552
(Signature/Date shown below may be electronic)
Donald McPhie
PPE Approval
Signature & Date:
NPI PRQE Plan Approval
Signature & Date:
CAB Approval
Signature & Date:
Chasity Fleming
Douglas Blackwood
DD87896
XAA1115A
Not Required
Douglas Blackwood
23rd June 2011
eCAB: 11161289M
Neil Ross 24th June 2011
Qualification Argument
2M25V: Minor Via fix to address Power On Reset (POR) errata e3321, this does not impact the reliability performance or NVM performance of the device; generic data applies as detailed below.
Mask Set Errata MPC560XS_1M25V
e3321 MC_RGM: A non-monotonic ramp on the VDDR line can cause the RGM module to clear all flags in the DES register, meaning that code cannot tell if a POR has occurred.
Qualification Results/Conclusion
The 2M25V qualification was successfully completed and passed without issue. No degradation was seen across measured parameters and the POR design fix was validated.
Tests highlighted in yellow will be performed for this study
This testing is performed by Freescale FSL-EKB, FSL-KLM, and FSL-ATX where noted in the Comments
GROUP A - ACCELERATED ENVIRONMENTAL STRESS TESTS
STRESS TEST
PC
Reference
J=JESD22
Test Conditions
(Surface Mount Devices Only - PC required
for THB, HAST, AC, UHST, TC, PC+PTC)
End Point
Requirements
TEST @ RHC
JESD22- Preconditioning :
MSL 3 @ 260°C, +5/-0°C
A113
J-STD-020 Pre and Post CSAM SS=11 units per lot per stress
test
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not Applicable
All surface mount devices prior to THB, HAST, AC, Pass by similarity
UHST, TC, PC+PTC
Comments
Generic Data Performed in KLM
173479: Lot 1 0/231 Bolero1.5M 176ld 0M03Y
173479: Lot 2 0/231 Bolero1.5M 176ld 0M03Y
173479: Lot 3 0/231 Bolero1.5M 176ld 0M03Y
HAST
JESD22A110
PC before HAST required for SMDs.
Highly Accelerated Stress Test, Biased:
HAST = 130°C/85%RH for 96 hrs.
Bias = 5.5V
TEST @ RH
77
0
0
Pass by similarity
Generic Data Performed in KLM
173479: Lot 1 0/77 Bolero1.5M 176ld 0M03Y
173479: Lot 2 0/77 Bolero1.5M 176ld 0M03Y
173479: Lot 3 0/77 Bolero1.5M 176ld 0M03Y
AC
JESD22A102
PC before AC required for SMDs.
Autoclave:
AC = 121°C/100%RH/15 psig for 96 hrs
TEST @ R
77
0
0
Pass by similarity
Generic Data Performed in KLM
173479: Lot 1 0/77 Bolero1.5M 176ld 0M03Y
173479: Lot 2 0/77 Bolero1.5M 176ld 0M03Y
173479: Lot 3 0/77 Bolero1.5M 176ld 0M03Y
TC
JESD22A104
AEC Q100Appendix 3
TEST @ HC
PC before TC required for SMDs
WBP =/> 3 grams
Temperature Cycle:
TC = -65°C to 150°C for 500 cycles.
WBP after TC on 5 devices from 1 lot; 2 bonds per
corner and one mid-bond per side on each device.
Record which pins were used.
77
0
0
Pass by similarity
Generic Data Performed in KLM
173479: Lot 1 0/77 Bolero1.5M 176ld 0M03Y
173479: Lot 2 0/77 Bolero1.5M 176ld 0M03Y
173479: Lot 3 0/77 Bolero1.5M 176ld 0M03Y
JESD22A105
Preconditioning plus Power Temperature Cycle:
PTC = -40ºC to +125ºC for 1000 cycles.
TEST @ RH
22
0
0
JESD22A105
Power Temperature Cycle:
PTC = -40ºC to +125ºC for 1000 cycles.
TEST @ RH
23
0
0
JESD22A103
High Temperature Storage Life:
150°C for 1008 hrs
TEST @ RHC
77
0
0
PTC
HTSL
All Post 500TC wirepulls >3g
Not required.
1. P< 1W
2. DTj < 40°C
3. No Inductive Load
Pass by similarity
Generic Data - covered by EDR data
193757: Lot 1 0/154 Spectrum 176ld 1M25V
193757: Lot 2 0/154 Spectrum 176ld 1M25V
193757: Lot 3 0/154 Spectrum 176ld 1M25V
TEST GROUP B - ACCELERATED LIFETIME SIMULATION TESTS
STRESS TEST
Reference
Test Conditions
HTOL
JESD22A108
High Temperature Operating Life:
Ta= 125°C for 168 Qual Point, 1008hrs FIO
Bias:
Vdd I/O= 5.0V nom : 6.0V Stress
Vdd core = 1.2V nom : 1.56V Stress
NVM cycling @125°C, as shown in EDR below, is
required
NVM in Checkerboard
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not applicable
Comments
TEST @ RHC
77
1
77
Lot1: 0/77
Generic Data Performed in EKB
193757: Spectrum 1M25V DD766212 1/77[1]
193757: Spectrum 1M25V DD766231 0/77
193757: Spectrum 1M25V DD769041 0/77
[1]
1 unit failed W/E cycling pre-HTOL (808 cycles) due to
a short from gate to source/drain resulting from residual
polysilicon. Fix implemented and verified
ELFR
AEC Q100- Early Life Failure Rate:
008
Ta = 125°C for 48 hrs;
Bias:
Vdd I/O= 5.0V nom : 6.0V Stress
Vdd core = 1.2V nom : 1.56V Stress
10% of NVM cycling @125°C, as shown in EDR
below, is required
NVM in Checkerboard
TEST @ RHC
800
0
0
Pass by similarity
Generic Data Performed in EKB
173479: 0/800 Bolero1.5M 176ld 0M03Y
163078: 0/908 Bolero 512k 144ld 0M27V
163078: 0/843 Bolero 512k 144ld 0M27V
159917: 0/685 Pictus 512k 100ld 0M26V
EDR
AEC Q100- NVM Endurance, Data Retention,
005
C-Flash 0: 512Kb Block @ -40°C
100K W/E for 2x16k block size
10K W/E for 3x32k block size
1K W/E for 3x128k block size
C-Flash 1: 512Kb Block @ -40°C
1K W/E for 4x128k block size
D-Flash 0: 64Kb Block @ -40°C
100K W/E for 16k block size
TEST @ RHC
77
0
0
Pass by similarity
Generic Data Performed in EKB
193757: Lot 1 0/77 Spectrum 176ld 1M25V
193757: Lot 2 0/77 Spectrum 176ld 1M25V
193757: Lot 3 0/77 Spectrum 176ld 1M25V
TEST @ RHC
77
0
0
Pass by similarity
Generic Data Performed in EKB
193757: Lot 1 0/77 Spectrum 176ld 1M25V
193757: Lot 2 0/77 Spectrum 176ld 1M25V
193757: Lot 3 0/77 Spectrum 176ld 1M25V
NVM in Checkerboard 1008hrs @ 150°C
NVM Endurance, Data Retention,
C-Flash 0: 512Kb Block @ 125°C
100K W/E for 2x16k block size
10K W/E for 3x32k block size
1K W/E for 3x128k block size
C-Flash 1: 512Kb Block @ 125°C
1K W/E for 4x128k block size
D-Flash 0: 64Kb Block @ 125°C
100K W/E for 16k block size
NVM in Checkerboard 1008hrs @ 150°C
FORMPPAP004XLS
1 of 3
Freescale Rev U
Freescale PN: PC5606S
Part Name: Spectrum 1.0M
Customer Name(s):
PN(s):
Summary Revision # 1.2
Date: 15th March 2013
TEST GROUP C - PACKAGE ASSEMBLY INTEGRITY TESTS
STRESS TEST
Reference
Test Conditions
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not applicable
Comments
WBS
AEC Q100- Wire Bond shear
001
Cpk = or > 1.67
30 bonds
from minimum
5 units
0
0
Pass by similarity
Generic Data
173479: Lot 1 0/231 Bolero1.5M 176ld 0M03Y
Cpk = 4.16
WBP
MilStd883- Wire Bond Pull
2011
Cond. C or D
Cpk = or > 1.67
30 bonds
from minimum
5 units
0
0
Pass by similarity
Generic Data
173479: Lot 1 0/231 Bolero1.5M 176ld 0M03Y
Cpk = 4.31
>95% lead coverage
of critical areas
15
0
0
Pass by similarity
Generic Data
173479: Lot 1 0/231 Bolero1.5M 176ld 0M03Y
Pass
Cpk = or > 1.67
10
0
0
Pass by similarity
Cpk = or >1.67
10
0
0
Generic Data
173479: Lot 1 0/231 Bolero1.5M 176ld 0M03Y
width Cpk = 11.58
length Cpk = 8.88
height Cpk = 7.21
N/A - not required for leaded devices.
5
0
0
N/A - not required for SM devices.
SD
JESD22B102
PD
JESD22B100
SBS
LI
Solderability;
8hr. Steam age (1 hr. for Au-plated leads) prior to
test.
If production burn-in is done, samples must also
undergo burn-in.
Physical Dimensions PD per 98A drawing
AEC-Q100- Solder Ball Shear;
010
Performed on all solder ball mounted packages e.g.
PBGA, Chip Scale, Micro Lead Frame (but NOT
Flip Chip).
Two 260°C reflow cycles before shear.
JESD22- Lead Integrity
B105
Not required for surface mount devices;
Only required for through-hole devices.
(5 balls from a min. of
10 devices)
No lead breakage or
cracks
(10 leads from each
of 5 parts)
TEST GROUP D - DIE FABRICATION RELIABILITY TESTS
STRESS TEST
Reference
Test Conditions
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Results
LotID-(#Rej/SS)
NA=Not applicable
Electro Migration
Report available on request
NBTI
Negative Bias Temperature Instability
Report available on request
TDDB
Time Dependent Dielectric Breakdown
Report available on request
EM
HCI
Hot Carrier Injection
Report available on request
SM
Stress Migration
Report available on request
Comments
TEST GROUP E - ELECTRICAL VERIFICATION TESTS
STRESS TEST
Reference
Test Conditions
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
0 Fails
All
All
All
TEST @ RH
2KV min.
3 units per
Voltage level
1
12
Lot1:
500V 0/3
1000V 0/3
1500V 0/3
2000V 0/3
Performed in KLM
AEC-Q100- ElectroStatic Discharge/
ESD
003
Machine Model Classification:
(MM)
Test @ 50 / 100 / 150 / 200Volts
CLASSIFICATION
See AEC-Q100-003 for classification levels.
TEST @ RH
200V min.
3 units per
Voltage level
1
12
Lot1:
50V 0/3
100V 0/3
150V 0/3
200V 0/3
Performed in KLM
AEC-Q100- ElectroStatic Discharge/
ESD
011
Charged Device Model Classification:
(CDM)
Test @ 250 / 500 / 750 Volts
CLASSIFICATION
See AEC-Q100-011 for classification levels.
JESD78 Latch-up:
LU
Test per JEDEC JESD78 with the AEC-Q100-004
plus
AEC-Q100- requirements. 100mA @ 125C
004
TEST @ RH
3 units per
Corner pins =/> 750V; Voltage level
All other pins =/>
500V
TEST @ RH
6
1
9
Performed in KLM
1
6
Lot1:
250V 0/3
500V 0/3
750V 0/3 Corner pins
Lot1: 0/6
1
77
Lot1: 0/30
Performed in EKB
Pre- and Post Functional / Parametrics
Test software shall meet requirements of AECQ100-007.
Testing performed to the limits of device
specification in temperature and limit value.
AEC-Q100- ElectroStatic Discharge/
ESD
002
Human Body Model Classification:
(HBM)
Test @ 500 / 1000 / 1500 / 2000Volts
CLASSIFICATION
See AEC-Q100-002 for classification levels.
TEST
Freescale
48A
ED
AEC-Q100- Electrical Distribution
009,
Freescale
TEST @ RHC
Cpk = or > 1.67
FG
AEC-Q100- Fault Grading
007
AEC-Q003 Characterization:
Performed on new technologies and part families.
FG shall be = or >
98% for qual units
AEC-Q100- Electro-Thermally Induced Gate Leakage;
006
155°C, 2.0 min, +400/-400 V
TEST @ R
CHAR
GL
FORMPPAP004XLS
30
Results
LotID-(#Rej/SS)
NA=Not applicable
Lot 1: DD87896 Pass
Comments
Performed in KLM
99.11%
6
0
2 of 3
0
Pass
Completed on 1M25V. Validation performed on fix to
POR.
Pass by similarity
Generic Data
193757: Lot 1 0/6 Spectrum 176ld 1M25V
Freescale Rev U
Freescale PN: PC5606S
Part Name: Spectrum 1.0M
SAE
Electromagnetic Compatibility
EMC
J1752/3 - (see AEC Q100 Appendix 5 for test applicability;
Radiated done on case-by-case basis per
Emissions customer/Freescale agreement)
AEC Q100- Short Circuit Characterization
SC
012
Applicable to all smart power devices. This test
and statistical evaluation (see section 4 of Q100012) shall be performed per agreement between
user and supplier on a case-by-case basis.
SER
JEDEC Unaccelerated:
JESD89-1 or
Accelerated:
JESD89-2 &
JESD89-3
Customer Name(s):
PN(s):
<40dBuV
150kHz - 1GHz
Soft Error Rate
Applicable to devices with memory sizes 1Mbit
SRAM or DRAM based cells. Either test option (unaccelerated or accelerated) can be performed, in
accordance to the referenced specifications. This
test and its accept criteria is user and supplier on a
case-by case basis. Final test report shall include
detailed test facility location and altitude data.
1
0
0
10
0
0
3
0
0
Summary Revision # 1.2
Date: 15th March 2013
Pass by similarity
Generic Data
193757: Spectrum 1M25V Passed
NA - Not applicable to microcontroller
Pass by similarity
Generic Data
193757: Spectrum 1M25V Passed
TEST GROUP F - DEFECT SCREENING TESTS
STRESS TEST
Reference
Test Conditions
PAT
AEC Q001 Part Average Testing
SBA
AEC Q002 Statistical Bin Analysis
Generic
Quartz
173479
163078
159917
193757
Data:
Device
PC5607B
PC5604B
PC5604P
PC5606S
Mask
0M03Y
0M27V
0M26V
1M25V
Title
Bolero 1.5M AEC 176ld Qual
Bolero 512k 144ld NPI Qual
Pictus 512k 100ld NPI Qual
Spectrum 1.0M 176ld NPI Qual
End Point
Requirements
Minimum
Sample Size
# of Lots
Total Units
Has PAT been
established for this
part?
Has SBYA been
established for this
part?
Fab
ATMC
ATMC
ATMC
ATMC
Mould
HITACHI CEL-9240
SUMITOMO EME-G700E
SUMITOMO EME-G700E
HITACHI CEL-9240
Results
LotID-(#Rej/SS)
NA=Not applicable
Implemented
Comments
Implemented
Die Size
5.082 x 5.301
4.261 x 4.471
4.351 x 4.062
5.465 x 5.430
x
x
x
x
0.33mm
0.33mm
0.33mm
0.33mm
CAB
09412905M
08462238M
08462222M
08462223M
Revision
1.0
Revision Date
4th April 2011
Description
Original Plan.
Douglas Blackwood
1.1
23rd June 2011
Updated results
Douglas Blackwood
1.2
15th March 2013
Updated format for web reporting, Added qualification argument
Douglas Blackwood
FORMPPAP004XLS
3 of 3
Freescale Rev U