ATMEL AT17F080-30JC

Features
• Programmable 4,194,304 x 1 and 8,388,608 x 1-bit Serial Memories Designed to Store
Configuration Programs for Field Programmable Gate Arrays (FPGAs)
• 3.3V Output Capability
• 5V Tolerant I/O Pins
• Program Support using the Atmel ATDH2200E System or Industry Third Party
Programmers
• In-System Programmable (ISP) via 2-wire Bus
• Simple Interface to SRAM FPGAs
• Compatible with Atmel AT40K and AT94K Devices, Altera® FLEX®, APEX™ Devices,
•
•
•
•
•
•
•
•
•
Lucent® ORCA® FPGAs, Xilinx® XC3000, XC4000, XC5200, Spartan®, Virtex™ FPGAs,
Motorola® MPA1000 FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Low-power CMOS FLASH Process
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
Single Device Capable of Holding 4 Bit Stream Files Allowing Simple System
Reconfiguration
Fast Serial Download Speeds up to 33 MHz
Endurance: 5,000 Write Cycles Typical
LHF Package Available (Lead and Halide Free)
FPGA
Configuration
Flash Memory
AT17F040
AT17F080
1. Description
The AT17F Series of In-System Programmable Configuration PROMs (Configurators)
provide an easy-to-use, cost-effective configuration memory for Field Programmable
Gate Arrays. The AT17F Series device is packaged in the 8-lead LAP, 20-lead PLCC,
44-lead PLCC and 44-lead TQFP, see Table 1-1. The AT17F Series Configurator
uses a simple serial-access procedure to configure one or more FPGA devices.
The AT17F Series Configurators can be programmed with industry-standard programmers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
Table 1-1.
Package
AT17F Series Packages
AT17F040
AT17F080
8-lead LAP
Yes
Yes
20-lead PLCC
Yes
Yes
44-lead PLCC
–
Yes
44-lead TQFP
–
Yes
3039I–CNFG–2/05
2. Pin Configuration
8-lead LAP
DATA
CLK
RESET/OE
CE
1
2
3
4
8
7
6
5
VCC
SER_EN
CEO (A2)
GND
18
17
16
15
14
9
10
11
12
13
4
5
6
7
8
NC
SER_EN
PAGE_EN
READY
CEO (A2)
NC
GND
PAGESEL0
NC
NC
CLK
NC
RESET/OE
PAGESEL1
CE
3
2
1
20
19
NC
DATA
NC
VCC
NC
20-lead PLCC
18
17
16
15
14
9
10
11
12
13
4
5
6
7
8
SER_EN
NC
NC
READY
NC
NC
CE
GND
NC
CEO (A2)
NC
NC
NC
NC
RESET/OE
3
2
1
20
19
CLK
NC
DATA
VCC
NC
20-lead PLCC (Virtex Pinout)(1)(2)
Notes:
1. 20-lead PLCC (Virtex pinout) is only available in the AT17F040.
2. Virtex pinout is compatible with the XC17V and XC18V Series PROM.
2
AT17F040/080
3039I–CNFG–2/05
NC
RESET/OE
PAGESEL0
CE
NC
NC
GND
PAGESEL1
NC
CEO(A2)
NC
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
NC
CLK
NC
NC
DATA
PAGE_EN
VCC
NC
NC
SER_EN
NC
NC
RESET/OE
PAGESEL0
CE
NC
NC
GND
PAGESEL1
NC
CEO/A2
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
3039I–CNFG–2/05
6
5
4
3
2
1
44
43
42
41
40
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
NC
CLK
NC
NC
DATA
PAGE_EN
VCC
NC
NC
SER_EN
NC
AT17F040/080
44 PLCC
39
38
37
36
35
34
33
32
31
30
29
1
2
3
4
5
6
7
8
9
10
11
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
READY
44 TQFP
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
READY
3
3. Block Diagram
READY
PAGE_EN
PAGESEL0
PAGESEL1
Power-on
Reset
Reset
Clock/Oscillator
Logic
CEO(A2)
Config. Page
Select
Serial Download Logic
2-wire Serial Programming
Flash
Memory
CLK
CE/WE/OE
Data
Address
DATA
CE
Control Logic
RESET/OE
SER_EN
4. Device Description
The control signals for the configuration memory device (CE, RESET/OE and CLK) interface
directly with the FPGA device control signals. All FPGA devices can control the entire configuration process and retrieve data from the configuration device without requiring an external
intelligent controller.
The RESET/OE and CE pins control the tri-state buffer on the DATA output pin and enable the
address counter. When RESET/OE is driven Low, the configuration device resets its address
counter and tri-states its DATA pin. The CE pin also controls the output of the AT17F Series
Configurator. If CE is held High after the RESET/OE reset pulse, the counter is disabled and the
DATA output pin is tri-stated. When OE is subsequently driven High, the counter and the DATA
output pin are enabled. When RESET/OE is driven Low again, the address counter is reset and
the DATA output pin is tri-stated, regardless of the state of CE.
When the configurator has driven out all of its data and CEO is driven Low, the device tri-states
the DATA pin to avoid contention with other configurators. Upon power-up, the address counter
is automatically reset.
4
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
5. Pin Description
Table 5-1.
Pin Description
AT17F040
AT17F080
Name
I/O
8
LAP
20
PLCC
20 PLCC
(Virtex)
8
LAP
20
PLCC
44
PLCC
44
TQFP
DATA
I/O
1
2
1
1
2
2
40
CLK
I
2
4
3
2
4
5
43
PAGE_EN
I
–
16
–
–
16
1
39
PAGESEL0
I
–
11
–
–
11
20
14
PAGESEL1
I
–
7
–
–
7
25
19
RESET/OE
I
3
6
8
3
6
19
13
CE
I
4
8
10
4
8
21
15
GND
–
5
10
11
5
10
24
18
CEO
O
6
14
13
6
14
27
21
A2
I
READY
O
–
15
15
–
15
29
23
SER_EN
I
7
17
18
7
17
41
35
VCC
–
8
20
20
8
20
44
38
5.1
DATA(1)
Three-state DATA output for configuration. Open-collector bi-directional pin for programming.
5.2
CLK(1)
Clock input. Used to increment the internal address and bit counter for reading and
programming.
5.3
PAGE_EN(2)
Input used to enable page download mode. When PAGE_EN is high the configuration download
address space is partitioned into 4 equal pages. This gives users the ability to easily store and
retrieve multiple configuration bitstreams from a single configuration device. This input works in
conjunction with the PAGESEL inputs. PAGE_EN must be remain low if paging is not desired.
When SER_EN is Low (ISP mode) this pin has no effect.
Notes:
1. This pin has an internal 20 KΩ pull-up resistor.
2. This pin has an internal 30 KΩ pull-down resistor.
5
3039I–CNFG–2/05
5.4
PAGESEL[1:0](2)
Page select inputs. Used to determine which of the 4 memory pages are targeted during a serial
configuration download. The address space for each of the pages is shown in Table 5-2. When
SER_EN is Low (ISP mode) these pins have no effect.
Table 5-2.
5.5
Address Space
Paging Decodes
AT17F040 (4 Mbits)
AT17F080 (8 Mbits)
PAGESEL = 00, PAGE_EN = 1
00000 – 0FFFFh
00000 – 1FFFFh
PAGESEL = 01, PAGE_EN = 1
10000 – 1FFFFh
20000 – 3FFFFh
PAGESEL = 10, PAGE_EN = 1
20000 – 2FFFFh
40000 – 5FFFFh
PAGESEL = 11, PAGE_EN = 1
30000 – 3FFFFh
60000 – 7FFFFh
PAGESEL = XX, PAGE_EN = 0
00000 – 3FFFFh
00000 – 7FFFFh
RESET/OE(1)
Output Enable (active High) and RESET (active Low) when SER_EN is High. A Low level on
RESET/OE resets both the address and bit counters. A High level (with CE Low) enables the
data output driver.
5.6
CE(1)
Chip Enable input (active Low). A Low level (with OE High) allows CLK to increment the address
counter and enables the data output driver. A High level on CE disables both the address and bit
counters and forces the device into a low-power standby mode. Note that this pin will not
enable/disable the device in the 2-wire Serial Programming mode (SER_EN Low).
5.7
GND
Ground pin. A 0.2 µF decoupling capacitor between VCC and GND is recommended.
5.8
CEO
Chip Enable Output (when SER_EN is High). This output goes Low when the internal address
counter has reached its maximum value. If the PAGE_EN input is set High, the maximum value
is the highest address in the selected partition. The PAGESEL[1:0] inputs are used to make the
4 partition selections. If the PAGE_EN input is set Low, the device is not partitioned and the
address maximum value is the highest address in the device, see Table 5-2 on page 6. In a
daisy chain of AT17F Series devices, the CEO pin of one device must be connected to the CE
input of the next device in the chain. It will stay Low as long as CE is Low and OE is High. It will
then follow CE until OE goes Low; thereafter, CEO will stay High until the entire EEPROM is
read again.
Notes:
1. This pin has an internal 20 KΩ pull-up resistor.
2. This pin has an internal 30 KΩ pull-down resistor.
6
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
5.9
A2(1)
Device selection input, (when SER_EN Low). The input is used to enable (or chip select) the
device during programming (i.e., when SER_EN is Low). Refer to the AT17F Programming
Specification available on the Atmel web site for additional details.
5.10
READY
Open collector reset state indicator. Driven Low during power-up reset, released when power-up
is complete. (recommended 4.7 kΩ pull-up on this pin if used).
5.11
SER_EN(1)
The serial enable input must remain High during FPGA configuration operations. Bringing
SER_EN Low enables the 2-Wire Serial Programming Mode. For non-ISP applications,
SER_EN should be tied to VCC.
5.12
VCC
+3.3V (±10%).
Notes:
1. This pin has an internal 20 KΩ pull-up resistor.
2. This pin has an internal 30 KΩ pull-down resistor.
7
3039I–CNFG–2/05
6. FPGA Master Serial Mode Summary
The I/O and logic functions of any SRAM-based FPGA are established by a configuration program. The program is loaded either automatically upon power-up, or on command, depending
on the state of the FPGA mode pins. In Master mode, the FPGA automatically loads the configuration program from an external memory. The AT17F Serial Configuration PROM has been
designed for compatibility with the Master Serial mode.
This document discusses the Atmel AT40K, AT40KAL and AT94KAL applications as well as Xilinx applications.
7. Control of Configuration
Most connections between the FPGA device and the AT17F Serial Configurator PROM are simple and self-explanatory.
• The DATA output of the AT17F Series Configurator drives DIN of the FPGA devices.
• The master FPGA CCLK output drives the CLK input of the AT17F Series Configurator.
• The CEO output of any AT17F Series Configurator drives the CE input of the next
Configurator in a cascade chain of configurator devices.
• SER_EN must be connected to VCC (except during ISP).
• The READY pin is available as an open-collector indicator of the device’s reset status; it is
driven Low while the device is in its power-on reset cycle and released (tri-stated) when the
cycle is complete.
• PAGE_EN must be held Low if download paging is not desired. The PAGESEL[1:0] inputs
must be tied off High or Low. If paging is desired, PAGE_EN must be High and the PAGESEL
pins must be set to High or Low such that the desired page is selected, see Table 5-2 on
page 6.
8. Cascading Serial Configuration Devices
For multiple FPGAs configured as a daisy-chain, or for FPGAs requiring larger configuration
memories, cascaded configurators provide additional memory.
After the last bit from the first configurator is read, the clock signal to the configurator asserts its
CEO output Low and disables its DATA line driver. The second configurator recognizes the Low
level on its CE input and enables its DATA output.
After configuration is complete, the address counters of all cascaded configurators are reset if
the RESET/OE on each configurator is driven to its active (Low) level.
If the address counters are not to be reset upon completion, then the RESET/OE input can be
tied to its inactive (High) level.
9. Programming Mode
The programming mode is entered by bringing SER_EN Low. In this mode the chip can be programmed by the 2-wire serial bus. The programming is done at VCC supply only. Programming
super voltages are generated inside the chip. The AT17F parts are read/write at 3.3V nominal.
Refe r to th e AT17F Programm ing Specification available on th e Atmel web site
(www.atmel.com) for more programming details. AT17F devices are supported by the Atmel
ATDH2200 programming system along with many third party programmers.
8
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
10. Standby Mode
The AT17F Series Configurators enter a low-power standby mode whenever SER_EN is High
and CE is asserted High. In this mode, the AT17F Configurator consumes less than 1 mA of current at 3.3V. The output remains in a high-impedance state regardless of the state of the OE
input.
11. Absolute Maximum Ratings*
Operating Temperature.................................... -40°C to +85 °C
*NOTICE:
Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those listed under operating conditions is not implied. Exposure to Absolute Maximum Rating conditions for extended
periods of time may affect device reliability.
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground ..............................-0.1V to VCC +0.5V
Supply Voltage (VCC) .........................................-0.5V to +4.0V
Maximum Soldering Temp. (10 sec. @ 1/16 in.).............260°C
ESD (RZAP = 1.5K, CZAP = 100 pF)................................. 2000V
12. Operating Conditions
AT17F Series Configurator
Symbol
Description
Min
Max
Units
Commercial
Supply voltage relative to GND
-0°C to +70°C
2.97
3.63
V
Industrial
Supply voltage relative to GND
-40°C to +85°C
2.97
3.63
V
VCC
13. DC Characteristics
AT17F040
AT17F080
Symbol
Description
Min
Max
Min
Max
Units
VIH
High-level Input Voltage
2.0
VCC
2.0
VCC
V
VIL
Low-level Input Voltage
0
0.8
0
0.8
V
VOH
High-level Output Voltage (IOH = -2.5 mA)
VOL
Low-level Output Voltage (IOL = +3 mA)
VOH
High-level Output Voltage (IOH = -2 mA)
VOL
Low-level Output Voltage (IOL = +3 mA)
0.4
0.4
V
ICCA
Supply Current, Active Mode
20
20
mA
IL
Input or Output Leakage Current (VIN = VCC or GND)
10
µA
ICCS
Supply Current, Standby Mode
2.4
2.4
V
Commercial
0.4
2.4
0.4
2.4
V
V
Industrial
-10
10
-10
Commercial
1
1
mA
Industrial
1
1
mA
9
3039I–CNFG–2/05
14. AC Characteristics
CE
TSCE
TSCE
THCE
RESET/OE
TLC
THOE
THC
CLK
TOE
TOH
TCAC
TDF
TCE
DATA
TOH
15. AC Characteristics when Cascading
RESET/OE
CE
CLK
TCDF
DATA
FIRST BIT
LAST BIT
TOCK
TOCE
TOOE
CEO
TOCE
10
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
16. AC Characteristics
AT17F040/080
Symbol
Description
TOE(2)
OE to Data Delay
TCE(2)
CE to Data Delay
TCAC(2)
CLK to Data Delay
TOH
Data Hold from CE, OE, or CLK
TDF(3)
CE or OE to Data Float Delay
TLC
CLK Low Time
THC
CLK High Time
TSCE
Min
Max
Units
50
ns
Industrial
55
ns
Commercial
55
ns
60
ns
30
ns
30
ns
Commercial
(1)
(1)
Industrial
Commercial
3
(1)
Industrial
Commercial
0
ns
Industrial(1)
0
ns
Commercial
(1)
Industrial
15
ns
15
ns
Commercial
15
ns
Industrial(1)
15
ns
Commercial
15
ns
Industrial
15
ns
CE Setup Time to CLK
(to guarantee proper counting)
Commercial
20
ns
Industrial
25
ns
CE Hold Time from CLK
(to guarantee proper counting)
Commercial
0
ns
THCE
Industrial
0
ns
RESET/OE Low Time
(guarantees counter is reset)
Commercial
20
ns
THOE
20
ns
Maximum Input Clock Frequency
SEREN = 0
Commercial
FMAX
FMAX
Maximum Input Clock Frequency
SEREN = 1
TWR
Write Cycle Time(4)
TEC
Erase Cycle Time(4)
Notes:
(1)
(1)
(1)
(1)
Industrial
10
MHz
Industrial
10
MHz
Commercial
33
MHz
Industrial(1)
33
MHz
(1)
Commercial
12
µs
Industrial
12
µs
Commercial
13
s
13
s
(1)
(1)
Industrial
1. Preliminary specifications for military operating range only.
2. AC test lead = 50 pF.
3. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels.
4. See the AT17F Programming Specfication for procedural information.
11
3039I–CNFG–2/05
16.1
AC Characteristics When Cascading
AT17F040
Symbol
Description
TCDF(3)
CLK to Data Float Delay
TOCK(2)
CLK to CEO Delay
TOCE(2)
CE to CEO Delay
TOOE(2)
RESET/OE to CEO Delay
FMAX
Maximum Input Clock Frequency
Notes:
Min
AT17F080
Max
Min
Max
Units
Commercial
60
50
ns
Industrial
60
50
ns
Commercial
55
50
ns
Industrial
60
55
ns
Commercial
55
35
ns
Industrial
60
40
ns
Commercial
40
35
ns
Industrial
45
35
ns
Commercial
33
33
MHz
Industrial
33
33
MHz
1. AC test lead = 50 pF.
2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels.
12
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
17. Thermal Resistance Coefficients
Package Type
8CN4
20J
44A
44J
Note:
Leadless Array Package (LAP)
Plastic Leaded Chip Carrier (PLCC)
Thin Plastic Quad Flat Package (TQFP)
Plastic Leaded Chip Carrier (PLCC)
AT17F040
AT17F080
θJC [°C/W]
–
θJA [°C/W](1)
–
θJC [°C/W]
–
θJA [°C/W]
(1)
–
θJC [°C/W]
–
17
θJA [°C/W](1)
–
62
θJC [°C/W]
–
15
–
50
θJA [°C/W]
(1)
1. Airflow = 0 ft/min.
13
3039I–CNFG–2/05
18. Ordering Information
Memory Size
4-Mbit
8-Mbit
Ordering Code
Package
Operation Range
AT17F040-30CC
AT17F040-30JC
AT17F040-30VJC
8CN4 - 8 LAP
20J - 20 PLCC
20J - 20 PLCC
Commercial
(0°C to 70°C)
AT17F040-30CI
AT17F040-30JI
AT17F040-30VJI
8CN4 - 8 LAP
20J - 20 PLCC
20J - 20 PLCC
Industrial
(-40°C to 85°C)
AT17F040-30CU
AT17F040-30JU
8CN4 - 8 LAP
20J - 20 PLCC
LHF Industrial
(-40°C to 85°C)
AT17F080-30CC
AT17F080-30JC
AT17F080-30TQC
AT17F080-30BJC
8CN4 - 8 LAP
20J - 20 PLCC
44A - 44 TQFP
44J - 44 PLCC
Commercial
(0°C to 70°C)
AT17F080-30CI
AT17F080-30JI
AT17F080-30TQI
AT17F080-30BJI
8CN4 - 8 LAP
20J - 20 PLCC
44A - 44 TQFP
44J - 44 PLCC
Industrial
(-40°C to 85°C)
AT17F080-30CU
AT17F080-30JU
8CN4 - 8 LAP
20J - 20 PLCC
LHF Industrial
(-40°C to 85°C)
Package Type
8CN4
8-lead, 6 mm x 6 mm x 1 mm, Leadless Array Package (LAP) – Pin-compatible with 8-lead SOIC/VOIC Packages
20J
20-lead, Plastic J-leaded Chip Carrier (PLCC)
44A
44-lead, Thin (1.0 mm) Plastic Quad Flat Package Carrier (TQFP)
44J
44-lead, Plastic J-leaded Chip Carrier (PLCC)
14
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
19. Packaging Information
19.1
8CN4 – LAP
Marked Pin1 Indentifier
E
A
A1
D
Top View
Side View
Pin1 Corner
L1
0.10 mm
TYP
8
1
e
COMMON DIMENSIONS
(Unit of Measure = mm)
2
7
3
6
b
5
4
e1
L
Bottom View
SYMBOL
MIN
NOM
MAX
A
0.94
1.04
1.14
A1
0.30
0.34
0.38
b
0.45
0.50
0.55
D
5.89
5.99
6.09
E
4.89
5.99
6.09
e
1.27 BSC
e1
1.10 REF
NOTE
1
L
0.95
1.00
1.05
1
L1
1.25
1.30
1.35
1
Note: 1. Metal Pad Dimensions.
11/14/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8CN4, 8-lead (6 x 6 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
DRAWING NO.
8CN4
REV.
A
15
3039I–CNFG–2/05
19.2
20J – PLCC
PIN NO. 1
1.14(0.045) X 45˚
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
e
E1
E
D2/E2
B1
B
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AA.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
9.779
–
10.033
D1
8.890
–
9.042
E
9.779
–
10.033
E1
8.890
–
9.042
D2/E2
7.366
–
8.382
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
16
2325 Orchard Parkway
San Jose, CA 95131
TITLE
20J, 20-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
20J
B
AT17F040/080
3039I–CNFG–2/05
AT17F040/080
19.3
44A – TQFP
PIN 1
B
PIN 1 IDENTIFIER
E1
e
E
D1
D
C
0˚~7˚
A1
A2
A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
11.75
12.00
12.25
D1
9.90
10.00
10.10
E
11.75
12.00
12.25
E1
9.90
10.00
10.10
B
0.30
–
0.45
C
0.09
–
0.20
L
0.45
–
0.75
e
NOTE
Note 2
Note 2
0.80 TYP
10/5/2001
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
DRAWING NO.
REV.
44A
B
17
3039I–CNFG–2/05
19.4
44J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
E1
D2/E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AC.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
17.399
–
17.653
D1
16.510
–
16.662
E
17.399
–
17.653
E1
16.510
–
16.662
D2/E2
14.986
–
16.002
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
18
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
44J
B
AT17F040/080
3039I–CNFG–2/05
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Regional Headquarters
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
Tel: (41) 26-426-5555
Fax: (41) 26-426-5500
Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Atmel Operations
Memory
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
RF/Automotive
Theresienstrasse 2
Postfach 3535
74025 Heilbronn, Germany
Tel: (49) 71-31-67-0
Fax: (49) 71-31-67-2340
Microcontrollers
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 436-4314
La Chantrerie
BP 70602
44306 Nantes Cedex 3, France
Tel: (33) 2-40-18-18-18
Fax: (33) 2-40-18-19-60
ASIC/ASSP/Smart Cards
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Biometrics/Imaging/Hi-Rel MPU/
High Speed Converters/RF Datacom
Avenue de Rochepleine
BP 123
38521 Saint-Egreve Cedex, France
Tel: (33) 4-76-58-30-00
Fax: (33) 4-76-58-34-80
Zone Industrielle
13106 Rousset Cedex, France
Tel: (33) 4-42-53-60-00
Fax: (33) 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906, USA
Tel: 1(719) 576-3300
Fax: 1(719) 540-1759
Scottish Enterprise Technology Park
Maxwell Building
East Kilbride G75 0QR, Scotland
Tel: (44) 1355-803-000
Fax: (44) 1355-242-743
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT
OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Atmel’s products are not
intended, authorized, or warranted for use as components in applications intended to support or sustain life.
© Atmel Corporation 2005. All rights reserved. Atmel ®, logo and combinations thereof, and others are registered trademarks, and Everywhere
You Are SM and others are the trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Printed on recycled paper.
3039I–CNFG–2/05