PHILIPS BAP50-03

BAP50-03
General purpose PIN diode
Rev. 04 — 11 September 2009
Product data sheet
1. Product profile
1.1 General description
General purpose PIN diode in a SOD323 small plastic SMD package.
1.2 Features
n Low diode capacitance
n Low diode forward resistance
1.3 Applications
n General RF application
2. Pinning information
Table 1.
Discrete pinning
Pin
Description
1
cathode
2
anode
Simplified outline
1
Graphic symbol
2
sym006
3. Ordering information
Table 2.
Ordering information
Type number Package
BAP50-03
Name
Description
Version
SC-76
plastic surface-mounted package; 2 leads
SOD323
BAP50-03
NXP Semiconductors
General purpose PIN diode
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per diode
VR
reverse voltage
-
50
V
IF
forward current
-
50
mA
Ptot
total power dissipation
-
500
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−65
+150
°C
Typ
Unit
85
K/W
Tsp = 90 °C
5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction
to soldering point
Conditions
6. Characteristics
Table 5.
Characteristics
Tj = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 50 mA
-
0.95
1.1
V
VR
reverse voltage
IR = 10 µA
50
-
-
V
IR
reverse current
VR = 50 V
-
-
100
nA
Cd
diode capacitance
f = 1 MHz; see Figure 1
VR = 0 V
-
0.4
-
pF
VR = 1 V
-
0.3
0.55
pF
VR = 5 V
-
0.2
0.35
pF
diode forward resistance
rD
[1]
f = 100 MHz; see Figure 2
IF = 0.5 mA
[1]
-
25
40
Ω
IF = 1 mA
[1]
-
14
25
Ω
IF = 10 mA
[1]
-
3
5
Ω
Guaranteed on AQL basis: inspection level S4, AQL 1.0.
BAP50-03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 September 2009
2 of 7
BAP50-03
NXP Semiconductors
General purpose PIN diode
mgs323
500
Cd
(fF)
mgs317
103
rD
(Ω)
400
102
300
200
10
100
1
10−2
0
0
4
8
12
20
16
10−1
1
f = 1 MHz; Tj = 25 °C.
Fig 1.
10
IF (mA)
VR (V)
f = 100 MHz; Tj = 25 °C.
Diode capacitance as a function of reverse
voltage; typical values
Fig 2.
Diode forward resistance as a function of
forward current; typical values
mgs319
0
(1)
Lins
(dB)
ISL
(dB)
(2)
−1
mgs316
0
−5
(3)
−2
−10
−3
−15
−4
−20
−5
0.5
1
1.5
2
2.5
3
−25
0.5
1
f (GHz)
1.5
2
2.5
3
f (GHz)
(1) IF = 10 mA
Tamb = 25 °C.
(2) IF = 1 mA
Diode zero biased and inserted in series with a 50 Ω
stripline circuit.
(3) IF = 0.5 mA
Tamb = 25 °C.
Diode inserted in series with a 50 Ω stripline circuit and
biased via the analyzer Tee network.
Fig 3.
Insertion loss of the diode as a function of
frequency; typical values
Fig 4.
Isolation of the diode as a function of
frequency; typical values
BAP50-03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 September 2009
3 of 7
BAP50-03
NXP Semiconductors
General purpose PIN diode
7. Package outline
Plastic surface-mounted package; 2 leads
SOD323
A
D
E
X
v
HD
M
A
Q
1
2
bp
A
A1
(1)
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
HD
Lp
Q
v
mm
1.1
0.8
0.05
0.40
0.25
0.25
0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45
0.15
0.25
0.15
0.2
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
REFERENCES
IEC
SOD323
Fig 5.
JEDEC
JEITA
SC-76
EUROPEAN
PROJECTION
ISSUE DATE
03-12-17
06-03-16
Package outline SOD323
BAP50-03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 September 2009
4 of 7
BAP50-03
NXP Semiconductors
General purpose PIN diode
8. Abbreviations
Table 6.
Abbreviations
Acronym
Description
AQL
Acceptable Quality Level
PIN
P-type, Intrinsic, N-type
SMD
Surface Mounted Device
RF
Radio Frequency
S4
Special inspection level 4
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BAP50-03_4
20090911
Product data sheet
-
BAP50-03_3
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
Legal texts have been adapted to the new company name where appropriate.
BAP50-03_3
20040211
Product data sheet
BAP50-03_2
BAP50-03_2
19990510
Product data sheet
BAP50-03_N_1
BAP50-03_N_1
19990201
Preliminary data sheet
-
BAP50-03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 September 2009
5 of 7
BAP50-03
NXP Semiconductors
General purpose PIN diode
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAP50-03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 11 September 2009
6 of 7
BAP50-03
NXP Semiconductors
General purpose PIN diode
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics. . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
1
2
2
2
4
5
5
6
6
6
6
6
6
7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 September 2009
Document identifier: BAP50-03_4