INTEGRATED CIRCUITS DATA SHEET TSA5055T 2.65 GHz bidirectional I2C-bus controlled synthesizer Product specification Supersedes data of November 1991 File under Integrated Circuits, IC02 1999 Aug 11 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T FEATURES • Complete 2.65 GHz single-chip system • Low power 5 V, 60 mA • I2C-bus programming • In-lock flag GENERAL DESCRIPTION • Varicap drive disable The TSA5055T is a single-chip PLL frequency synthesizer designed for satellite TV tuning systems. It may be used with a symmetrical input (pins 13 and 14) or with an asymmetrical input (pin 13). • Low radiation • 5-level Analog to Digital Converter (ADC) • Address selection for Picture-In-Picture (PIP), DBS tuner, etc. Control data is entered via the I2C-bus; five serial bytes are required to address the device, select the oscillator frequency, program the six output ports and set the charge-pump current. Four of these ports can also be used as input ports (three general purpose I/O ports, one ADC). Digital information concerning these ports can be read out of the TSA5055T on the SDA line (one status byte) during a READ operation. A flag is set when the loop is ‘in-lock’ and is read during a READ operation. The device has one fixed I2C-bus address and three programmable addresses, programmed by applying a specific voltage to port 3. The phase comparator operates at 7.8125 kHz when a 4 MHz crystal is used. • 6 controllable outputs, 4 bidirectional • Power-down flag • Available in SOT109-1 (SO16) package • Symmetrical or asymmetrical drive. APPLICATIONS • Satellite TV • High IF cable tuning systems. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCC supply voltage 4.5 5 5.5 V ICC supply current − 60 80 mA fRF RF input frequency range 1 − 2.65 GHz VI (rms) input voltage level (RMS value) 1 to 1.8 GHz 50 − 300 mV 1.8 to 2.65 GHz 70 − 300 mV fXTAL crystal oscillator frequency 3.2 4 4.48 MHz zXTAL crystal oscillator impedance (absolute value) 600 1000 − Ω IO open-collector output current P7, P6, P5 and P4 − − 10 mA output current P3 and P0 − 1 − mA Tamb ambient temperature −20 − +85 °C Tstg storage temperature −40 − +150 °C ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TSA5055T 1999 Aug 11 SO16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm 2 CODE SOT109-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... PRESCALER 16 14 fDIV Q2 3 OSCILLATOR 4 MHz DIVIDER N = 512 POWER DOWN DETECTOR fREF 7.8125 kHz IN-LOCK DETECTOR CHARGEPUMP TO DIGITAL PHASE COMPARATOR Q1 2 3 SDA PD UD CP 15-BIT LATCH DIVIDER RATIO LOGIC OS TSA5055T SCL 16 5 I2C-BUS TRANSCEIVER 4 15 ADDRESS SELECTION 3-BIT ADC 3 TTL LEVEL COMPARATORS Philips Semiconductors RFIN2 15-BIT PROGRAMMABLE DIVIDER 2.65 GHz bidirectional I2C-bus controlled synthesizer RFIN1 BLOCK DIAGRAM handbook, full pagewidth 1999 Aug 11 1 13 GND LATCH 3 CONTROL DATA 7-BIT LATCH PORT INFORMATION 12 VCC GATE T1 10 9 8 7 6 MBC307 P3 P4 P5 P6 P7 Fig.1 Block diagram. TSA5055T P0 Product specification 11 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T PINNING SYMBOL PIN DESCRIPTION PD 1 charge-pump output Q1 2 crystal oscillator input 1 Q2 3 crystal oscillator input 2 SDA 4 serial data input/output SCL 5 serial clock input P7 6 port output/input (general purpose) P6 7 port output/input (ADC) P5 8 port output/input (general purpose) P4 9 port output/input (general purpose) P3 10 port output (also used for address selection) P0 11 port output VCC 12 voltage supply RFIN1 13 RF signal input 1 RFIN2 14 RF signal input 2 (decoupled) GND 15 ground UD 16 drive output handbook, halfpage 16 UD Q1 2 15 GND Q2 3 14 RFIN2 SDA 4 TSA5055T 13 RFIN1 12 VCC SCL 5 P7 6 11 P0 P6 7 10 P3 P5 8 9 P4 MBC304 Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge-pump and port information (first bit = 1) will follow. Until an I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. This allows a smooth frequency sweep for fine tuning. At power-on, the ports are set to the high-impedance state. General The TSA5055T is controlled via the 2-wire I2C-bus. For programming, there is one (7-bit) module address and the R/W bit for selecting READ or WRITE mode. WRITE mode: R/W = 0; see Table 1 After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are needed to fully program the TSA5055T. The bus transceiver has an auto-increment facility that permits the programming of the TSA5055T within one single transmission (address + four data bytes). The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512. Because the input of the RF signal is first divided by 16, the step size is 125 kHz. A 3.2 MHz crystal can offer a step size of 100 kHz. The TSA5055T can also be partly programmed on the condition that the first data byte following the address is byte 2 or byte 4. 1999 Aug 11 PD 1 4 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer Table 1 TSA5055T Write data format; see notes 1 to 13 BYTE MSB DATA BYTE LSB COMMAND Address 1 1 0 0 0 MA1 MA0 0 A byte 1 Programmable divider 0 N14 N13 N12 N11 N10 N9 N8 A byte 2 N7 N6 N5 N4 N3 N2 N1 N0 A byte 3 1 CP T1 T0 1 1 1 OS A byte 4 P7 P6 P5 P4 P3 X X P0 A byte 5 Charge-pump and test bits Output ports, control bits Notes 1. MA1 and MA0: programmable address bits (see Table 3). 2. A: Acknowledge bit. 3. N14 to N0: programmable divider bits. 4. N = N14 × 214 + N13 × 213 + ... + N1 × 21 + N0. 5. CP: charge-pump current. CP = 0: 50 µA; CP = 1: 220 µA. 6. P7 to P4 = 1: open-collector outputs are active. 7. P7 to P3 and P0 = 0: outputs are in high-impedance state. 8. P3 and P0 = 1: current-limited outputs are active. 9. T1, T0 and OS = 0, 0 and 0: normal operation. 10. T1 = 1: P6 = fREF and P7 = fDIV. 11. T0 = 1: 3-state charge-pump. 12. OS = 1: Operational amplifier output is switched off (varicap drive disable). 13. X: don’t care. READ mode: R/W = 1; see Table 2 The TSA5055T will then release the data line to allow the processor to generate a STOP condition. When ports P3 to P7 are used as inputs, they must be programmed to their high-impedance state. Data can be read out of the TSA5055T by setting the R/W bit to 1. After the slave address has been recognized, the TSA5055T generates an Acknowledge signal (A) and the first data byte (status byte) is transferred to the SDA line (MSB first). Data is valid on the SDA line while the SCL clock signal is HIGH. The POR flag (Power-On Reset) is set to 1 at power-on and when VCC goes below 3 V. The flag is reset when an end of data is detected by the TSA5055T (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL, which indicates when the loop is phase-locked (FL = 1). A second data byte can be read out of the TSA5055T if the processor generates an Acknowledge signal on the SDA line. End of transmission will occur if the processor does not send an Acknowledge signal. 1999 Aug 11 5 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer Table 2 TSA5055T Read data format (see notes 1 to 5) BYTE MSB Address Status byte DATA BYTE LSB COMMAND 1 1 0 0 0 MA1 MA0 1 A byte 1 POR FL I2 I1 I0 A2 A1 A0 − byte 2 Notes 1. POR: Power-on reset flag (POR = 1 on power-on). 2. FL: in-lock flag (FL = 1 when the loop is phase-locked). 3. I2, I1 and I0: digital information for I/O ports P7, P5 and P4 respectively. 4. A2, A1 and A0: digital outputs of the 5-level ADC. Accuracy is 1⁄2 LSB (see Table 4). 5. MSB is transmitted first. Bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4, respectively. A logic ‘0’ indicates a LOW level and a logic ‘1’ a HIGH level (TTL levels). A built-in 5-level ADC is available at I/O port P6. This ADC can be used to feed AFC information to the controller from the IF section of the receiver, as shown in Fig.4. The relationship between bits A2, A1, A0 and the input voltage at port P6 is given in Table 4. Table 3 Address selection MA1 MA0 VOLTAGE APPLIED ON PORT P3 0 0 0 to 0.1VCC 0 1 always valid 1 0 0.4VCC to 0.6VCC 1 1 0.9VCC to 13.5 V Address selection; see Table 3 The module address contains programmable address bits (MA1 and MA0), which offer the possibility of having several synthesizers (up to three) in one system. The relationship between MA1 and MA0 and the input voltage at port P3 is given in Table 3. Table 4 ADC levels A2 A1 A0 1 0 0 0.6VCC to VCC 0 1 1 0.45VCC to 0.6VCC 0 1 0 0.3VCC to 0.45VCC 0 0 1 0.15VCC to 0.3VCC 0 0 0 0 to 0.15VCC 1999 Aug 11 VOLTAGE APPLIED ON PORT P6 6 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T +12 V handbook, full pagewidth +5 V IF signal IF SECTION AFC OUTPUT P0 P3 P4 9 P5 8 P6 SATELLITE MIXER OSCILLATOR PART 10 7 11 6 12 5 TSA5055T 1 nF oscillator outputs P7 SCL I2C-bus 13 4 14 3 15 2 16 1 SDA MICROCONTROLLER 4 MHz 1 nF 18 pF 0.1 µF 180 nF 39 nF varicap VT input +33 V 22 kΩ 22 kΩ BC847B FCE048 Fig.3 Symmetrical application diagram. 1999 Aug 11 7 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T +12 V handbook, full pagewidth +5 V IF signal IF SECTION AFC OUTPUT P0 P3 P4 9 8 10 7 11 6 12 5 P5 P6 SATELLITE MIXER OSCILLATOR PART oscillator output TSA5055T 1 nF P7 SCL I2C-bus 13 4 14 3 15 2 16 1 SDA MICROCONTROLLER 4 MHz 18 pF 10 nF 0.1 µF 180 nF 39 nF varicap VT input +33 V 22 kΩ 22 kΩ BC847B FCE049 Fig.4 Asymmetrical application diagram. 1999 Aug 11 8 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.3 +6 V VO(PD) charge-pump (PD) output voltage −0.3 VCC V VI(Q1) crystal (Q1) input voltage −0.3 VCC V VI/O(SDA) serial data (SDA) input/output voltage −0.3 +6 V VI(SCL) serial clock (SCL) input voltage −0.3 +6 V VI/O(P7-P0) input/output ports (P7 to P3 and P0) voltage −0.3 +16 V VI(RFIN) prescaler inputs (RFIN1 and RFIN2) voltage −0.3 +2.5 V VO(UD) drive output (UD) voltage −0.3 VCC V IO(P4-P7) output ports (P7 to P4) current (open-collector) −1 +15 mA IO(SDA) serial data (SDA) output current (open-collector) −1 +5 mA Tstg storage temperature −40 +150 °C Tj maximum junction temperature − 150 °C HANDLING All pins withstand the ESD test in accordance with “MIL-STD-883C”, category A (1000 V). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS from junction to ambient in free air VALUE UNIT 110 K/W CHARACTERISTICS VCC = 5 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VCC supply voltage range 4.5 5 5.5 V Tamb ambient temperature −20 − +85 °C fRF RF input frequency range 1 − 2.65 GHz N divider ratio 256 − 32767 ICC supply current − 60 80 mA fXTAL crystal oscillator frequency 3.2 4 4.48 MHz ZXTAL crystal oscillator impedance (pin 2) 600 1000 − Ω VXTAL(p-p) drive level on pin 2 (quartz Philips 4322 143 04093) (peak-to-peak value) − 110 − mV VI(rms) input voltage level (RMS value) VCC = 4.5 to 5.5 V; Tamb = −20 to +85 °C; see typical sensitivity curve in Fig.5 50/−13 − 300/2.6 mV/dBm 70/−10 − 300/2.6 mV/dBm see Smith chart in Fig.6 − 50 − Ω − 2 − pF f = 1 to 1.8 GHz f = 1.8 to 2.65 GHz RI prescaler input impedance CI input capacitance 1999 Aug 11 absolute value 9 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer SYMBOL PARAMETER TSA5055T CONDITIONS MIN. TYP. MAX. UNIT Output ports P3 and P0 (current limited) ILO leakage current Vo = 13.5 V − − 10 µA IOS output sink current Vo = 13.5 V 0.7 1 1.5 mA Output ports P7 to P4 (open collector); see note 1 ILO leakage current Vo = 13.5 V − − 10 µA VOL output voltage LOW Io = 10 mA; note 2 − − 0.7 V Input ports P6 and P3 IIH input current HIGH VIH = 13.5 V − − 10 µA IIL input current LOW VIL = 0 V −10 − − µA 2.7 − − V Input ports P7, P5 and P4 VIH input voltage HIGH VIL input voltage LOW − − 0.8 V IIH input current HIGH VIH = 13.5 V − − 10 µA IIL input current LOW VIL = 0 V −10 − − µA Bus inputs SCL and SDA VIH input voltage HIGH 3 − 5.5 V VIL input voltage LOW − − 1.5 V IIH input current HIGH IIL input current LOW VIH = 5 V; VCC = 0 V − − 10 µA VIH = 5 V; VCC = 5 V − − 10 µA VIL = 0 V; VCC = 0 V −10 − − µA VIL = 0 V; VCC = 5 V −10 − − µA Output SDA (open-collector) IOH leakage current VOH = 5.5 V − − 10 µA VOL output voltage IOL = 3 mA − − 0.4 V 220 300 µA Charge-pump output PD IOH output current HIGH (absolute value) CP = 1 90 IOL output current LOW (absolute value) CP = 0 22 50 75 µA VO output voltage in-lock 1.5 − 2.5 V IO(leak) off-state leakage current T0 = 1 −5 − +5 nA − − 100 mV mV Operational amplifier output UD (test mode: T0 = 1) VO output voltage output voltage when switched off T0 = 1; OS = 1; VO(PD) = 2 V − − 250 hFE operational amplifier current gain T0 = 1, OS = 0; VO(PD) = 2 V IO(UD) = 10 µA 2000 − − I O ( UD ) ----------------------------------------------I O ( PD ) – I O ( PD leak ) VO(PD) = 0 V Notes 1. When a port is active, the collector voltage must not exceed 6 V. 2. Measured with a single open-collector active. 1999 Aug 11 10 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T FCE060 9 handbook, halfpage Vi (dBm) guaranteed operating area −3 −10 dBm −15 −27 −39 0 800 1600 2400 3200 2650 f (MHz) VCC = 5 V; Tamb = 25 °C. Fig.5 Typical input sensitivity curve. 1 handbook, full pagewidth 0.5 2 0.2 5 2.65 GHz 10 +j 0 0.2 0.5 1 2 5 10 ∞ 2 GHz −j 10 5 0.2 1 GHz 2 0.5 1 FCE061 VCC = 5 V; reference value = 50 Ω. Fig.6 Smith chart of typical input impedance. 1999 Aug 11 11 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T FLOCK FLAG DEFINITION (FL) When the FL flag is 1, the maximum frequency deviation (∆f) from stable frequency can be expressed as follows: K VCO C1 + C2 ∆f = ± -------------- × I CP × ---------------------- KO C1 × C2 C2 handbook, halfpage C1 where: R MGA032 KVCO = oscillator slope (Hz/V) ICP = charge-pump current (A) KO = 4 × 106 Fig.7 Loop filter. C1 and C2 = loop filter capacitors. Flock flag settings PARAMETER MIN. MAX. UNIT Time span between actual phase lock and FL-flag setting 1024 1152 µs Time span between the loop losing lock and FL-flag resetting 0 128 µs Flock flag application • KVCO = 50 MHz/V • ICP = 220 µA • C1 = 180 nF • C2 = 39 nF • ∆f = ±85.8 kHz. 1999 Aug 11 12 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T EQUIVALENT INPUT CIRCUITS VCC Vref Vref 1 600 Ω 600 Ω PD 200 Ω RFIN1 13 170 Ω RFIN2 14 16 UD OS FCE051 FCE052 Fig.8 RF input amplifier. Fig.9 Current amplifier. VCC VCC (2) 6-11 (2) (1) 1 kΩ (2) SDA 4 FCE053 FCE054 (1) This resistor is implemented only for P0 and P3. (2) These components are not implemented for P0. Fig.11 I2C SDA. Fig.10 Input/output ports, pins 6 to 11. 1999 Aug 11 13 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T VCC VCC Q2 3 Q1 2 1 kΩ SCL 5 FCE055 FCE056 Fig.12 I2C SCL. 1999 Aug 11 Fig.13 Reference oscillator. 14 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T PACKAGE OUTLINE SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.244 0.041 0.228 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC 1999 Aug 11 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 15 o 8 0o Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer SOLDERING TSA5055T If wave soldering is used the following conditions must be observed for optimal results: Introduction to soldering surface mount packages • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Wave soldering Manual soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. To overcome these problems the double-wave soldering method was specifically developed. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 1999 Aug 11 16 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE REFLOW(1) WAVE BGA, SQFP not suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS not PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO suitable suitable(2) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Aug 11 17 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer TSA5055T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 1999 Aug 11 18 Philips Semiconductors Product specification 2.65 GHz bidirectional I2C-bus controlled synthesizer NOTES 1999 Aug 11 19 TSA5055T Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1999 SCA 67 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545004/25/03/pp20 Date of release: 1999 Aug 11 Document order number: 9397 750 05009