Features ■ ■ ■ ■ ■ 0603 package Rated for IEC 61000-4-2, level 4 ESD requirements for high speed USB 2.0 or IEEE1394 applications Withstands multiple ESD strikes Low capacitance and leakage currents for invisible load protection Tape and reel packaging ChipGuard® MLC Series Varistor ESD Clamp Protectors Electrical Characteristics @ 25 °C (unless otherwise noted) Description The ChipGuard® CG0603MLC Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been designed to protect equipment to IEC61000-4-2, level 4 ESD specifications targeted for high speed USB 2.0 or IEEE1394 applications. The ChipGuard® MLC Series has been manufactured to provide very low capacitance and leakage currents with excellent clamp qualities, making the family almost transparent under normal working conditions. Device Symbol Parameter Device Typ. Max. Continuous operating voltage CG0603MLC-05 CG0603MLC-12 5 12 6 Clamping voltage (see notes 1,2,3) CG0603MLC-05 CG0603MLC-12 20 30 35 50 V Off-state capacitance, f = 1 MHz, 1 Vrms bias 0.5 pF IL Off-state current, VDC = max. rating 50 nA VT Trigger voltage (see notes 1,3,4) VDC VCLAMP Coff 150 Unit V V Notes: 1.Per IEC 61000-4-2, 30 A at 8 kV, level 4. 2.Measurement made 30 ns after initiation of pulse. 3.Test conducted in contact discharge mode. 4.Measurement made at maximum pulse voltage. V Environmental Characteristics Response Time ................................................................................................................<1 ns Operating Temperature ..................................................................................-55 °C to +85 °C Storage Temperature ......................................................................................-55 °C to +85 °C How to Order CG 0603 MLC - 05 E ChipGuard Product Designator ® Package Option 0603 = 0603 Package Surge Withstand Ratings Peak Voltage Repetitions (Min.) ESD Voltage Capability, Contact Discharge 8 kV 100 at 8 kV ESD Voltage Capability, Air Discharge 15 kV 100 at 15 kV Parameter Multilayer Series Designator Operating Voltage 05 = 5 V 12 = 12 V Packaging E = Tape and Reel 5,000 pcs. per reel Standard Ni barrier terminations are standard on all ChipGuard® part numbers. Reliable Electronic Solutions Asia-Pacific: TEL +886-2 25624117 FAX +886-2 25624116 Europe: TEL +41-41 7685555 FAX +41-41 7685510 The Americas: TEL +1-951 781-5500 FAX +1-951 781-5700 www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. IEC61000-4-2 Level 4 ChipGuard® MLC Series Varistor ESD Clamp Protectors Recommended Pad Layout Product Dimensions 0.75 ± 0.10 (0.03 ± 0.004) 0.50 ± 0.1 (0.020 ± 0.004) 0.80 ± 0.2 (0.032 ± 0.008) DIMENSIONS = MM (INCHES) 0.30 ± 0.2 (0.012 ± 0.008) 1.60 ± 0.2 (0.064 ± 0.008) 0.75 ± 0.10 (0.03 ± 0.004) 0.75 ± 0.10 (0.03 ± 0.004) Packaging Dimensions 1.10 ± 0.20 (0.044 ± 0.008) 2.00 ± 0.05 (0.08 ± 0.002) 13.0 ± 1.0 (0.52 ± 0.04) 3.50 ± 0.05 (0.14 ± 0.002) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) 13.0 ± 0.50 (0.52 ± 0.02) 1.90 ± 0.20 (0.076 ± 0.008) 1.50 ± 0.10 (0.06 ± 0.004) 4.00 ± 0.10 (0.16 ± 0.004) 1.75 ± 0.10 (0.04 ± 0.004) 21.0 ± 0.80 (0.84 ± 0.032) 8.00 ± 0.30 (0.32 ± 0.012) 180.8 ± 2.0 (7.12 ± 0.08) NOTES: TAPE MATERIAL IS PAPER. 0.60 ± 0.05 TAPE THICKNESS IS (0.024 ± 0.002) COVER TAPE ADHESION IS 40 ± 15 GRAMS. 9.0 ± 0.50 (0.36 ± 0.02) Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Ambient to Preheating 30 s to 60 s Temperature 200 B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s 150 C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 210 220 230 240 60 55 50 40 30 E Cooling 200 °C to 100 °C Temperature (°C) 250 100 50 0 110 sec. (min.) 30-70 sec. 120 sec. (min.) °C °C °C °C °C s s s s s to to to to to 70 65 60 50 40 s s s s s 1 °C/s to 4 °C/s Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. REV. D 01/05 A solder gun under 30 watts is recommended. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. “ChipGuard” is a registered trademark of Bourns, Inc.