TD62001~004P/AP/F/AF TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62001P,TD62001AP,TD62001F,TD62001AF,TD62002P TD62002AP,TD62002F,TD62002AF,TD62003P,TD62003AP,TD62003F TD62003AF,TD62004P,TD62004AP,TD62004F,TD62004AF 7CH DARLINGTON SINK DRIVER The TD62001P / AP / F / AF Series are high−voltage, high−current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. FEATURES l Output current (single output) 500 mA MAX. l High sustaining voltage output 35 V MIN. (TD62001P / F Series) 50 V MIN. (TD62001AP / AF Series) l Output clamp diodes l Inputs compatible with various types of logic l Package Type−P, AP : DIP−16 pin l Package Type−F, AF : SOP−16 pin TYPE INPUT BASE RESISTOR TD62001P / AP / F / AF External General Purpose TD62002P / AP / F / AF 10.5−kΩ + 7 V Zenner diode 14~25 V PMOS TD62003P / AP / F / AF 2.7 kΩ TTL, 5 V CMOS TD62004P / AP / F / AF 10.5 kΩ 6~15 V PMOS, CMOS DESIGNATION Weight DIP16−P−300−2.54A : 1.11 g (Typ.) SOP16−P−225−1.27 : 0.16 g (Typ.) PIN CONNECTION (TOP VIEW) 1 2001-06-27 TD62001~004P/AP/F/AF SCHEMATICS (EACH DRIVER) TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF TD62004P / AP / F / AF Note: The input and output parasitic diodes cannot be used as clamp diodes. MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Output Sustaining Voltage SYMBOL P, F AP, AF Output Current −0.5~35 −0.5~50 IOUT Input Voltage VIN (Note 1) Input Current Clamp Diode Reverse Voltage VCE (SUS) RATING AP, AF Clamp Diode Forward Current mA / ch −0.5~30 V 25 mA 35 VR 50 IF 500 P Power Dissipation AP Storage Temperature P AP, F, AF V mA 1.0 PD 1.47 W 0.54 / 0.625 (Note 3) F, AF Operating Temperature V 500 IIN (Note 2) P, F UNIT Topr Tstg −30~75 −40~85 −55~150 °C °C Note 1: Except TD62001P / AP / F / AF Note 2: Only TD62001P / AP / F / AF Note 3: On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%) 2 2001-06-27 TD62001~004P/AP/F/AF RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C and Ta = −30~75°C for only Type−P) CHARACTERISTIC SYMBOL P, F Output Sustaining Voltage AP, AF CONDITION P IOUT Tpw = 25 ms 7 Circuits Ta = 85°C Tj = 120°C F, AF Input Voltage Except TD62001P / AP / F / AF TYP. MAX 0 ― 35 0 ― 50 Duty = 10% 0 ― 370 Duty = 50% 0 ― 130 Duty = 10% 0 ― 295 Duty = 50% 0 ― 95 Duty = 10% 0 ― 233 Duty = 50% 0 ― 70 0 ― 24 14.5 ― 24 2.8 ― 24 VCE (SUS) AP Output Current MIN VIN TD62002 Input Voltage (Output On) Input Voltage (Output Off) TD62003 VIN (ON) IOUT = 400 mA hFE = 800 TD62004 6.2 ― 24 TD62001 0 ― 0.6 0 ― 7.4 0 ― 0.7 0 ― 1.0 0 ― 10 ― ― 35 ― ― 50 ― ― 350 ― ― 0.6 ― ― 0.76 ― ― 0.325 TD62002 TD62003 VIN (OFF) TD62004 Input Current Only TD62001 Clamp Diode Reverse Voltage P, F AP, AF Clamp Diode Forward Current IIN VR IF P Power Dissipation AP AF, F Note: PD Ta = 85°C Ta = 85°C (Note) UNIT V mA / ch V V V mA V mA W On glass epoxy PCB (30 × 30 × 1.6 mm Cu 50%) 3 2001-06-27 TD62001~004P/AP/F/AF ELECTRICAL CHARACTERISTICS (Ta = 25°C unless otherwise noted) CHARACTERISTIC SYMBOL TEST CIR− CUIT MIN TYP. MAX VCE = 50 V, Ta = 25°C ― ― 50 VCE = 50 V, Ta = 85°C ― ― 100 VCE = 35 V, Ta = 25°C ― ― 50 VCE = 35 V, Ta = 85°C ― ― 100 VCE = 35 V, Ta = 25°C ― ― 50 VCE = 35 V, Ta = 75°C ― ― 100 IOUT = 350 mA, IIN = 500 µA ― 1.3 1.6 IOUT = 200 mA, IIN = 350 µA ― 1.1 1.3 IOUT = 100 mA, IIN = 250 µA ― 0.9 1.1 VCE = 2 V, IOUT = 350 mA 1000 ― ― VIN = 20 V, IOUT = 350 mA ― 1.1 1.7 VIN = 2.4 V, IOUT = 350 mA ― 0.4 0.7 VIN = 9.5 V, IOUT = 350 mA ― 0.8 1.2 IOUT = 500 µA, Ta = 75°C 50 65 ― IOUT = 500 µA, Ta = 85°C 50 65 ― IOUT = 350 mA ― ― 13.7 IOUT = 200 mA ― ― 11.4 IOUT = 350 mA ― ― 2.6 IOUT = 200 mA ― ― 2.0 IOUT = 350 mA ― ― 4.7 IOUT = 200 mA ― ― 4.4 VR = 50 V, Ta = 25°C ― ― 50 VR = 50 V, Ta = 85°C ― ― 100 VR = 35 V, Ta = 25°C ― ― 50 VR = 35 V, Ta = 85°C ― ― 100 VR = 35 V, Ta = 25°C ― ― 50 VR = 35 V, Ta = 75°C ― ― 100 IF = 350 mA ― ― 2.0 V ― 15 ― pF VOUT = 35 V, RL = 87.5 Ω CL = 15 pF ― 0.1 ― AP, AF VOUT = 50 V, RL = 125 Ω CL = 15 pF ― 0.1 ― P, F VOUT = 35 V, RL = 87.5 Ω CL = 15 pF ― 0.2 ― VOUT = 50 V, RL = 125 Ω CL = 15 pF ― 0.2 ― AP, AF Output Leakage Current F ICEX 1 P Collector−Emitter Saturation Voltage DC Current Transfer Ratio VCE (sat) hFE 2 2 TD62002 Input Current (Output On) TD62003 IIN (ON) 3 TD62004 Input Current (Output Off) P AP, F, AF IIN (OFF) 4 TEST CONDITION TD62002 Input Voltage (Output On) TD62003 VIN (ON) 5 VCE = 2 V hFE = 800 TD62004 AP, AF Clamp Diode Reverse Current F IR 6 P Clamp Diode Forward Voltage VF 7 Input Capacitance CIN ― P, F Turn−On Delay tON Turn−Off Delay tOFF AP, AF 8 8 4 UNIT µA V mA µA V µA µs 2001-06-27 TD62001~004P/AP/F/AF TEST CIRCUIT 1. ICEX 2. VCE (sat), hFE 3. IIN (ON) 4. IIN (OFF) 5. VIN (ON) 6. IR 7. VF 5 2001-06-27 TD62001~004P/AP/F/AF 8. tON, tOFF Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns Note 2: See below INPUT CONDITION TYPE NUMBER R1 VIH TD62001P / AP / F / AF 2.7 kΩ 3V TD62002P / AP / F / AF 0 13 V TD62003P / AP / F / AF 0 3V TD62004P / AP / F / AF 0 8V Note 3: CL includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 6 2001-06-27 TD62001~004P/AP/F/AF 7 2001-06-27 TD62001~004P/AP/F/AF 8 2001-06-27 TD62001~004P/AP/F/AF 9 2001-06-27 TD62001~004P/AP/F/AF 10 2001-06-27 TD62001~004P/AP/F/AF PACKAGE DIMENSIONS DIP16−P−300−2.54A Unit : mm Weight: 1.11 g (Typ.) 11 2001-06-27 TD62001~004P/AP/F/AF PACKAGE DIMENSIONS SOP16−P−225−1.27 Unit : mm Weight: 0.16 g (Typ.) 12 2001-06-27 TD62001~004P/AP/F/AF RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 13 2001-06-27