TCV7104FN TOSHIBA CMOS Integrated Circuit Silicon Monolithic TCV7104FN Buck DC-DC Converter IC The TCV7104FN is a single-chip buck DC-DC converter IC. The TCV7104FN contains high-speed and low-on-resistance power MOSFETs for the main switch and synchronous rectifier to achieve high efficiency. Features • Enables up to 2 A of load current (IOUT) with a minimum of external components. • High efficiency: η = 95% (typ.) (@VIN = 5 V, VOUT = 3.3 V, IOUT = 0.7 A) Weight: 0.017 g (typ.) • Operating voltage range: VIN = 2.7 to 5.5 V • Low ON-resistance: RDS (ON) = 0.18 Ω (high-side) / 0.12 Ω (low-side) typical (@VIN = 5 V, Tj = 25°C) • High oscillation frequency: fOSC = 1500 kHz (typ.) • Feedback voltage: VFB = 0.8 V ± 1% (@Tj = 25°C) • Uses internal phase compensation to achieve high efficiency with a minimum of external components. • Allows the use of a small surface-mount ceramic capacitor as an output filter capacitor. • Housed in a small surface-mount package (PS-8) with a low thermal resistance. • Soft-start time adjustable by an external capacitor Part Marking Pin Assignment Part Number (or abbreviation code) LX 8 EN SS 7 6 VFB 5 Lot No. V104 The dot (•) on the top surface indicates pin 1. *: 1 2 3 4 PGND VIN1 VIN2 SGND The lot number consists of three digits. The first digit represents the last digit of the year of manufacture, and the following two digits indicates the week of manufacture between 01 and either 52 or 53. Manufacturing week code (The first week of the year is 01; the last week is 52 or 53.) Manufacturing year code (last digit of the year of manufacture) This product has a MOS structure and is sensitive to electrostatic discharge. Handle with care. The product(s) in this document (“Product”) contain functions intended to protect the Product from temporary small overloads such as minor short-term overcurrent, or overheating. The protective functions do not necessarily protect Product under all circumstances. When incorporating Product into your system, please design the system (1) to avoid such overloads upon the Product, and (2) to shut down or otherwise relieve the Product of such overload conditions immediately upon occurrence. For details, please refer to the notes appearing below in this document and other documents referenced in this document. 1 2010-03-23 TCV7104FN Ordering Information Part Number Shipping TCV7104FN (TE85L, F) Embossed tape (3000 units per reel) Block Diagram VIN2 VIN1 Current detection Oscillator Under voltage lockout Slope Compensation Control logic Driver LX Constant-current source (8 μA) VFB Short-Circuit Protection Error amplifier SS Phase compensation EN Soft Start PGND Ref. Voltage (0.8 V) SGND Pin Description Pin No. Symbol 1 PGND 2 VIN1 3 VIN2 4 SGND 5 VFB Description Ground pin for the output section Input pin for the output section This pin is placed in the standby state if VEN = low. Standby current is 10 μA or less. Input pin for the control section This pin is placed in the standby state if VEN = low. Standby current is 10 μA or less. Ground pin for the control section Feedback pin This input is fed into an internal error amplifier with a reference voltage of 0.8 V (typ.). Soft-start pin 6 SS When the SS input is left open, the soft-start time is 1 ms (typ.). The soft-start time can be adjusted with an external capacitor. The external capacitor is charged from a 8 μA (typ.) constant-current source, and the reference voltage of the error amplifier is regulated between 0 V and 0.8 V. The external capacitor is discharged when EN = low and in case of undervoltage lockout or thermal shutdown. Enable pin 7 EN When EN ≥ 1.5 V (@ VIN = 5 V), the internal circuitry is allowed to operate and thus enable the switching operation of the output section. When EN ≤ 0.5 V (@ VIN = 5 V), the internal circuitry is disabled, putting the TCV7104FN in Standby mode. This pin has an internal pull-down resistor of approx. 500 kΩ. 8 LX Switch pin This pin is connected to high-side P-channel MOSFET and low-side N-channel MOSFET. 2 2010-03-23 TCV7104FN Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Input pin voltage for the output section VIN1 −0.3 to 6 V Input pin voltage for the control section VIN2 −0.3 to 6 V Feedback pin voltage VFB −0.3 to 6 V Soft-start pin voltage VSS −0.3 to 6 V Enable pin voltage VEN −0.3 to 6 V VEN-VIN2 VEN – VIN2 < 0.3 V VLX −0.3 to 6 V ILX ±2.4 A PD 0.9 W Tjopr −40 to125 °C Tj 150 °C Tstg −55 to150 °C VEN – VIN2 voltage difference Switch pin voltage (Note 1) Switch pin current Power dissipation (Note 2) Operating junction temperature Junction temperature (Note 3) Storage temperature Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc) Note 1: The switch pin voltage (VLX) doesn’t include the peak voltage generated by TCV7104FN’s switching. A negative voltage generated in dead time is permitted among the switch pin current (ILX). Thermal Resistance Characteristics Characteristics Symbol Max Unit Thermal resistance, junction to ambient Rth (j-a) 110.2 (Note 2) °C/W Note 2: Single-sided glass epoxy board FR-4 25.4 × 25.4 × 0.8 (Unit: mm) Note 3: The TCV7104FN may into thermal shutdown at the rated maximum junction temperature. Thermal design is required to ensure that the rated maximum operating junction temperature, Tjopr, will not be exceeded. 3 2010-03-23 TCV7104FN Electrical Characteristics (Tj = 25°C, VIN1 = VIN2 = 2.7 to 5.5 V, unless otherwise specified) Characteristics Operating input voltage Operating current Symbol Test Condition Min Typ. Max Unit VIN (OPR) ⎯ 2.7 ⎯ 5.5 V VIN1 = VIN2 = VEN = VFB = 5 V ⎯ 450 680 μA VOUT (OPR) VEN = VIN1 = VIN2 0.8 ⎯ ⎯ V IIN (STBY) 1 VIN1 = VIN2 = 5 V, VEN = 0 V VFB = 0.8 V ⎯ ⎯ 10 IIN (STBY) 2 VIN1 = VIN2 = 3.3 V, VEN = 0 V VFB = 0.8 V ⎯ ⎯ 10 ILEAK (H) VIN1 = VIN2 = 5 V, VEN = 0 V VFB = 0.8 V, VLX = 0 V ⎯ ⎯ 10 VIH (EN) 1 VIN1 = VIN2 = 5 V 1.5 ⎯ ⎯ VIH (EN) 2 VIN1 = VIN2 = 3.3 V 1.5 ⎯ ⎯ VIL (EN) 1 VIN1 = VIN2 = 5 V ⎯ ⎯ 0.5 VIL (EN) 2 VIN1 = VIN2 = 3.3 V ⎯ ⎯ 0.5 IIH (EN) 1 VIN1 = VIN2 = 5 V, VEN = 5 V 6 ⎯ 13 IIH (EN) 2 VIN1 = VIN2 = 3.3 V, VEN = 3.3 V 4 ⎯ 9 0.792 0.8 0.808 IIN Output voltage range Standby current High-side switch leakage current EN threshold voltage EN input current VFB1 VFB input voltage Tj = 0 to 85℃ VIN = 3.3 V, VEN = 3.3 V 0.8 0.808 VIN1 = VIN2 = 2.7 to 5.5 V VFB = VIN2 −1 ⎯ 1 RDS (ON) (H) 1 VIN1 = VIN2 = 5 V, VEN = 5 V ILX = −1 A ⎯ 0.18 ⎯ RDS (ON) (H) 2 VIN1 = VIN2 = 3.3 V, VEN = 3.3 V ILX = −1 A ⎯ 0.21 ⎯ IFB High-side switch on-state resistance Tj = 0 to 85℃ μA V μA V 0.792 VFB2 VFB input current VIN = 5 V, VEN = 5 V μA μA Ω VIN1 = VIN2 = 5 V , VEN = 5V RDS (ON) (H) 3 ILX = - 0.1 A , Tj=-40～85℃ ⎯ ⎯ 0.25 VIN1 = VIN2 = 3.3 V , VEN = 3.3V RDS (ON) (H) 4 ILX = - 0.1 A , Tj=-40～85℃ ⎯ ⎯ 0.3 RDS (ON) (L) 1 VIN1 = VIN2 = 5 V, VEN = 5 V ILX = 1 A ⎯ 0.12 ⎯ RDS (ON) (L) 2 VIN1 = VIN2 = 3.3 V, VEN = 3.3 V ILX = 1 A ⎯ 0.14 ⎯ RDS (ON) (L) 3 VIN1 = VIN2 = 5 V , VEN = 5V ILX = 0.1 A , Tj=-40 to 85℃ ⎯ ⎯ 0.18 RDS (ON) (L) 4 VIN1 = VIN2 = 3.3 V , VEN = 3.3V ILX = 0.1 A , Tj=-40 to 85℃ ⎯ ⎯ 0.2 1200 1500 1800 kHz Low-side switch on-state resistance VIN1 = VIN2 = VEN = 5 V Ω Oscillation frequency fOSC Internal soft-start time tSS VIN1 = VIN2 = 5 V, IOUT = 0 A, Measured between 0% and 90% points at VOUT. 0.5 1 1.5 ms External soft-start charge current ISS VIN1 = VIN2 = 5 V, VEN = 5 V −5 −8 −13 μA VIN1 = VIN2 = 2.7 to 5.5 V ⎯ ⎯ 100 % TSD VIN1 = VIN2 = 5 V ⎯ 150 ⎯ Hysteresis ΔTSD VIN1 = VIN2 = 5 V ⎯ 15 ⎯ Detection voltage VUV VEN = VIN1 = VIN2 2.3 2.45 2.6 Recovery voltage VUVR VEN = VIN1 = VIN2 2.4 2.55 2.7 Hysteresis ΔVUV VEN = VIN1 = VIN2 ⎯ 0.1 ⎯ VIN1 = VIN2 = 5 V, VOUT = 2 V 2.3 3.2 ⎯ High-side switch duty cycle Thermal shutdown (TSD) Undervoltage lockout (UVLO) LX current limit Detection temperature Dmax ILIM 4 2010-03-23 °C V A TCV7104FN Note on Electrical Characteristics The test condition Tj = 25°C means a state where any drifts in electrical characteristics incurred by an increase in the chip’s junction temperature can be ignored during pulse testing. Application Circuit Example Figure 1 shows a typical application circuit using a low-ESR electrolytic or ceramic capacitor for COUT. VIN VIN1 VIN2 EN EN CIN CC LX L TCV7104FN VOUT RFB1 VFB SS COUT CSS SGND PGND RFB2 GND GND Figure 1 TCV7104FN Application Circuit Example Component values (reference value@ VIN = 5 V, VOUT = 3.3 V, Ta = 25°C) CIN: Input filter capacitor = 10 μF (ceramic capacitor: GRM21BB30J106K manufactured by Murata Manufacturing Co., Ltd.) COUT: Output filter capacitor = 10 μF (ceramic capacitor: GRM21BB30J106K manufactured by Murata Manufacturing Co., Ltd.) RFB1: Output voltage setting resistor = 7.5 kΩ RFB2: Output voltage setting resistor = 2.4 kΩ L: Inductor = 1.5 μH (LTF5022T-1R5N3R6-LC or SLF6045T-1R5N4R0-3PF manufactured by TDK-EPC Corporation) CSS is a capacitor for adjusting the soft-start time. CC is a decoupling capacitor of Input pin for the control section. (Connect it when the circuit operation is unstable due to the board layout or a feature of the CIN.) Examples of Component Values (For Reference Only) Output Voltage Setting VOUT Inductance L Input Capacitance CIN Output Capacitance COUT Feedback Resistor RFB1 Feedback Resistor RFB2 1.2 V 1.5 μH 10 μF 10 μF 7.5 kΩ 15 kΩ 1.51 V 1.5 μH 10 μF 10 μF 16 kΩ 18 kΩ 1.8 V 1.5 μH 10 μF 10 μF 15 kΩ 12 kΩ 2.5 V 1.5 μH 10 μF 10 μF 5.1 kΩ 2.4 kΩ 3.3 V 1.5 μH 10 μF 10 μF 7.5 kΩ 2.4 kΩ Component values need to be adjusted, depending on the TCV7104FN’s I/O conditions and the board layout. 5 2010-03-23 TCV7104FN Application Notes Inductor Selection The inductance required for inductor L can be calculated as follows: VIN: Input voltage (V) VIN − VOUT VOUT VOUT: Output voltage (V) ············· (1) L= ⋅ fOSC ⋅ ΔIL VIN fOSC: Oscillation frequency = 1500 kHz (typ.) ΔIL: Inductor ripple current (A) *: Generally, ΔIL should be set to approximately 30% of the maximum output current. Since the maximum output current of the TCV7104FN is 2.0 A, ΔIL should be 0.6 A or so. The inductor should have a current rating greater than the peak output current of 2.3 A. If the inductor current rating is exceeded, the inductor becomes saturated, leading to an unstable DC-DC converter operation. L= = VIN − VOUT VOUT ⋅ fOSC ⋅ ΔIL VIN 5 V − 3.3 V 3.3 V ⋅ 1500kHz ⋅ 0.6A 5 V ΔIL When VIN = 5 V and VOUT = 3.3 V, the required inductance can be calculated as follows. Be sure to select an appropriate inductor, taking the input voltage range into account. IL (2) 0 T= = 1.25μH V TON = Τ ⋅ OUT VIN 1 fOSC Figure 2 Inductor Current Waveform Setting the Output Voltage A resistive voltage divider is connected as shown in Figure 3 to set the output voltage; it is given by Equation 3 based on the reference voltage of the error amplifier (0.8 V typ.), which is connected to the Feedback pin, VFB. RFB1 should be up to 30 kΩ or so, because an extremely large-value RFB1 incurs a delay due to parasitic capacitance at the VFB pin. It is recommended that resistors with a precision of ±1% or higher be used for RFB1 and RFB2. LX VFB VOUT RFB2 RFB1 VOUT ⎛ ⎞ R = VFB ⋅ ⎜⎜ 1 + FB1 ⎟⎟ R FB2 ⎠ ⎝ ⎛ R ⎞ = 0.8 V ⋅ ⎜⎜1 + FB1 ⎟⎟ ········ (3) ⎝ R FB2 ⎠ Figure 3 Output Voltage Setting Resistors 6 2010-03-23 TCV7104FN Output Filter Capacitor Selection Use a low-ESR electrolytic or ceramic capacitor as the output filter capacitor. Since a capacitor is generally sensitive to temperature, choose one with excellent temperature characteristics. As a rule of thumb, its capacitance should be 10 μF or greater for applications. The capacitance should be set to an optimal value that meets the system’s ripple voltage requirement and transient load response characteristics. The phase margin tends to decrease as the output voltage is getting low. Enlarge a capacitance for output flatness when phase margin is insufficient, or the transient load response characteristics cannot be satisfied. Since the ceramic capacitor has a very low ESR value, it helps reduce the output ripple voltage; however, because the ceramic capacitor provides less phase margin, it should be thoroughly evaluated. Soft-Start Feature The TCV7104FN has a soft-start feature. If the SS pin is left open, the soft-start time, tSS, for VOUT defaults to 1 ms (typ.) internally. The soft-start time can be extended by adding an external capacitor (CSS) between the SS and SGND pins. The soft-start time can be calculated as follows: t SS2 = 0.1 ⋅ C SS ···························· (4) tSS2: Soft-start time (in seconds) when an external capacitor is connected between SS and SGND. CSS: Capacitor value (μF) The soft-start feature is activated when the TCV7104FN exits the undervoltage lockout (UVLO) state after power-up and when the voltage at the EN pin has changed from logic low to logic high. Overcurrent Protection（OCP） The TCV7104FN has maximum current limiting. The TCV7104FN limits the ON time of high side switching transistor and decreases output voltage when the peak value of the LX terminal current exceeds switching terminal peak current limitation ILIM=3.2A(typ.). Undervoltage Lockout (UVLO) The TCV7104FN has undervoltage lockout (UVLO) protection circuitry. The TCV7104FN does not provide output voltage (VOUT) until the input voltage (VIN2) has reached VUVR (2.55 V typ.). UVLO has hysteresis of 0.1 V (typ.). After the switch turns on, if VIN2 drops below VUV (2.45 V typ.), UVLO shuts off the switch at VOUT. Undervoltage lockout recovery voltage VUVR VIN2 Undervoltage lockout detection voltage VUV Hysteresis: ΔVUV GND Switching operation starts VOUT GND Switching operation stops Soft start Figure 4 Undervoltage Lockout Operation 7 2010-03-23 TCV7104FN Thermal Shutdown (TSD) The TCV7104FN provides thermal shutdown. When the junction temperature continues to rise and reaches TSD (150°C typ.), the TCV7104FN goes into thermal shutdown and shuts off the power supply. TSD has a hysteresis of about 15°C (typ.). The device is enabled again when the junction temperature has dropped by approximately 15°C from the TSD trip point. The device resumes the power supply when the soft-start circuit is activated upon recovery from TSD state. Thermal shutdown is intended to protect the device against abnormal system conditions. It should be ensured that the TSD circuit will not be activated during normal operation of the system. TSD detection temperature: TSD Recovery from TSD Hysteresis: ΔTSD Tj 0 Switching operation starts VOUT GND Switching operation stops Soft start Figure 5 Thermal Shutdown Operation Usage Precautions • The input voltage, output voltage, output current and temperature conditions should be considered when selecting capacitors, inductors and resistors. These components should be evaluated on an actual system prototype for best selection. • External components such as capacitors, inductors and resistors should be placed as close to the TCV7104FN as possible. • The TCV7104FN has an ESD diode between the EN and VIN2 pins. The voltage between these pins should satisfy VEN − VIN2 < 0.3 V. • CIN should be connected as close to the PGND and VIN1 pins as possible. Operation might become unstable due to board layout. In that case, add a decoupling capacitor (CC) of 0.1 μF to 1 μF between the SGND and VIN2 pins. • The minimum programmable output voltage is 0.8 V (typ.). If the difference between the input and output voltages is small, the output voltage might not be regulated accurately and fluctuate significantly. • When TCV7104FN is in operation, a negative voltage is generated since regeneration current flows through the switch pin (LX). Even if the current flows through the low side parasitic diode during the dead time of switching transistor, operation is undisturbed so an external flywheel diode is unnecessary. If there is the possibility of an external negative voltage generation, add a diode for protection. • SGND pin is connected with the back of IC chip and serves as the heat radiation pin. Secure the area of a GND pattern as large as possible for greater of heat radiation. • The overcurrent protection circuits in the Product are designed to temporarily protect Product from minor overcurrent of brief duration. When the overcurrent protective function in the Product activates, immediately cease application of overcurrent to Product. Improper usage of Product, such as application of current to Product exceeding the absolute maximum ratings, could cause the overcurrent protection circuit not to operate properly and/or damage Product permanently even before the protection circuit starts to operate. • The thermal shutdown circuits in the Product are designed to temporarily protect Product from minor overheating of brief duration. When the overheating protective function in the Product activates, immediately correct the overheating situation. Improper usage of Product, such as the application of heat to Product exceeding the absolute maximum ratings, could cause the overheating protection circuit not to operate properly and/or damage Product permanently even before the protection circuit starts to operate. 8 2010-03-23 TCV7104FN Typical Performance Characteristics IIN – Tj (μA) 500 400 IIN 400 Operating current (μA) 500 Operating current 600 600 IIN IIN – VIN 300 200 100 VEN = VFB = VIN Tj = 25°C 0 0 1 2 3 4 Input voltage VIN 300 200 100 VEN = VIN = 5 V VFB = VIN 0 5 6 -50 -25 (V) 0 50 75 Junction temperature IIN – Tj Tj 100 125 (°C) VIH(EN), VIL(EN) – Tj 2 600 400 EN threshold voltage VIH(EN), VIL(EN) (V) (μA) IIN VIN = 5 V 500 Operating current 25 300 200 100 1.5 VIH(EN) 1 0.5 VEN = VIN = 3.3 V VFB = VIN 0 0 -50 VIL(EN) -25 0 25 50 Junction temperature 75 100 Tj (°C) 125 -50 -25 0 25 Junction temperature VIH(EN), VIL(EN) – Tj 75 50 Tj 100 125 (°C) IIH(EN) – VEN 2 20 VIN = 5.5 V Tj = 25°C 16 1.5 EN input current IIH(EN) (μA) EN threshold voltage VIH(EN), VIL(EN) (V) VIN = 3.3 V VIH(EN) 1 VIL(EN) 0.5 12 8 4 0 -50 -25 0 25 50 Junction temperature 75 100 Tj (°C) 0 125 0 1 2 3 EN input voltage 9 4 VEN 5 6 (V) 2010-03-23 TCV7104FN IIH(EN) – Tj VUV, VUVR – Tj 14 2.6 Under voltage lockout voltageVUV,VUVR (V) VIN = 5 V VEN = 5 V EN input current IIH(EN) (μA) 12 10 8 Recovery voltage VUVR 2.5 Detection voltage VUV 2.4 VEN = VIN 6 -50 -25 0 25 50 Junction temperature 75 100 Tj (°C) 2.3 -50 125 -25 0 100 Tj 125 (°C) VFB – VIN VFB (V) (V) VEN = VIN VOUT = 1.2 V Tj = 25°C VFB input voltage VOUT Output voltage 75 0.84 1.5 1 0.5 0 VEN = VIN VOUT = 1.2 V Tj = 25°C 0.82 0.8 0.78 0.76 2.2 2.3 2.4 Input voltage 2.5 2.6 VIN 2 2.7 (V) 3 5 VIN 6 (V) ΔVOUT – VIN 30 (mV) VIN = 5 V VOUT = 1.2 V VEN = VIN VOUT = 1.2 V , IOUT = 0 mA L =1.5 μH , COUT = 10 μF Ta = 25°C 20 ΔVOUT 0.81 10 0 Output voltage 0.8 0.79 0.78 -50 4 Input voltage VFB – Tj 0.82 VFB (V) 50 Junction temperature VOUT – VIN 2 VFB input voltage 25 -10 -20 -30 -25 0 25 50 Junction temperature 75 Tj 100 2 125 3 4 Input voltage (°C) 10 5 VIN 6 (V) 2010-03-23 TCV7104FN fOSC – Tj fOSC – VIN 1800 1800 (kHz) fOSC 1600 Oscillation frequency 1600 Oscillation frequency (kHz) VIN = 5 V 1700 fOSC Tj = 25°C 1700 1500 1400 1300 1200 1500 1400 1300 1200 2 3 4 Input voltage 5 VIN 6 -50 (V) -25 0 50 Junction temperature ISS – VIN 75 Tj 100 125 (°C) ISS – Tj 0 0 Tj = 25°C VIN = 5 V -2 External soft-start charge current ISS (μA) External soft-start charge current ISS (μA) 25 -4 -6 -8 -10 -12 -14 -2 -4 -6 -8 -10 -12 -14 2 3 4 5 Input voltage, VIN -50 6 (V) -25 0 25 50 Junction temperature 75 Tj 100 125 (°C) ISS – Tj External soft-start charge current ISS (μA) 0 VIN = 3.3 V -2 -4 -6 -8 -10 -12 -14 -50 -25 0 25 50 Junction temperature 75 100 Tj (°C) 125 11 2010-03-23 TCV7104FN ΔVOUT – IOUT 10 5 Output voltage 0 (mV) VIN = 5 V , VOUT = 3.3 V L = 1.5 μH , COUT =10 μF Ta = 25°C ΔVOUT (mV) ΔVOUT 10 Output voltage 20 -10 -20 -30 1 1.5 Output current IOUT -10 0.5 (A) 1 1.5 Output current VIN =3.3V , VOUT =1.2 V L = 1.5 μH , COUT =10 μF Ta = 25°C IOUT 2 (A) η – IOUT 100 (%) 90 Efficiency η (mV) ΔVOUT -5 0 ΔVOUT – IOUT Output voltage 0 2 15 5 VIN = 5 V , VOUT = 1.2 V L = 1.5μH , COUT =10 μF Ta = 25°C -15 0.5 0 10 ΔVOUT – IOUT 15 30 0 -5 80 70 60 VIN = 5 V , VOUT = 1.2V L = 1.5 μH , COUT =10 μF Ta = 25°C -10 50 -15 0.5 0 1 1.5 Output current IOUT 0 2 0.5 Output current (A) IOUT 2 (A) 90 90 (%) 100 100 80 η 70 Efficiency (%) η 1.5 η – IOUT η – IOUT Efficiency 1 80 70 60 60 VIN = 5 V , VOUT = 3.3V L = 1.5 μH , COUT = 10 μF Ta = 25°C 50 0 0.5 1 Output current 1.5 IOUT VIN =3.3 V , VOUT = 1.2V L = 1.5μH , COUT =10 μF Ta = 25°C 50 0 2 0.5 1 Output current (A) 12 1.5 IOUT 2 (A) 2010-03-23 TCV7104FN Overcurrent Protection Overcurrent Protection 2 2 VIN = 5V , VOUT = 1.2V L = 1.5μH , COUT = 10 μF Ta = 25°C (V) VOUT 1.5 1 Output voltage Output voltage VOUT (V) VIN = 3.3V , VOUT = 1.2V L = 1.5μH , COUT = 10 μF Ta = 25°C 0.5 1.5 1 0.5 0 0 1 2 Output current 3 IOUT 1 4 2 (A) Output current Overcurrent Protection IOUT (A) (V) 4 (V) VOUT 3 Output voltage VOUT 4 Overcurrent Protection 4 Output voltage 3 2 1 VIN = 3.8V , VOUT = 3.3 V L = 1.5μH , COUT = 10 μF Ta = 25°C 3 2 1 VIN = 5 V , VOUT = 3.3 V L = 1.5μH , COUT = 10 μF Ta = 25°C 0 0 1 2 Output current 3 IOUT 4 1 (A) 2 Output current 13 3 4 IOUT (A) 2010-03-23 TCV7104FN Startup Characteristics (Internal Soft-Start Time) VIN = 5 V VOUT = 3.3 V Ta = 25°C L = 1.5μH COUT = 10 μF Startup Characteristics (CSS = 0.1 μF) VIN = 5 V VOUT = 3.3 V Ta = 25°C L = 1.5 μH COUT = 10 μF Output voltage: VOUT (1V/div) Output voltage: VOUT (1V/div) EN voltage: VEN:L→H EN voltage: VEN:L→H 200 μs/div 2 ms/div Load Response Characteristics Load Response Characteristics VIN =5 V , VOUT = 3.3 V , Ta = 25°C L = 1.5 μH , COUT = 10 μF VIN =5 V , VOUT = 1.2 V , Ta = 25°C L = 1.5 μH , COUT = 10 μF Output voltage: VOUT (200 mV/div) Output voltage: VOUT (100 mV/div) Output current: IOUT : (10mA→2A→10mA) Output current: IOUT : (10mA→2A→10mA) 100 μs/div 100 μs/div 14 2010-03-23 TCV7104FN Package Dimensions Weight: 0.017 g (typ.) 15 2010-03-23 TCV7104FN RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 16 2010-03-23