TC74VCXH16646FT TENTATIVE TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic TC74VCXH16646FT Low-Voltage 16-Bit Bus Transceiver/Register with Bushold The TC74VCXH16646FT is a high-performance CMOS 16-bit bus transceiver/register. Designed for use in 1.8-V, 2.5-V or 3.3-V systems, it achieves high-speed operation while maintaining the CMOS low power dissipation. This device is bus transceiver with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the internal registers. The A, B data inputs include active bushold circuitry, eliminating the need for external pull-up resisisors to hold unused or floating data inputs at a valid logic level. All inputs are equipped with protection circuits against static discharge. Weight: 0.25 g (typ.) Features · Low-voltage operation: VCC = 1.8 to 3.6 V · Bushold on data inputs eliminating the need for external pull-up/pull-down resistors · High-speed operation : tpd = 2.9 ns (max) (VCC = 3.0 to 3.6 V) : tpd = 3.5 ns (max) (VCC = 2.3 to 2.7 V) : tpd = 7.0 ns (max) (VCC = 1.8 V) · 3.6-V tolerant control inputs · Output current : IOH/IOL = ±24 mA (min) (VCC = 3.0 V) : IOH/IOL = ±18 mA (min) (VCC = 2.3 V) : IOH/IOL = ±6 mA (min) (VCC = 1.8 V) · Latch-up performance: ±300 mA · ESD performance : Machine model > ±200 V · Package: TSSOP (thin shrink small outline package) : Human body model > ±2000 V Note 1: Do not apply a signal to any bus pins when it is in the output mode. Damage may result. 1 2001-10-16 TC74VCXH16646FT Pin Assignment (top view) IEC Logic Symbol 1DIR 1 56 1OE 1CAB 2 55 1CBA 1SAB 3 54 1SBA GND 4 53 GND 1A1 5 52 1B1 1A2 6 51 1B2 VCC 7 50 VCC 1A3 8 49 1B3 1A4 9 48 1B4 1A5 10 47 1B5 1OE 1DIR 56 1 1CBA 1SBA 1CAB 1SAB 2OE 2DIR 55 54 2 3 29 28 2CBA 2SBA 2CAB 2SAB 30 31 27 26 1A1 5 GND 11 46 GND 1A6 12 45 1B6 1A7 13 44 1B7 1A8 14 43 1B8 1A3 2A1 15 42 2B1 1A4 2A2 16 41 2B2 2A3 17 40 2B3 1A2 1A5 1A6 GND 18 39 GND 2A4 19 38 2B4 2A5 20 37 2B5 1A7 2A6 21 36 2B6 VCC 22 35 VCC 2A7 23 34 2B7 1A8 2A1 2A2 2A8 24 33 2B8 GND 25 32 GND 2SAB 26 31 2SBA 2A4 2CAB 27 30 2CBA 2A5 2DIR 28 29 2OE 2A3 2A6 2A7 2A8 2 G3 3EN1 (BA) 3EN2 (AB) C4 G5 C6 G7 G10 10EN8 (BA) 10EN9 (AB) C11 G12 C13 G14 > 1 5 1 6D 1 5 7 > 7 4D 52 6 51 8 49 9 48 10 47 12 45 13 44 14 43 15 > 1 1B1 1 1 2 12 11D 8 12 1 13D 14 > 1 9 14 1 42 16 41 17 40 19 38 20 37 21 36 23 34 24 33 1B2 1B3 1B4 1B5 1B6 1B7 1B8 2B1 2B2 2B3 2B4 2B5 2B6 2B7 2B8 2001-10-16 TC74VCXH16646FT Truth Table Control Inputs OE H DIR Bus CAB CBA SAB SBA X* X* X X X* X* X* L L X X Input Input Z Z X X Input Output L L H H L L H H X Qn L L H H Output Input L L H H L L H H Qn X L L H H X H X* X* X* X* X* X* L B X X L Function A H H X X X X L L L X* X* X* X H X H The output functions of A and B Busses are disabled. Both A and B Busses are used as inputs to the internal flip-flops. Data on the Bus will be stored on the rising edge of the Clock. The data on the A bus are displayed on the B bus. The data on the A bus are displayed on the B Bus, and are stored into the A storage flip-flops on the rising edge of CAB. The data in the A storage flop-flops are displayed on the B Bus. The data on the A Bus are stored into the A storage flip-flops on the rising edge of CAB, and the stored data propagate directly onto the B Bus. The data on the B Bus are displayed on the A bus. The data on the B Bus are displayed on the A Bus, and are stored into the B storage flip-flops on the rising edge of CBA. The data in the B storage flip-flops are displayed on the A Bus. The data on the B Bus are stored into the B storage flip-flops on the rising edge of CBA, and the stored data propagate directly onto the A Bus. X: Don’t care Z: High impedance Qn: The data stored into the internal flip-flops by most recent low to high transition of the clock inputs. *: The clocks are not internally with either OE or DIR. Therefore, data on the A and/or B busses may be clocked into the storage flip-flops at any time. 3 2001-10-16 TC74VCXH16646FT System Diagram 56 1OE 1 1DIR 1A1 BA 5 D Q fA CK BB Q fB D 52 1B1 CK 1A8 1CAB 1SAB 14 2 3 55 fA fB BA 2OE 2DIR 2A1 43 Same as above block 54 1B8 1CBA 1SBA BB 29 28 BA 15 D Q fA CK BB Q fB D 42 2B1 CK 2A8 2CAB 2SAB 24 33 Same as above block 27 26 30 fA fB BA 31 2B8 2CBA 2SBA BB 4 2001-10-16 TC74VCXH16646FT Timing Chart OE DIR SAB SBA CAB CBA A B A: Input B: Output : Don’t care A: Output B: Input A: Z B: Z Z: High impedance 5 2001-10-16 TC74VCXH16646FT Maximum Ratings Characteristics Power supply voltage DC input voltage Symbol Rating Unit VCC -0.5 to 4.6 V (DIR, OE , CAB, CBA, SAB, SBA) -0.5 to 4.6 VIN (An, Bn) -0.5 to VCC + 0.5 V (Note 2) -0.5 to VCC + 0.5 DC output voltage (An, Bn) VOUT (Note 3) V Input diode current IIK -50 Output diode current IOK ±50 Output current IOUT ±50 mA PD 400 mW ICC/IGND ±100 mA Tstg -65 to 150 °C Power dissipation DC VCC/ground current per supply pin Storage temperature mA (Note 4) mA Note 2: OFF state Note 3: High or low state. IOUT absolute maximum rating must be observed. Note 4: VOUT < GND, VOUT > VCC Recommended Operating Range (Note 5) Characteristics Power supply voltage Input voltage Symbol VCC (DIR, OE , CAB, CBA, SAB, SBA) VIN Rating 1.8 to 3.6 (An, Bn) Output current V 1.2 to 3.6 (Note 6) -0.3 to 3.6 V 0 to VCC (Note 7) (An, Bn) Output voltage Unit 0 to VCC (Note 8) VOUT IOH/IOL Operating temperature Topr Input rise and fall time dt/dv ±24 (Note 9) ±18 (Note 10) ±6 (Note 11) -40 to 85 0 to 10 (Note 12) V mA °C ns/V Note 5: Floating or unused control inputs must be held high or low. Note 6: Data retention only Note 7: OFF state Note 8: High or low state Note 9: VCC = 3.0 to 3.6 V Note 10: VCC = 2.3 to 2.7 V Note 11: VCC = 1.8 V Note 12: VIN = 0.8 to 2.0 V, VCC = 3.0 V 6 2001-10-16 TC74VCXH16646FT Electrical Characteristics < 3.6 V) DC Characteristics (Ta = -40 to 85°C, 2.7 V < VCC = Characteristics Symbol Test Condition Min Max Unit VCC (V) Input voltage H-level VIH ¾ 2.7 to 3.6 2.0 ¾ L-level VIL ¾ 2.7 to 3.6 ¾ 0.8 IOH = -100 mA 2.7 to 3.6 VCC - 0.2 ¾ IOH = -12 mA 2.7 2.2 ¾ IOH = -18 mA 3.0 2.4 ¾ IOH = -24 mA 3.0 2.2 ¾ IOL = 100 mA 2.7 to 3.6 ¾ 0.2 IOL = 12 mA 2.7 ¾ 0.4 IOL = 18 mA 3.0 ¾ 0.4 IOL = 24 mA 3.0 ¾ 0.55 2.7 to 3.6 ¾ ±5.0 VIN = 0.8 V 3.0 75 ¾ VIN = 2.0 V 3.0 -75 ¾ (Note 13) 3.6 ¾ 450 (Note 14) 3.6 ¾ -450 2.7 to 3.6 ¾ ±10.0 mA H-level VOH VIN = VIH or VIL Output voltage L-level Input leakage current (DIR, OE , CAB, CBA, SAB, SBA) VOL IIN Bushold input minimum drive hold current II (HOLD) Bushold input over-drive current to change state II (OD) VIN = VIH or VIL VIN = 0 to 3.6 V VIN = VIH or VIL V V mA mA mA 3-state output OFF state current IOZ Quiescent supply current ICC VIN = VCC or GND 2.7 to 3.6 ¾ 20.0 mA Increase in ICC per input DICC VIH = VCC - 0.6 V 2.7 to 3.6 ¾ 750 mA VOUT = VCC or GND Note 13: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 14: An external driver must sink at least the specified current to switch from HIGH-to-LOW. 7 2001-10-16 TC74VCXH16646FT < 2.7 V) < VCC = DC Characteristics (Ta = -40 to 85°C, 2.3 V = Characteristics Symbol Test Condition Min Max Unit VCC (V) Input voltage H-level VIH ¾ 2.3 to 2.7 1.6 ¾ L-level VIL ¾ 2.3 to 2.7 ¾ 0.7 2.3 to 2.7 VCC - 0.2 ¾ IOH = -6 mA 2.3 2.0 ¾ IOH = -12 mA 2.3 1.8 ¾ IOH = -18 mA 2.3 1.7 ¾ IOL = 100 mA 2.3 to 2.7 ¾ 0.2 IOL = 12 mA 2.3 ¾ 0.4 IOL = 18 mA 2.3 ¾ 0.6 2.3 to 2.7 ¾ ±5.0 VIN = 0.7 V 2.3 45 ¾ VIN = 1.6 V 2.3 -45 ¾ (Note 13) 2.7 ¾ 300 (Note 14) 2.7 ¾ -300 2.3 to 2.7 ¾ ±10.0 mA 2.3 to 2.7 ¾ 20.0 mA IOH = -100 mA H-level VOH VIN = VIH or VIL Output voltage L-level Input leakage current (DIR, OE , CAB, CBA, SAB, SBA) VOL IIN Bushold input minimum drive hold current II (HOLD) Bushold input over-drive current to change state II (OD) 3-state output OFF state current IOZ Quiescent supply current ICC VIN = VIH or VIL VIN = 0 to 3.6 V VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND V V mA mA mA Note 13: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 14: An external driver must sink at least the specified current to switch from HIGH-to-LOW. 8 2001-10-16 TC74VCXH16646FT < VCC < 2.3 V) DC Characteristics (Ta = -40 to 85°C, 1.8 V = Characteristics Symbol Test Condition Min Max Unit VCC (V) H-level VIH ¾ 1.8 to 2.3 0.7 ´ VCC ¾ L-level VIL ¾ 1.8 to 2.3 ¾ 0.2 ´ VCC VOH IOH = -100 mA 1.8 H-level VCC - 0.2 ¾ IOH = -6 mA 1.8 1.4 ¾ IOL = 100 mA 1.8 ¾ 0.2 IOL = 6 mA 1.8 ¾ 0.3 Input voltage VIN = VIH or VIL Output voltage L-level Input leakage current (DIR, OE , CAB, CBA, SAB, SBA) V V VOL VIN = VIH or VIL IIN VIN = 0 to 3.6 V 1.8 ¾ ±5.0 VIN = 0.36 V 1.8 25 ¾ VIN = 1.26 V 1.8 -25 ¾ (Note 13) 1.8 ¾ 200 (Note 14) 1.8 ¾ -200 1.8 ¾ ±10.0 mA 1.8 ¾ 20.0 mA Bushold input minimum drive hold current II (HOLD) Bushold input over-drive current to change state II (OD) 3-state output OFF state current IOZ Quiescent supply current ICC VIN = VIH or VIL VOUT = VCC or GND VIN = VCC or GND mA mA mA Note 13: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 14: An external driver must sink at least the specified current to switch from HIGH-to-LOW. 9 2001-10-16 TC74VCXH16646FT AC Characteristics (Ta = -40 to 85°C, input: tr = tf = 2.0 ns, CL = 30 pF, RL = 500 W) Characteristics Symbol Test Condition Min Max 1.8 100 ¾ 2.5 ± 0.2 200 ¾ 3.3 ± 0.3 250 ¾ 1.8 1.5 7.0 2.5 ± 0.2 0.8 3.5 3.3 ± 0.3 0.6 2.9 1.8 1.5 8.8 2.5 ± 0.2 0.8 4.4 3.3 ± 0.3 0.6 3.2 1.8 1.5 8.8 2.5 ± 0.2 0.8 4.4 3.3 ± 0.3 0.6 3.5 1.8 1.5 9.8 2.5 ± 0.2 0.8 4.9 3.3 ± 0.3 0.6 3.8 1.8 1.5 7.6 2.5 ± 0.2 0.8 4.2 3.3 ± 0.3 0.6 3.7 Unit VCC (V) Maximum clock frequency Propagation delay time (An, Bn-Bn, An) Propagation delay time (CAB, CBA-Bn, An) Propagation delay time (SAB, SBA-Bn, An) Output enable time ( OE , DIR-An, Bn) Output disable time ( OE , DIR-An, Bn) Minimum pulse width fmax tpLH Figure 1, Figure 3 Figure 1, Figure 2 tpHL tpLH Figure 1, Figure 3 tpHL tpLH Figure 1, Figure 2 tpHL tpZL tpZH tpLZ Figure 1, Figure 4, Figure 5 Figure 1, Figure 4, Figure 5 tpHZ tw (H) 1.8 4.0 ― 2.5 ± 0.2 1.5 ¾ 3.3 ± 0.3 1.5 ¾ 1.8 2.5 ¾ 2.5 ± 0.2 1.5 ¾ 3.3 ± 0.3 1.5 ¾ 1.8 1.0 ¾ 2.5 ± 0.2 1.0 ¾ 3.3 ± 0.3 1.0 ¾ 1.8 ¾ 0.5 (Note 15) 2.5 ± 0.2 ¾ 0.5 3.3 ± 0.3 ¾ 0.5 Figure 1, Figure 3 tw (L) Minimum setup time Minimum hold time Output to output skew ts th Figure 1, Figure 3 Figure 1, Figure 3 tosLH tosHL MHz ns ns ns ns ns ns ns ns ns For CL = 50 pF, add approximately 300 ps to the AC maximum specification. Note 15: Parameter guaranteed by design. (tosLH = |tpLHm - tpLHn|, tosHL = |tpHLm - tpHLn|) 10 2001-10-16 TC74VCXH16646FT Dynamic Switching Characteristics (Ta = 25°C, input: tr = tf = 2.0 ns, CL = 30 pF, RL = 500 W) Characteristics Symbol Test Condition Typ. Unit VCC (V) Quiet output maximum dynamic VOL Quiet output minimum dynamic VOL Quiet output minimum dynamic VOH VOLP VOLV VOHV VIH = 1.8 V, VIL = 0 V (Note 16) 1.8 0.25 VIH = 2.5 V, VIL = 0 V (Note 16) 2.5 0.6 VIH = 3.3 V, VIL = 0 V (Note 16) 3.3 0.8 VIH = 1.8 V, VIL = 0 V (Note 16) 1.8 -0.25 VIH = 2.5 V, VIL = 0 V (Note 16) 2.5 -0.6 VIH = 3.3 V, VIL = 0 V (Note 16) 3.3 -0.8 VIH = 1.8 V, VIL = 0 V (Note 16) 1.8 1.5 VIH = 2.5 V, VIL = 0 V (Note 16) 2.5 1.9 VIH = 3.3 V, VIL = 0 V (Note 16) 3.3 2.2 V V V Note 16: Parameter guaranteed by design. Capacitive Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Typ. Unit 6 pF 1.8, 2.5, 3.3 7 pF (Note 17) 1.8, 2.5, 3.3 20 pF VCC (V) Input capacitance CIN Bus I/O capacitance CI/O Power dissipation capacitance CPD (DIR, OE , CAB, CBA, SAB, SBA) ¾ fIN = 10 MHz 1.8, 2.5, 3.3 Note 17: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC (opr) = CPD･VCC･fIN + ICC/16 (per bit) 11 2001-10-16 TC74VCXH16646FT AC Test Circuit 6.0 V or VCC ´ 2 Open GND RL Switch Switch tpLH, tpHL Open RL Measure CL Output Parameter tpLZ, tpZL CL = 30 pF RL = 500 W 6.0 V VCC ´ 2 tpHZ, tpZH @VCC = 3.3 ± 0.3 V @VCC = 2.5 ± 0.2 V @VCC = 1.8 V GND Figure 1 AC Waveform tr 2.0 ns tf 2.0 ns Input (An, Bn, SAB, SBA) VIH 90% VM 10% GND VOH Output (Bn, An) VM Figure 2 tr 2.0 ns Input (CAB, CBA) VOL tpHL tpLH tpLH, tpHL tf 2.0 ns VIH 90% VM 10% GND tw (H) tw (L) VIH Input (An, Bn) VM ts (H) th (H) ts (L) th (L) GND VOH Output (Bn, An) VM tpHL Figure 3 tpLH VOL tpLH, tpHL, tw, ts, th 12 2001-10-16 TC74VCXH16646FT tr 2.0 ns tf 2.0 ns 2.7 V 90% VM Output Disable ( OE ) 10% tpLZ GND tpZL 3.0 V or VCC Output (An, Bn) Low to Off to Low VM VX tpHZ VOL tpZH VOH VY Output (An, Bn) High to Off to High VM GND Outputs enabled Outputs enabled Outputs disabled Figure 4 tpLZ, tpH, tpZ, tpZH tf 2.0 ns tr 2.0 ns VIN 90% Input (DIR) VM 10% GND 3.0 V or VCC Output (An) VM VX tpZL Output (An) VOL tpLZ VOH VY VM tpZH GND tpHZ tpLZ Output (Bn) 3.0 V or VCC VM VX VOL tpZL VOH VY Output (Bn) VM tpHZ GND tpZH Figure 5 tpLZ, tpH, tpZ, tpZH VCC Symbol 3.3 ± 0.3 V 2.5 ± 0.2 V 1.8 V VIH 2.7 V VCC VCC VM 1.5 V VCC/2 VCC/2 VX VOL + 0.3 V VOL + 0.15 V VOL + 0.15 V VY VOH - 0.3 V VOH - 0.15 V VOH - 0.15 V 13 2001-10-16 TC74VCXH16646FT Package Dimensions Weight: 0.25 g (typ.) 14 2001-10-16 TC74VCXH16646FT RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 15 2001-10-16