DIODES ZXCL330E5TA

ZXCL SERIES
Micropower SC70-5 & SOT23-5 low dropout regulators
ZXCL5213V25, ZXCL5213V26, ZXCL5213V28, ZXCL5213V30, ZXCL5213V33,
ZXCL250, ZXCL260, ZXCL280, ZXCL300, ZXCL330
Description
Features
The ZXCL series have been designed with space
sensitive systems in mind. They are available in
the ultra small SC70-5 package, which is half the
size of SOT23 based regulators.
•
Low 85mV dropout at 50mA load
•
50␮A ground pin current with full 150mA load
•
2.5, 2.6, 2.8, 3, & 3.3 volts output
The devices can be used with all types of output
capacitors including low ESR ceramics and
typical dropout voltage, is only 85mV at 50mA
load. Supply current is minimised with a ground
pin current of only 50␮A at full 150mA load.
Logic control allows the devices to be shut
down, consuming typically less than 10nA.
These features make the device ideal for battery
powered applications where power economy is
critical.
•
Very low noise, without bypass capacitor
•
5-pin SC70 and SOT23 package
•
No-load stable
For
applications
requiring
improved
performance over alternative devices, the
ZXCL is also offered in the 5 pin SOT23
package with an industry standard pinout.
The devices feature thermal overload and
over-current protection and are available with
output voltages of 2.5V, 2.6V, 2.8V, 3V, 3.3V.
Applications
•
Cellular and Cordless phones
•
PDA
•
Hand held instruments
•
Camera, Camcorder, Personal stereo
•
PC cards
•
Portable and battery-powered equipment
No-Load Stability, the ZXCL device will maintain regulation and
is stable with no external load. e.g. CMOS RAM applacations.
Typical application circuit
Package footprint
SOT23-5 (see P7 for SC70-5)
Package suffix - E5
VO
VIN
GND
EN
NC
Top view
Issue 8 - October 2007
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ZXCL SERIES
Ordering information
Order reference
Voltage
(V)
Package
Part
marking
Status
Reel size
(inches)
Tape
width
(mm)
Quantity
per reel
ZXCL250H5TA
2.5
SC70-5
L25A
Active
7
8
3000
ZXCL260H5TA
2.6
SC70-5
L26A
Active
7
8
3000
ZXCL280H5TA
2.8
SC70-5
L28A
Active
7
8
3000
ZXCL300H5TA
3.0
SC70-5
L30A
Active
7
8
3000
ZXCL330H5TA
3.3
SC70-5
L33A
Active
7
8
3000
ZXCL400H5TA
4.0
SC70-5
L40A
Obsolete
7
8
3000
ZXCL5213V25H5TA
2.5
SC70-5
L25C
Active
7
8
3000
ZXCL5213V26H5TA
2.6
SC70-5
L26C
Active
7
8
3000
ZXCL5213V28H5TA
2.8
SC70-5
L28C
Active
7
8
3000
ZXCL5213V30H5TA
3.0
SC70-5
L30C
Active
7
8
3000
ZXCL5213V33H5TA
3.3
SC70-5
L33C
Active
7
8
3000
ZXCL5213V40H5TA
4.0
SC70-5
L40C
Not rec.
for new
designs
7
8
3000
ZXCL250E5TA
2.5
SOT23-5
L25B
Active
7
8
3000
ZXCL260E5TA
2.6
SOT23-5
L26B
Active
7
8
3000
ZXCL280E5TA
2.8
SOT23-5
L28B
Active
7
8
3000
ZXCL300E5TA
3.0
SOT23-5
L30B
Active
7
8
3000
ZXCL330E5TA
3.3
SOT23-5
L33B
Active
7
8
3000
ZXCL400E5TA
4.0
SOT23-5
L40B
Obsolete
7
8
3000
Absolute maximum rating
Terminal Voltage with respect to GND
Output short circuit duration
Infinite
VIN
-0.3V to 7.0V
Continuous power dissipation Internally limited
EN
-0.3V to 10V
Operating temperature range -40°C to +85°C
VO
-0.3V to 5.5V
Storage temperature range
-55°C to +125°C
Package power dissipation (TA=25°C)
SC70-5
300mW (Note 1)
SOT23-5
450mW (Note 1)
Stresses beyond those listed under “Absolute maximum ratings” may cause permanent damage
to the device. These are stress ratings only, and functional operation of the device at these or any
other conditions beyond those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum conditions for extended periods may affect device
reliability.
Issue 8 - October 2007
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ZXCL SERIES
Recommended operating conditions
Symbol
Parameter
Min
Max
Units
VIN
Input voltage range
2.0*
5.5
V
VENH
Enable pin logic level High pin
2.2
10
V
VENL
Enable pin logic level Low pin
0
0.8
V
TA
Ambient temperature range
-40
85
°C
* Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation,
VIN(min) > VOUT(nom) + 0.5V.
Pin description
Symbol
Parameter
VIN
Supply voltage
GND
Ground
EN
Active HIGH enable input. TTL/CMOS logic compatible. Connect to VIN
or logic high for normal operation
N/C
No connection
VO
Regulator output
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ZXCL SERIES
Electrical characteristics
VIN = VO = 0.5V, all values at TA = 25°C (Unless otherwise stated)
Symbol Parameter
Conditions
VO
IO=1mA
IO=100mA
VO+0.5V < VIN < VIN max
⌬VO/⌬T
Output voltage
IO(Max)
Output voltage
temperature
coefficient
Output current
IOLIM
Over current limit
IO
Ground pin
current
VDO
Dropout voltage
note 3
VENHS
IEN
IOSD
TSD
-3%
+3%
-15
XCL250/5213V25 only
⌬VLNR
⌬VLDR
EN
Limits
Min. Typ. Max.
-2%
+2%
XCL250/5213V25 only
No Load
IO=150mA
IO=100mA
IO=10mA
All variants
IO=50mA
IO=100mA ZXCL250 / 5213V25
IO=100mA ZXCL260 / 5213V26
IO=100mA ZXCL280 / 5213V28
IO=100mA ZXCL300 / 5213V30
IO=100mA ZXCL330 / 5213V33
IO=100mA ZXCL400 / 5213V40
VIN=(VO+0.5V) to 5.5V, IO=1mA
IO=1mA to 100mA
f=10Hz to 100kHz, CO=10␮F
Line regulation
Load regulation
Output noise
voltage
Enable pin
hysteresis
Enable pin input
VEN=5.5V
current
Shutdown supply VEN=0V
current
Thermal shutdown
temperature
150
100
160
105
V
V
ppm/°C
mA
230
25
50
40
15
85
163
155
140
140
140
140
0.02
0.01
50
800
750
50
120
100
325
310
280
280
280
280
0.1
0.04
150
125
Units
mA
␮A
␮A
␮A
mV
mV
mV
mV
mV
mV
mV
mV
%/V
%/mA
␮VRMS
mV
100
nV
1
␮A
165
°C
Device testing is performed at TA=25°C. Device thermal performance is guaranteed by design.
Note1: Maximum power dissipation is calculated assuming the device is mounted on a PCB measuring 2 inches square
Note2:Output voltage will start to rise when VIN exceeds a value or approximately 1.3V. For normal operation,
VIN(min) > VOUT(nom) + 0.5V.
Note3:Dropout voltage is defined as the difference between VIN and VO, when VO has dropped 100mV below its nominal
value. Nominal value of VO is defined at VIN=VO+0.5V.
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ZXCL SERIES
Typical characteristics (ZXCL280 / 5213 shown)
0.25
Dropout Voltage (V)
6
Voltage (V)
5
4
VIN
3
2
IOUT = 100mA
1
0.20
0.15
0.10
0.05
IOUT = 1mA
0
0.00
0
1
2
3
4
5
6
0
50
75
100
125
150
175
Output Current (mA)
Input to Output Characteristics
Dropout Voltage v Output Current
25.0
2.81
VIN = 3.3V
No Load
Ground Current (µA)
Output Voltage (V)
25
Input Voltage (V)
2.80
VIN = 3.3V
No Load
24.8
24.6
24.4
24.2
24.0
23.8
23.6
23.4
23.2
2.79
-50
-25
0
25
50
75
23.0
-50
100
0
25
50
75
Temperature (˚C)
Output Voltage v Temperature
Ground Current v Temperature
100
60
30
No Load
Ground Current (µA)
Ground Current (µA)
-25
Temperature (˚C)
25
20
15
10
5
0
55
50
VIN = 5V
45
VIN = 3.3V
40
35
30
25
20
0
1
2
3
4
5
0
25
50
75
100
125
Input Voltage (V)
Load Current (mA)
Ground Current v Input Voltage
Ground Current v Load Current
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ZXCL SERIES
Typical characteristics
400
100
6
COUT = 1μF
3
VIN = 3.3V
IL = 1mA
IL = 100mA
2
1
0
10
20
30
40
50
60
70
Time (μs)
VIN = 5V
IL = 1mA to 50mA
350
50
300
0
100
ΔVOUT (mV)
Voltage (V)
VIN = 5V
IL = 1mA
IL = 100mA
4
0
IL(mA)
Enable
5
80
COUT = 1μF
50
COUT = 10μF
0
COUT = 10μF
-50
-100
0.0
90 100
COUT = 1μF
0.1
6
COUT = 1μF
Tr & Tf = 2.5μs
5
4
0.5
COUT = 1μF
Tr & Tf = 2.5μs
5
4
ΔVOUT (mV)
3
0.1
0.2
0.3
0.4
0.5
1
20
0
10
-1
0
-2
-10
-3
-20
-4
0.0
0.1
0.2
0.3
0.4
Time (ms)
Time (ms)
Line Rejection IL = 1mA
Line Rejection IL = 100mA
10
80
70
All Caps Ceramic
Surface Mount
60
IL = 50mA
Noise μV/√Hz
ΔVOUT (mV)
3
Power Supply Rejection (dB)
0.4
Load Response
VIN (V)
VIN(V)
6
50
40
COUT = 10μF
30
COUT = 2.2μF
20
COUT = 1μF
10
0
10
0.3
Time (ms)
Start-Up Response
1
20
0
10
-1
0
-2
-10
-3
-20
-4
0.0
0.2
100
1k
10k
IL = 100mA, COUT = 1μF
IL = 100mA, COUT = 10μF
1
0.1
No Load, COUT = 1μF
No Load, COUT = 10μF
100k
0.01
10
1M
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Power Supply Rejection v Frequency
Output Noise v Frequency
Issue 8 - October 2007
© Zetex Semiconductors plc 2007
0.5
6
1M
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ZXCL SERIES
Connection diagrams
SC70-5 (H5)
VIN
SC70-5 (H5)
VO
EN
VIN
N/C*
GND
NC
EN
Top view
ZXCLxxx
VO
GND
Top view
* Should be left open circuit
or connected to pin 3
ZXCL5213Vxx
Schematic diagram
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ZXCL SERIES
Input to Output Diode
Increased Output current
In common with many other LDO regulators, the
ZXCL device has an inherent diode associated
with the output series pass transistor. This diode
has its anode connected to the output and its
cathode to the input. The internal diode is
normally reverse biased, but will conduct if the
output is forced above the input by more than a
VBE (approximately 0.6V). Current will then flow
from Vout to Vin. For safe operation, the
maximum current in this diode should be
limited to 5mA continuous and 30mA peak. An
external schottky diode may be used to provide
protection when this condition cannot be
satisfied.
Any ZXCL series device may be used in
conjunction with an external PNP transistor to
boost the output current capability. In the
application circuit shown below, a FMMT717
device is employed as the external pass
element. This SOT23 device can supply up to
2.5A maximum current subject to the thermal
dissipation limits of the package (625mW).
Alternative devices may be used to supply
higher levels of current. Note that with this
arrangement, the dropout voltage will be
increased by the VBE drop of the external device.
Also, care should be taken to protect the pass
transistor in the event of excessive output
current.
Scheme to boost output current to 2A
Issue 8 - October 2007
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ZXCL SERIES
Applications information
Enable control
A TTL compatible input is provided to allow the
regulator to be shut down. A low voltage on the
Enable pin puts the device into shutdown mode.
In this mode the regulator circuit is switched off
and the quiescent current reduces to virtually
zero (typically less than 10nA) for input voltages
above the minimum operating threshold of the
device. A high voltage on the Enable pin ensures
normal operation.
The Enable pin can be connected to VIN or
driven from an independent source of up to 10V
maximum. (e.g. CMOS logic) for normal
operation. There is no clamp diode from the
Enable pin to VIN, so the VIN pin may be at any
voltage within its operating range irrespective
of the voltage on the Enable pin. However input
voltage rise time should be kept below 5ms to
ensure consistent start-up response.
R
C
Figure 1 Circuit Connection
Current Limit
The ZXCL devices include a current limit circuit
which restricts the maximum output current
flow to typically 230mA. Practically the range of
over-current should be considered as minimum
160mA to maximum 800mA. The device’s
robust design means that an output short circuit
to any voltage between ground and VOUT can be
tolerated for an indefinite period.
Td
Figure 2 Start up delay (Td)
Thermal Overload
Thermal overload protection is included on
chip. When the device junction temperature
exceeds a minimum 125°C the device will shut
down. The sense circuit will re-activate the
output as the device cools. It will then cycle until
the overload is removed. The thermal overload
protection will be activated when high load
currents or high input to output voltage
differentials cause excess dissipation in the
device.
⎛ VIN ⎞
Td(NOM) = RCIn⎜
⎟
⎝ VIN − 1.5 ⎠
Calculation of start up delay as above
Start up delay
A small amount of hysteresis is provided on the
Enable pin to ensure clean switching. This
feature can be used to introduce a start up delay
if required. Addition of a simple RC network on
the Enable pin provides this function. The
following diagram illustrates this circuit
connection. The equation provided enables
calculation of the delay period.
Issue 8 - October 2007
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ZXCL SERIES
Applications information (Cont)
Power dissipation
The maximum allowable power dissipation of
the device for normal operation (Pmax), is a
function of the package junction to ambient
thermal resistance (θja), maximum junction
temperature (Tjmax), and ambient temperature
(Tamb), according to the expression:
Pmax = (Tjmax – Tamb) / θja
The dielectric of the ceramic capacitance is an
important consideration for the ZXCL Series
operation over temperature. Zetex recommends
minimum dielectric specification of X7R for the
input and output capacitors. For example a
ceramic capacitor with X7R dielectric will lose 20%
of its capacitance over a -40⬚C to 85⬚C temperature
range, whereas a capacitor with a Y5V dielectric
loses 80% of its capacitance at -40⬚C and 75% at
85⬚C.
The maximum output current (Imax) at a given
value of Input voltage (VIN) and output voltage
(VOUT) is then given by
An input capacitor of 1␮F (ceramic or tantalum) is
recommended to filter supply noise at the device
input and will improve ripple rejection.
Imax = Pmax / (VIN - VOUT)
The input and output capacitors should be
positioned close to the device, and a ground plane
board layout should be used to minimise the
effects of parasitic track resistance.
Max Power Dissipation (mW)
The value of qja is strongly dependent upon the
type of PC board used. Using the SC70 package
it will range from approximately 280°C/W for a
multi-layer board to around 450°C/W for a single
sided board. It will range from 180°C/W to
300°C/W for the SOT23-5 package. To avoid
entering the thermal shutdo wn state, Tjmax
should be assumed to be 125°C and Imax less
than the over-current limit,(IOLIM). Power
derating for the SC70 and SOT23-5 packages is
shown in the following graph.
500
Dropout voltage
The output pass transistor is a large PMOS device,
which acts like a resistor when the regulator enters
the dropout region. The dropout voltage is
therefore proportional to output current as shown
in the typical characteristics.
Ground current
The use of a PMOS device ensures a low value of
ground current under all conditions including
dropout, start-up and maximum load.
400
SOT23
Power supply rejection and load transient
response
300
200
SC70
Line and Load transient response graphs are
shown in the typical characteristics.
100
0
-40
-20
0
20
40
60
80
100
Temperature (°C)
Derating Curve
Capacitor selection and regulator stability
The device is designed to operate with all types
of output capacitor, including tantalum and low
ESR ceramic. For stability over the full operating
range from no load to maximum load, an output
capacitor with a minimum value of 1μF is
recommended, although this can be increased
without limit to improve load transient
performance. Higher values of output capacitor
will also reduce output noise. Capacitors with
ESR less than 0.5V are recommended for best
results.
Issue 8 - October 2007
© Zetex Semiconductors plc 2007
These show both the DC and dynamic shift in the
output voltage with step changes of input voltage
and load current, and how this is affected by the
output capacitor.
If improved transient response is required, then an
output capacitor with lower ESR value should be
used. Larger capacitors will reduce over/
undershoot, but will increase the settling time.
Best results are obtained using a ground plane
layout to minimise board parasitics.
10
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ZXCL SERIES
S70-5 Package outline
␣
Dim.
Millimeters
Inches
Dim.
Millimeters
Min.
Max.
Min.
Max.
A
0.80
1.10
0.0315
0.0433
E
2.10 BSC
0.0826 BSC
A1
-
0.10
-
0.0039
E1
1.25 BSC
0.0492 BSC
A2
0.80
1.00
0.0315
0.0039
e
0.65 BSC
0.0255 BSC
b
0.15
0.30
0.006
0.0118
e1
1.30 BSC
0.0511 BSC
C
0.08
0.25
0.0031
0.0098
L
0.26
0.46
0.010
0.018
␣
0°
8°
0°
8°
D
2.00 BSC
Min.
0.0787 BSC
Max.
Inches
Max.
Max.
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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ZXCL SERIES
SOT23-5 Package outline
DIM
A
A1
A2
b
C
D
E
E1
e
e1
L
a°
Millimeters
Min.
0.90
0.00
0.90
0.20
0.09
2.70
2.20
1.30
Inches
Max.
1.45
0.15
1.30
0.50
0.26
3.10
3.20
1.80
Min.
0.0354
0.00
0.0354
0.0078
0.0035
0.1062
0.0866
0.0511
0.95 REF
1.90 REF
0.10
0°
Max.
0.0570
0.0059
0.0511
0.0196
0.0102
0.1220
0.1181
0.0708
0.0374 REF
0.0748 REF
0.60
30°
0.0039
0°
0.0236
30°
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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ZXCL SERIES
Intentionally left blank
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ZXCL SERIES
Definitions
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service. Customers are solely responsible for obtaining the latest relevant information before placing orders.
Applications disclaimer
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,
opportunity or consequential loss in the use of these circuit applications, under any circumstances.
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Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labelling can be reasonably expected to result in significant injury to the user.
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To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our
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Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.
Devices suspected of being affected should be replaced.
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All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with
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Product status key:
“Preview”
Future device intended for production at some point. Samples may be available
“Active”
Product status recommended for new designs
“Last time buy (LTB)”
Device will be discontinued and last time buy period and delivery is in effect
“Not recommended for new designs” Device is still in production to support existing designs and production
“Obsolete”
Production has been discontinued
Datasheet status key:
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This term denotes a very early datasheet version and contains highly provisional information, which
may change in any manner without notice.
“Provisional version”
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.
However, changes to the test conditions and specifications may occur, at any time and without notice.
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Asia Pacific
Corporate Headquarters
Zetex GmbH
Kustermann-park
Balanstraße 59
D-81541 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
Zetex (Asia Ltd)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
© 2007 Published by Zetex Semiconductors plc
Issue 8 - October 2007
© Zetex Semiconductors plc 2007
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www.zetex.com