TOREX XC8102AA01NR-G

XC8102 Series
ETR2502-006a
Load Switch with Low On-Resistance
■GENERAL DESCRIPTION
The XC8102 series is a low ON resistance load switch IC with ON/OFF control and output current protection which integrates
a P-channel MOSFET.
By connecting the XC8102 to the output pin of a step-down DC/DC converter, the CE pin controls ON/OFF for each
distribution switch to deliver power per requirements and maximize total power efficiency. As a result, the XC8102 helps to
extend battery life and product operation time.
The series contains a current limit and protection circuit so these are not required externally unlike discrete circuit solutions
where MOSFETs and resistors are used.
When a low signal is input to the CE pin, the series enters stand-by mode. Even where a load capacitor is connected to the
output pin during stand-by, the electric charge stored at the load capacitor is discharged through the internal switch. As a
result, the VOUT pin voltage falls quickly to the VSS level.
The series contains over current protection with fold-back current circuitry which operates as over current protection and
short circuit protection for the output pin.
■FEATURES
■APPLICATIONS
On Resistance
: 0.28Ω@ VIN=6.0V (TYP.)
: 0.31Ω@ VIN=4.0V (TYP.)
: 0.35Ω@ VIN=2.9V (TYP.)
: 0.52Ω@ VIN=1.8V (TYP.)
: 0.60Ω@ VIN=1.5V (TYP.)
: 0.80Ω@ VIN=1.2V (TYP.)
: 1.2V∼6.0V
: 3.0μA@ VIN=1.2V
: 3.6μA@ VIN=2.9V
: 4.0μA@ VIN=6.0V
: 0.1μA
:Current limit(Output Current)
480mA (TYP.) (1.8≦VIN≦6.0V)
: Short-circuit Protection,
Short current= 30mA (TYP.)
: High Active Enable
● Mobile phones, Smart phones
● Digital still cameras, Digital video cameras
● Portable game consoles
Input Voltage Range
Power Consumption
● Portable equipment
Stand-by Current
Protection Circuit
ON/OFF Function
High-Speed Discharge Function
Operating Temperature Range : -40℃∼+85℃
Packages
: USP-4,SSOT-24, SOT-25
USPN-4
Environmentally Friendly
: EU RoHS Compliant, Pb Free
■TYPICAL APPLICATION CIRCUIT
VOUT
DC/DC OUT
2.1V
VIN
Step Down
Li-ion
3.6V
DC/DC
CE
CIN
ON/OFF
Control
●On Resistance vs. Input Voltage
IN
VOUT
CPU
XC8102
XC8102AA01M/XC8102AA01G
VSS
VIN=CE
IOUT=50mA
CIN=None,CL=None
CL
XC9235
1.0
VIN
IN
VOUT
CPU
XC8102
CE
CIN
ON/OFF
Control
VSS
CL
VIN
IN
VOUT
XC8102
CE
CIN
ON/OFF
Control
CPU
VSS
ON Resistance : RON (Ω
VIN
■ TYPICAL PERFORMANCE
CHARACTERISTICS
0.8
Ta=85℃
25℃
-40℃
0.6
0.4
0.2
0.0
CL
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input Voltage : VIN (V)
1/19
XC8102 Series
■PIN CONFIGURATION
*The heat dissipation pad of the USP-4 package is recommended to solder as shown in the
recommended mount pattern and metal mask pattern for mounting strength. The heat
dissipation pad should be electrically opened or connected to the VSS (No. 2) pin.
■PIN ASSIGNMENT
PIN NUMBER
USP-4
SOT-25
SSOT-24
USPN-4
4
1
2
3
−
1
5
2
3
4
4
3
2
1
−
4
1
2
3
-
PIN NAME
FUNCTIONS
VIN
VOUT
VSS
CE
NC
Power Input
Output
Ground
ON/OFF Control
No Connection
■PRODUCT CLASSIFICATION
●Ordering Information
XC8102①②③④⑤⑥-⑦(*1)
DESIGNATOR
DESCRIPTION
SYMBOL
①
CE pin logic
A
CE High active
②
CL Discharge Function
A
Output capacitor (CL) auto-discharge function
integrated
③④
Internal Standard Number
01
Fixed
GR-G
USP-4
MR-G
SOT-25
NR-G
SSOT-24
7R-G
USPN-4
⑤⑥-⑦
(*1)
(*2)
2/19
Packages
Taping Type (*2)
DESCRIPTION
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or
representative. (Standard orientation: ⑤R-⑦, Reverse orientation: ⑤L-⑦)
XC8102
Series
■FUNCTION CHART
SERIES
CE
IC OPERATIONAL STATUS
ON/OFF
XC8102AA01
High
Low
ON
OFF
■BLOCK DIAGRAM
●XC8102AA Series
VIN
VOUT
GATE
CONTROL
Current
Limit
Rdischg
CE
ON/OFF
Control
each
circuit
CE/
VSS
XC8102AAシリーズ
* Diodes inside the circuit
are an ESD protection diode and a parasitic diode.
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
Input Voltage
Output Current
Output Voltage
CE Input Voltage
USP-4
SSOT-24
Power Dissipation
SOT-25
USPN-4
Operating Temperature Range
Storage Temperature Range
SYMBOL
VIN
IOUT
VOUT
VCE
Pd
Topr
Tstg
RATINGS
VSS-0.3∼+6.5
850*
VSS-0.3∼VIN
VSS-0.3∼+6.5
120
150
250
100
-40∼+85
-55∼+125
UNITS
V
mA
V
V
mW
o
o
C
C
* Please make sure that IOUT is less than Pd/ (VIN-VOUT)
3/19
XC8102 Series
■ELECTRICAL CHARACTERISTICS
●XC8102AA Series
Ta=25℃
PARAMETER
SYMBOL
Input Voltage
VIN
On Resistance
(SSOT-24/USPN-4)
On Resistance
(SOT-25/USP-4)
Supply Current
RON
RON
IDD
CONDITIONS
MIN.
TYP.
MAX.
UNITS
CIRCUITS
V
-
Ω
①
Ω
①
μA
②
1.2
-
6.0
VIN =6.0V, VCE=VIN
-
0.28
0.425
VIN =4.0V, VCE=VIN
-
0.31
0.475
VIN =2.9V, VCE=VIN
-
0.35
0.475
VIN =1.8V, VCE=VIN
-
0.52
0.625
0.80
VIN =1.5V, VCE=VIN
-
0.60
VIN =1.2V, VCE=VIN
-
0.80
1.60
VIN =6.0V, VCE=VIN
-
0.35
0.475
VIN =4.0V, VCE=VIN
-
0.38
0.525
VIN =2.9V, VCE=VIN
-
0.43
0.525
VIN =1.8V, VCE=VIN
-
0.59
0.675
VIN =1.5V, VCE=VIN
-
0.67
0.85
VIN =1.2V, VCE=VIN
-
0.87
1.65
VIN =6.0V, VCE=VIN, VOUT=OPEN
-
4.0
7.0
VIN =4.0V, VCE=VIN, VOUT=OPEN
-
3.8
6.5
VIN =2.9V, VCE=VIN, VOUT=OPEN
-
3.6
6.3
VIN =1.8V, VCE=VIN, VOUT=OPEN
-
3.4
5.7
VIN =1.5V, VCE=VIN, VOUT=OPEN
-
3.2
5.5
VIN =1.2V, VCE=VIN, VOUT=OPEN
-
3.0
4.9
Stand-by Current
ISTBY
VIN =6.0V, VCE=VSS, VOUT=OPEN
-
0.01
0.10
μA
②
Switch Leakage Current
ILEAK
VIN =6.0V, VCE=VSS, VOUT=0V
-
0.01
0.10
μA
②
400
480
-
1.8V≦VIN<2.9V, VOUT = VIN -0.6V
400
480
-
1.5V≦VIN<1.8V, VOUT =1.2V
200
-
-
mA
①
1.2V≦VIN<1.5V, VOUT =1.0V
90
-
-
-
30
75
mA
①
1.1
-
6.0
V
③
VIN≧2.9V, VOUT = VIN -0.8V
Current Limit
ILIM
Short Circuit Current
ISHORT
CE High Level Voltage
VCEH
VCE=VIN, VOUT=0V
CE Low Level Voltage
VCEL
-
-
0.3
V
③
CE High Level Current
ICEH
VCE=VIN
-0.1
-
0.1
μA
③
CE Low Level Current
ICEL
VCE=VSS
-0.1
-
0.1
μA
③
RDCHG
VIN=4.0V, VOUT=4.0V, VCE=VSS
380
480
570
Ω
④
CL Auto-Discharge
Resistance
Turn On Time
(*1)
tDLY(ON)
VIN =4.0V, VCE=0.3V→1.2V, RL=80Ω, without CIN, CL
-
8.5
18
μs
⑤
Turn Off Time
(*2)
tDLY(OFF)
VIN =4.0V, VCE=1.2V→0.3V, RL=80Ω, without CIN, CL
-
3.0
7.5
μs
⑤
NOTE:
*1: Time to reach 90% of VOUT after VCE entering the VCEH threshold.
*2: Time to fall to 10% of VOUT after VCE entering the VCEL threshold.
4/19
XC8102
Series
■TEST CIRCUITS
Circuit ①
VIN
VOUT
A
IOUT
V
Ishort
V
CE
VSS
Circuit ②
Circuit ③
5/19
XC8102 Series
■TEST CIRCUITS (Continued)
Circuit ④
Circuit ⑤
The measurement point of wave form
The measurement point of wave form
RL
6/19
XC8102
Series
■OPERATIONAL EXPLANATION
<CE Pin>
The XC8102 enables an output P-channel MOSFET switch and the IC internal circuitry to turn off by the signal to the CE pin. In
the shutdown mode, the VOUT pin will be pulled down to the VSS by the CL auto-discharge function.
The output voltage becomes unstable when the CE pin is opened. If the input voltage to the CE pin is within the specified
threshold voltages, the logic is fixed and the XC8102 will operate normally. However, supply current may increase as a result
of the shoot-through current of internal circuitry when the medium level voltage is input to the CE pin.
<Input/Output Capacitor>
The XC8102 works well without an input and output capacitors. Also, an output capacitor of the power source can be used as
an input capacitor of the XC8102 and a bypass capacitor of the driving IC can be used as an output capacitor of the XC8102.
<CL Auto-Discharge Function>
The XC8102AA contains a CL auto-discharge resistor and an N-channel transistor between the VOUT pin and the VSS pin. The
device quickly discharge the electric charge in the output capacitor (CL) when a low signal to the CE pin is input to turn off a
whole IC circuit. The CL auto-discharge resistance is set at 480Ω (VOUT=4.0V TYP. @ VIN=4.0). Discharge time of the
output capacitor (CL) is determined by a CL auto-discharge resistor value (Rdischg) and an output capacitor value. Time
constant τ is defined as (τ = C x Rdischg). Output voltage after starting discharge can be calculated by the following
formula.
V = VOUT x e –t/τ,
or
t=τIn (VOUT / V)
V: Output voltage after starting discharge,
VOUT: Output voltage,
t : Discharge time,
τ: Output discharge resistor value Rdischg×Output capacitor (CL) value C
<Current Limiter, Short-Circuit Protection>
The XC8102 series contains a constant current limiter and fold-back current circuitry. The constant current limiter operates to
limit output current and the fold-back current circuitry operates as short circuit protection for the output pin.
When the load current reaches the limit current, the constant current limiter operates and the output voltage drops. The output
voltage further, then the fold-back current circuitry operates to decrease the output current. When the output pin is
short-circuited to the ground, the output current drops and maintains a flow about 30mA.
■NOTES ON USE
1.
2.
3.
4.
Please use this IC within the stated absolute maximum ratings. Operation beyond these limits may cause degrading or
permanent damage to the device.
The X8102 goes into an undefined operation when the CE pin is left open. The CE pin shall be tied to low or high level.
VOUT pin voltage should not be applied beyond the VIN pin voltage.
The IC may get damage due to the reverse current toward the VIN pin.
Current limit function is integrated. However, power dissipation may be beyond the limit before starting a fold-back current
protection when used in high temperature. For the power dissipation of each package, please refer to the graphs of Package
Power vs. Operating Temperature in page 15 to 18.
7/19
XC8102 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) ON Resistance vs. Input Voltage
XC8102AA01N/XC8102AA017
XC8102AA01M/XC8102AA01G
VIN=CE
IOUT=50mA
CIN=None,CL=None
VIN=CE
IOUT=50mA
CIN=None,CL=None
1.0
0.8
ON Resistance : RON (Ω
ON Resistance : RON (Ω
1.0
Ta=85℃
25℃
-40℃
0.6
0.4
0.2
0.0
0.8
Ta=85℃
25℃
-40℃
0.6
0.4
0.2
0.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.0
1.5
2.0
2.5
3.0
Input Voltage : VIN (V)
3.5
4.0
4.5
5.0
5.5
6.0
Input Voltage : VIN (V)
(2) ON Resistance vs. Ambient Temperature
XC8102AA01M/XC8102AA01G
XC8102AA01N/XC8102AA017
VIN=CE
IOUT=50mA
CIN=None,CL=None
VIN=CE
IOUT=50mA
CIN=None,CL=None
1.0
1.0
VIN=1.2V
ON Resistance : RON (Ω
ON Resistance : RON (Ω
VIN=1.2V
0.8
1.5V
0.6
1.8V
0.4
4.0V
0.2
2.9V
6.0V
0.0
0.8
0.6
1.5V
1.8V
0.4
0.2
6.0V
-50
-25
0
25
50
75
100
-50
-25
Ambient Temp : Ta ( ℃)
0
25
50
100
(4) Supply Current vs. Ambient Temperature
XC8102AA01
XC8102AA01
VIN=CE
CIN=None,CL=None
VIN=CE
CIN=None,CL=None
5.0
5.0
Supply Current : IDD (uA)
Supply Current : IDD (uA)
75
Ambient Temp : Ta (℃)
(3) Supply Current vs. Input Voltage
4.0
3.0
Ta=85℃
25℃
-40℃
2.0
1.0
0.0
4.0
3.0
VIN=1.2V
1.5V
1.8V
2.9V
4.0V
6.0V
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Input Voltage : VIN (V)
8/19
2.9V
4.0V
0.0
4.5
5.0
5.5
6.0
-50
-25
0
25
50
Ambient Temp : Ta ( ℃)
75
100
XC8102
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) Output Voltage vs. Output Current
XC8102AA01M/XC8102AA01G
XC8102AA01M/XC8102AA01G
VIN=CE=1.2V
CIN=None,CL=None
VIN=CE=1.5V
CIN=None,CL=None
5.0
Ta=85℃
25℃
-40℃
4.0
Output Voltage : VOUT (V)
Output Voltage : VOUT (V)
5.0
3.0
2.0
1.0
0.0
Ta=85℃
25℃
-40℃
4.0
3.0
2.0
1.0
0.0
0
100
200
300
400
500
600
0
100
Output Current : IOUT (mA)
200
300
400
XC8102AA01M/XC8102AA01G
VIN=CE=2.9V
CIN=None,CL=None
5.0
5.0
Ta=85℃
25℃
-40℃
4.0
Output Voltage : VOUT (V)
Output Voltage : VOUT (V)
600
XC8102AA01M/XC8102AA01G
VIN=CE=1.8V
CIN=None,CL=None
3.0
2.0
1.0
0.0
Ta=85℃
25℃
-40℃
4.0
3.0
2.0
1.0
0.0
0
100
200
300
400
500
600
0
100
Output Current : IOUT (mA)
200
300
400
500
600
Output Current : IOUT (mA)
XC8102AA01M/XC8102AA01G
XC8102AA01M/XC8102AA01G
VIN=CE=4.0V
CIN=None,CL=None
VIN=CE=6.0V
CIN=None,CL=None
10.0
10.0
Ta=85℃
25℃
-40℃
8.0
Output Voltage : VOUT (V)
Output Voltage : VOUT (V)
500
Output Current : IOUT (mA)
6.0
4.0
2.0
0.0
Ta=85℃
25℃
-40℃
8.0
6.0
4.0
2.0
0.0
0
100
200
300
400
Output Current : IOUT (mA)
500
600
0
100
200
300
400
500
600
Output Current : IOUT (mA)
9/19
XC8102 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) Output Voltage vs. Output Current
XC8102AA01N/XC8102AA017
XC8102AA01N/XC8102AA017
VIN=CE=1.2V
CIN=None,CL=None
VIN=CE=1.5V
CIN=None,CL=None
5.0
Ta=85℃
25℃
-40℃
4.0
Output Voltage : VOUT (V)
Output Voltage : VOUT (V)
5.0
3.0
2.0
1.0
0.0
Ta=85℃
25℃
-40℃
4.0
3.0
2.0
1.0
0.0
0
100
200
300
400
500
0
600
100
200
300
400
XC8102AA01N/XC8102AA017
VIN=CE=2.9V
CIN=None,CL=None
5.0
Ta=85℃
25℃
-40℃
4.0
Output Voltage : VOUT (V)
Output Voltage : VOUT (V)
5.0
3.0
2.0
1.0
0.0
Ta=85℃
25℃
-40℃
4.0
3.0
2.0
1.0
0.0
0
100
200
300
400
500
600
0
100
Output Current : IOUT (mA)
200
300
400
500
600
Output Current : IOUT (mA)
XC8102AA01N/XC8102AA017
XC8102AA01N/XC8102AA017
VIN=CE=4.0V
CIN=None,CL=None
VIN=CE=6.0V
CIN=None,CL=None
10.0
10.0
Ta=85℃
25℃
-40℃
8.0
Output Voltage : VOUT (V)
Output Voltage : VOUT (V)
600
XC8102AA01N/XC8102AA017
VIN=CE=1.8V
CIN=None,CL=None
6.0
4.0
2.0
0.0
Ta=85℃
25℃
-40℃
8.0
6.0
4.0
2.0
0.0
0
100
200
300
400
Output Current : IOUT (mA)
10/19
500
Output Current : IOUT (mA)
Output Current : IOUT (mA)
500
600
0
100
200
300
400
Output Current : IOUT (mA)
500
600
XC8102
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) CE Threshold Voltage vs. Ambient Temperature (7) CL Discharge Resistance vs. Ambient Temperature
XC8102AA01
XC8102AA01
VIN=VOUT
CE=VSS
CIN=None,CL=None
VIN=6.0V
CIN=None,CL=None
Discharge Resistance : Rdischg (Ω)
CE High Level Voltage : VCEH (V)
1.0
0.9
VCEH
0.8
0.7
0.6
VCEL
0.5
0.4
-50
-25
0
25
50
75
100
3000
VIN=1.2V
2500
2000
VIN=1.8V
VIN=2.9V
VIN=1.5V
1500
1000
500
VIN=4.0V
VIN=6.0V
0
-50
Ambient Temp : Ta (℃)
-25
0
25
50
75
100
Ambient Temp : Ta (℃)
(8) Output Turn-on Time with CE
CE Input Voltage
0.0
-0.5
5.0
1.0
4.0
3.0
Output Voltage
2.0
-1.0
1.0
-1.5
0.0
-2.0
-1.0
0.5
-0.5
2.0
1.0
-1.5
0.0
-2.0
1.5
5.0
1.0
4.0
0.0
3.0
-0.5
2.0
-1.0
1.0
Output Voltage
0.0
-1.0
CE Input Voltage: VCE (V)
6.0
Output Voltage :VOUT (V)
CE Input Voltage: VCE (V)
CE Input Voltage
Time: 10μs/div
Output Voltage
-1.0
XC8102AA01
VIN=1.8V
CE=0.3V →1.2V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
-2.0
3.0
Time: 10μs/div
1.0
-1.5
4.0
-1.0
XC8102AA01
0.5
6.0
5.0
CE Input Voltage
0.0
Time: 10μs/div
1.5
VIN=1.5V
CE=0.3V →1.2V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
0.5
VIN=2.9V
CE=0.3V →1.2V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
6.0
5.0
CE Input Voltage
4.0
0.0
3.0
-0.5
2.0
-1.0
-1.5
1.0
Output Voltage
-2.0
0.0
Output Voltage :VOUT (V)
0.5
1.5
CE Input Voltage: VCE (V)
1.0
6.0
Output Voltage :VOUT (V)
1.5
CE Input Voltage: VCE (V)
XC8102AA01
VIN=1.2V
CE=0.3V →1.2V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
Output Voltage :VOUT (V)
XC8102AA01
-1.0
Time: 10μs/div
11/19
XC8102 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Output Turn-on Time with CE (Continued)
0.5
CE Input Voltage
1.5
10.0
1.0
8.0
0.0
6.0
-0.5
4.0
-1.0
2.0
-1.5
Output Voltage
-2.0
0.0
CE Input Voltage: VCE (V)
1.0
12.0
Output Voltage :VOUT (V)
1.5
CE Input Voltage: VCE (V)
XC8102AA01
VIN=4.0V
CE=0.3V →1.2V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
0.5
VIN=6.0V
CE=0.3V →1.2V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
10.0
CE Input Voltage
0.0
4.0
Output Voltage
-1.5
2.0
0.0
-2.0
-2.0
Time: 10μs/div
8.0
6.0
-0.5
-1.0
12.0
Output Voltage :VOUT (V)
XC8102AA01
-2.0
Time: 10μs/div
(9) Output Turn-off Time with CE
CE Input Voltage
0.0
-0.5
5.0
1.0
4.0
3.0
Output Voltage
2.0
-1.0
1.0
-1.5
0.0
-2.0
-1.0
0.5
-0.5
-1.5
0.0
6.0
1.5
5.0
1.0
4.0
3.0
Output Voltage
2.0
-1.0
1.0
-1.5
0.0
-1.0
CE Input Voltage: VCE (V)
0.0
12/19
2.0
1.0
-2.0
Output Voltage :VOUT (V)
CE Input Voltage: VCE (V)
CE Input Voltage
Time: 10μs/div
Output Voltage
-1.0
XC8102AA01
VIN=1.8V
CE=1.2V →0.3V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
-2.0
3.0
Time: 10μs/div
1.0
-0.5
4.0
-1.0
XC8102AA01
0.5
6.0
5.0
CE Input Voltage
0.0
Time: 10μs/div
1.5
VIN=1.5V
CE=1.2V →0.3V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
VIN=2.9V
CE=1.2V →0.3V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
CE Input Voltage
6.0
5.0
0.5
4.0
0.0
3.0
-0.5
2.0
Output Voltage
-1.0
-1.5
1.0
0.0
-2.0
-1.0
Time: 5μs/div
Output Voltage :VOUT (V)
0.5
1.5
CE Input Voltage: VCE (V)
1.0
6.0
Output Voltage :VOUT (V)
1.5
CE Input Voltage: VCE (V)
XC8102AA01
VIN=1.2V
CE=1.2V →0.3V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
Output Voltage :VOUT (V)
XC8102AA01
XC8102
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Output Turn-off Time with CE (Continued)
1.5
10.0
1.0
0.5
8.0
0.0
6.0
-0.5
4.0
Output Voltage
-1.0
2.0
-1.5
0.0
-2.0
-2.0
Time: 5μs/div
CE Input Voltage: VCE (V)
CE Input Voltage
12.0
Output Voltage :VOUT (V)
CE Input Voltage: VCE (V)
1.5
1.0
XC8102AA01
VIN=4.0V
CE=1.2V →0.3V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
VIN=6.0V
CE=1.2V →0.3V
tr=tf=5μs , IOUT=50mA
CIN=None , CL=None
CE Input Voltage
12.0
10.0
0.5
8.0
0.0
6.0
-0.5
4.0
Output Voltage
-1.0
-1.5
2.0
0.0
-2.0
Output Voltage :VOUT (V)
XC8102AA01
-2.0
Time: 5μs/div
13/19
XC8102 Series
■PACKAGING INFORMATION
●SOT-25
●SSOT-24
Unit : mm
●USP-4
Unit : mm
●USPN-4
Unit : mm
Unit : mm
14/19
XC8102
Series
■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1.
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material:Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient Temperature
Evaluation Board (Unit: mm)
評価基板レイアウト(単位:mm)
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
25
600
85
240
Thermal Resistance (℃/W)
166.67
許容損失Pd(mW)
Power Dissipation Pd (mW)
Pd-Ta特性グラフ
Pd vs. Ta
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient
Temperature Ta (℃)
周辺温度Ta(℃)
15/19
XC8102 Series
■PACKAGING INFORMATION (Continued)
● SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
40.0
40.0
28.9
2.5
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
28.9
2.
2.54
1.4
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
25
500
85
200
Thermal Resistance (℃/W)
200.00
Pd-Ta特
フ
Pd vs.性グラ
Ta
Power Dissipation
Pd (mW)
許容損失Pd(mW
600
16/19
500
400
300
200
100
0
25
45
65
85
)
Ambient周辺温度Ta(℃
Temperature Ta (℃)
105
125
XC8102
Series
■PACKAGING INFORMATION (Continued)
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
40.0
2.5
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
28.9
1.
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
25
1000
85
400
Thermal Resistance (℃/W)
100.00
Pd vs Ta
Power Dissipation Pd (mW)
1200
1000
800
600
400
200
0
25
45
65
85
Ambient Temperature Ta(℃)
105
125
17/19
XC8102 Series
■PACKAGING INFORMATION (Continued)
● USPN-4 Power Dissipation
Power dissipation data for the USPN-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
40.0
2.5
2.
Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
28.9
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃)
Power Dissipation Pd(mW)
25
640
85
240
Thermal Resistance (℃/W)
166.67
Power
Dissipation Pd (mW)
許容損失Pd(mW)
Pd-Ta特性グラフ
Pd vs Ta
700
600
500
400
300
200
100
0
25
18/19
45
65
85
周囲温度Ta(℃)
Ambient
Temperature Ta(℃)
105
125
XC8102
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
19/19