MBRP20060CT Preferred Device POWERTAPt II SWITCHMODEt Power Rectifier These state−of−the−art devices use the Schottky Barrier principle with a platinum barrier metal. http://onsemi.com Features • Dual Diode Construction − May Be Paralleled for Higher Current • • • • Output Guardring for Stress Protection Low Forward Voltage 150°C Operating Junction Temperature Pb−Free Package is Available* SCHOTTKY BARRIER RECTIFIER 200 AMPERES, 60 VOLTS 1 3 Mechanical Characteristics: • • • • • Case: Epoxy, Molded with metal heatsink base Weight: 80 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant Top Terminal Torque: 25−40 lb−in max Base Plate Torques: See procedure given in the Package Outline Section 2 2 1 MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 60 V Average Rectified Forward Current (Rated VR, TC = 140°C) Per Leg Per Device IF(AV) Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 140°C) Per Leg IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Peak Repetitive Reverse Current (2.0 ms, 1.0 kHz) Per Leg IRRM Storage Temperature Range Tstg −55 to +150 °C Operating Junction Temperature TJ −55 to +150 °C dv/dt 10,000 V/ms Voltage Rate of Change (Rated VR) 100 200 A 200 1500 MCC AYYWWG B20060T A A 2.0 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. September, 2006 − Rev. 4 MARKING DIAGRAM A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2006 POWERTAP II CASE 357C PLASTIC 3 1 B20060T MCC A YY WW G = Specific Device Code = Mold Compound Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping MBRP20060CT POWERTAP II 25 Units/Tray MBRP20060CTG POWERTAP II (Pb−Free) 25 Units/Tray Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MBRP20060CT/D MBRP20060CT THERMAL CHARACTERISTICS (Per Leg) Rating Thermal Resistance, Junction−to−Case Symbol Value Unit RqJC 0.6 °C/W ELECTRICAL CHARACTERISTICS (Per Leg) Instantaneous Forward Voltage (Note 1) (iF = 200 Amps, TJ = 25°C) (iF = 200 Amps, TJ = 100°C) vF Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) iR V 0.91 0.80 mA 50 0.5 I F , INSTANTANEOUS FORWARD CURRENT (AMPS) I F , INSTANTANEOUS FORWARD CURRENT (AMPS) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. 1000 100 TJ = 150°C 10 25°C 100°C 1.0 0.2 0.8 0.3 0.4 0.5 0.6 0.7 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0.9 1000 100 TJ = 150°C 10 25°C 100°C 1.0 0.2 0.3 0.4 0.9 1.0 0.5 0.6 0.7 0.8 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage http://onsemi.com 2 MBRP20060CT I R , MAXIMUM REVERSE CURRENT (AMPS) I R , REVERSE CURRENT (AMPS) 1.0 TJ = 150°C 0.1 0.01 100°C 0.001 0.0001 0.00001 0.000001 25°C 0 10 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50 1.0 0.1 100°C 0.01 0.001 0.0001 0.00001 60 25°C 0 I O , AVERAGE FORWARD CURRENT (AMPS) 160 dc 140 120 SQUARE WAVE 100 Ipk/Io = p 80 Ipk/Io = 5 FREQ = 20 kHz 60 Ipk/Io = 10 40 Ipk/Io = 20 20 0 0 20 40 60 80 100 120 TC, CASE TEMPERATURE (°C) 20 30 40 VR, REVERSE VOLTAGE (VOLTS) 50 60 Figure 4. Maximum Reverse Current P FO , AVERAGE POWER DISSIPATION (WATTS) Figure 3. Typical Reverse Current 10 140 120 SQUARE WAVE 80 Ipk/Io = p Ipk/Io = 5 60 Ipk/Io = 10 Ipk/Io = 20 40 20 TJ = 150°C 0 160 dc 100 0 Figure 5. Current Derating (PER LEG) 25 50 75 100 125 150 IO, AVERAGE FORWARD CURRENT (AMPS) Figure 6. Forward Power Dissipation (PER LEG) http://onsemi.com 3 175 MBRP20060CT 10,000 C, CAPACITANCE (pF) TJ = 25°C 1,000 100 1.0 10 VR, REVERSE VOLTAGE (VOLTS) 100 R(T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) Figure 7. Capacitance 1.0 0.1 0.01 0.001 0.00001 Rtjc(t) = Rtjc*r(t) 0.0001 0.001 0.01 0.1 1.0 10 T, TIME (s) Figure 8. Thermal Response VCC 12 Vdc 2 kW 12 V 100 2 ms 1 kHz + 150 V, 10 mAdc D.U.T. 2N2222 CURRENT AMPLITUDE ADJUST 0−10 AMPS 100 W CARBON 2N6277 1 CARBON 1N5817 Figure 9. Test Circuit for Repetitive Reverse Current http://onsemi.com 4 4 mF + 100 MBRP20060CT MAXIMUM MECHANICAL RATINGS POWERTAP MECHANICAL DATA APPLIES OVER OPERATING TEMPERATURE Terminal Penetration: 0.235 max Terminal Torque: 25−40 in-lb max Mounting Torque — Outside Holes: 30−40 in-lb max Mounting Torque — Center Hole: 8−10 in-lb max Seating Plane Flatness 1 mil per in. (between mounting holes) 2″ Vertical Pull 250 lbs. max 2 in. Lever Pull 50 lbs. max Note: While the POWERTAP is capable of sustaining these vertical and levered tensions, the intimate contact Note: between POWERTAP and heat sink may be lost. This could lead to thermal runaway. The use of very Note: flexible leads is recommended for the anode connections. Use of thermal grease is highly recommended. MOUNTING PROCEDURE The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink. It is important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the POWERTAP and heat sink. STEP 1: Locate the POWERTAP on the heat sink and start mounting bolts into the threads by hand (2 or 3 turns). STEP 2: Finger tighten the center bolt. The bolt may catch on the threads of the heat sink so it is important to make sure the face of the bolt or washer is in contact with the surface of the POWERTAP. STEP 3: Tighten each of the end bolts between 5 to 10 in-lb. STEP 4: Tighten the center bolt between 8 to 10 in-lb. STEP 5: Finally, tighten the end bolts between 30 to 40 in-lb. 2 −3 TURNS 2 −3 TURNS POWER TAP HEAT SINK 2 −3 TURNS FINGER-TIGHT 2 −3 TURNS POWER TAP HEAT SINK FINGER-TIGHT 5 −10 IN-LB 5 −10 IN-LB POWER TAP HEAT SINK 8 −10 IN-LB 5 −10 IN-LB 5 −10 IN-LB POWER TAP HEAT SINK 8 −10 IN-LB 30 −40 IN-LB 30 −40 IN-LB POWER TAP HEAT SINK http://onsemi.com 5 2 −3 TURNS MBRP20060CT PACKAGE DIMENSIONS CASE 357C−03 POWERTAP PLASTIC PACKAGE ISSUE E −A− W 0.25 (0.010) R G M T A B M M N −B− Q H 2 PL 0.25 (0.010) F C U E −T− M T A M B M SEATING PLANE V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TERMINAL PENETRATION: 5.97 (0.235) MAXIMUM. DIM A B C E F G H N Q R U V W INCHES MIN MAX 3.450 3.635 0.700 0.810 0.615 0.640 0.120 0.130 0.435 0.445 1.370 1.380 0.007 0.030 1/4−20UNC−2B 0.270 0.285 31.50 BSC 0.600 0.630 0.330 0.375 0.170 0.190 MILLIMETERS MIN MAX 87.63 92.33 17.78 20.57 15.63 16.26 3.05 3.30 11.05 11.30 34.80 35.05 0.18 0.76 1/4−20UNC−2B 6.86 7.23 80.01 BSC 15.24 16.00 8.39 9.52 4.32 4.82 POWERTAP and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRP20060CT/D